JPS6278748U - - Google Patents

Info

Publication number
JPS6278748U
JPS6278748U JP1985170043U JP17004385U JPS6278748U JP S6278748 U JPS6278748 U JP S6278748U JP 1985170043 U JP1985170043 U JP 1985170043U JP 17004385 U JP17004385 U JP 17004385U JP S6278748 U JPS6278748 U JP S6278748U
Authority
JP
Japan
Prior art keywords
silicon wafer
semiconductor device
electrode plate
plate fixed
protective electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985170043U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985170043U priority Critical patent/JPS6278748U/ja
Publication of JPS6278748U publication Critical patent/JPS6278748U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/30Die-attach connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117Shapes of semiconductor bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/01Manufacture or treatment
    • H10W72/013Manufacture or treatment of die-attach connectors
    • H10W72/01308Manufacture or treatment of die-attach connectors using permanent auxiliary members, e.g. using alignment marks
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/073Connecting or disconnecting of die-attach connectors
    • H10W72/07311Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/30Die-attach connectors
    • H10W72/381Auxiliary members
    • H10W72/387Flow barriers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/90Bond pads, in general
    • H10W72/931Shapes of bond pads

Landscapes

  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第1図はこの考案の半導体素子の一実施例を示
す断面図、第2図は従来のダイオード素子の一例
を示す断面図である。 図において、1はシリコンウエハ、3はろう材
、12は保護電極板、12aは溝部である。なお
、各図中の同一符号は同一または相当部分を示す

Claims (1)

    【実用新案登録請求の範囲】
  1. 少なくとも1つ以上のPN接合を有するシリコ
    ンウエハと、このシリコンウエハにろう材を用い
    て固着される保護電極板とを有する半導体素子に
    おいて、前記保護電極板のシリコンウエハと固着
    される部分の外周部またはその外側に溝部を設け
    たことを特徴とする半導体素子。
JP1985170043U 1985-11-05 1985-11-05 Pending JPS6278748U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985170043U JPS6278748U (ja) 1985-11-05 1985-11-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985170043U JPS6278748U (ja) 1985-11-05 1985-11-05

Publications (1)

Publication Number Publication Date
JPS6278748U true JPS6278748U (ja) 1987-05-20

Family

ID=31104410

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985170043U Pending JPS6278748U (ja) 1985-11-05 1985-11-05

Country Status (1)

Country Link
JP (1) JPS6278748U (ja)

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