JPS6252995A - Method for forming curved circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [14 technical fields] The present invention relates to a method of forming a curved circuit board.

[Prior art and its problems] Various difficulties arise when forming curved circuits by screen printing on four-sided flute bodies with curved surfaces such as curved or bent surfaces, curved printed circuit boards, etc. In order to form a curved circuit, a conductor is created on a deformable substrate such as a metal core, which is etched to form a circuit pattern and then processed into a predetermined shape. 1-Circuit patterns were formed after creating conductors by vacuum evaporation, but this more conventional method limited the materials available, required expensive mounting, increased SJ production costs, and limited the scope of use. There were drawbacks such as being limited.

[Object of the invention] This invention was made in view of the above-mentioned circumstances (7+,
The purpose is 1. Formation of a curved circuit board that can easily and reliably form any curved circuit board, and does not require expensive equipment, making it possible to easily and inexpensively form a curved circuit board. It is intended to provide a method.

[Summary of the Invention] In order to achieve the above-mentioned object, the present invention has the following features:
After sequentially coating a conductive paste and an insulating protective film to form a circuit board, these are immersed in a liquid to peel the circuit board from the board, and the separated circuit board is plastically deformed by hot pressing. The gist of this method is to form a predetermined curved surface and adhere it to an insulating curved substrate or the like.

[Example] The present invention will be explained below with reference to Examples shown in the drawings. In the drawings, reference numeral 1 denotes a substrate made of a flat glass plate, and on the upper surface of this substrate l, as shown in Fig. Then, as shown in FIG. In the cured state, a paste-like insulating protective skin 1813 based on the same type of resin is coated over the entire surface of the upper surface of the substrate 1, and then completely cured to coat the entire surface of the substrate 1 with a conductive layer 1813. A circuit board 4 is formed of the adhesive paste 2 and the protective film 3. Then, as shown in FIG. 3, the conductive paste 2. Film 3
After the substrate 1 is completely cured, when the substrate 1 and the circuit substrate 4 attached to it are immersed in the liquid 6 in the container 5 (this liquid may be water or a solvent), the 1 circuit substrate 4 is peeled off from the substrate 1. When the liberated circuit board 4 is taken out from the liquid 6 and sufficiently dried, it has a thickness of several 10 gm to several 100 gm.
A nine-plate circuit board 4 having a certain degree of flexibility is formed. The circuit board 4 thus formed is heated and pressed by a heating press 7 having a pressure surface of a predetermined curved shape as shown in FIG. 4 to plastically deform it, thereby forming the circuit board 4 having a predetermined curved surface. Then, as shown in FIG. 5, when the circuit board 4 on which a predetermined curved surface is formed is adhered to a predetermined location of a curved base 9 made of an insulating curved casing or a curved board, etc. using an adhesive 8, the curved base 9 A conductive pattern made of a predetermined circuit board 4 can be reliably formed on the upper surface of the circuit board 4 in correspondence with the curved surface thereof.

Note that when the circuit board 4 is plastically deformed by the hot press 7, it goes without saying that the deformation process is applied in accordance with the predetermined shape of the curved board 9, and it can also be applied to a curved printed circuit board etc. instead of the curved board 9. .

Further, in the above embodiment, a glass plate was used as the substrate 1, but it is not limited to this, and a material 1 that easily peels off from the conductive paste 2 and the film 3, such as a mirror-finished stainless steel plate, etc., may also be used. The paste 2 and the film 3 are preferably made of materials that have excellent adhesion to each other.

[Effects of the Invention 1] As described in detail below, the present invention consists of forming a circuit board by sequentially coating a conductive paste and an insulating protective film on a substrate, and then immersing them in a liquid. The circuit board was separated from the board by 'A', and the circuit board separated by A was plastically deformed by hot pressing to form a predetermined curved surface, which was then bonded to the curved board. Since it can be formed easily and reliably and does not require expensive equipment, a convenient and inexpensive curved circuit board can be formed.

[Brief explanation of drawings]

1 to 5 are explanatory diagrams for sequentially explaining each step of an embodiment of the present invention. l...Substrate, 2...Conductive paste,
3... Insulating protective film, 4... Circuit board, 5... Old container, 6... Liquid, 7...
...heat press, 8...adhesive, 9...
・Curved base. Patent applicant Casio Computer Co., Ltd. Fuji Electronics Co., Ltd.

Claims (1)

[Claims] After forming a predetermined circuit pattern base on a substrate with a conductive paste, an insulating protective film is coated on the upper surface of the conductive paste, and a predetermined circuit base is configured with the circuit base conductive paste and the film, After the circuit board is cured, the board and the circuit board are immersed in a liquid to separate the board and the circuit board, and the separated circuit board is plastically deformed by hot pressing to form a circuit board having a predetermined curved surface.
A method for forming a curved circuit board, characterized in that the circuit board having a predetermined curved surface is adhered to a predetermined location of an insulating curved board using an adhesive.