JPS6280344U - - Google Patents
Info
- Publication number
- JPS6280344U JPS6280344U JP17152285U JP17152285U JPS6280344U JP S6280344 U JPS6280344 U JP S6280344U JP 17152285 U JP17152285 U JP 17152285U JP 17152285 U JP17152285 U JP 17152285U JP S6280344 U JPS6280344 U JP S6280344U
- Authority
- JP
- Japan
- Prior art keywords
- inner lead
- island
- outer periphery
- semiconductor
- annular tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000012212 insulator Substances 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
図面は本考案の実施例を示し、第１図はリード
フレームの要部平面図、第２図は第１図の―
線視拡大断面図、第３図は他の実施例を示す要部
拡大断面図である。
１……リードフレーム、２，２……枠体、３，
３……タイバー、４，４……支持片、５……アイ
ランド、６……インナーリード部、７……環状テ
ープ、８……半導体チツプ、９……ワイヤ。
The drawings show an embodiment of the present invention, FIG. 1 is a plan view of the main part of the lead frame, and FIG.
FIG. 3 is an enlarged cross-sectional view of main parts showing another embodiment. 1... Lead frame, 2, 2... Frame body, 3,
3... Tie bar, 4, 4... Support piece, 5... Island, 6... Inner lead portion, 7... Annular tape, 8... Semiconductor chip, 9... Wire.
Claims (1)
に、細幅帯状の多数のインナーリード部を互いに
適宜隔てて放射状に配設し、該各インナーリード
部の先端が前記アイランドの外周縁に対して適宜
隔てて臨むように形成して成る半導体用リードフ
レームにおいて、前記インナーリード部の先端の
表面には、これらを互いに結合する絶縁体製の環
状テープを前記アイランドの外周を囲繞するよう
に貼着し、半導体チツプとインナーリード部とを
ワイヤボンデイングするワイヤを前記環状テープ
表面上を跨いで配設したことを特徴とする半導体
用リードフレーム。 A large number of narrow band-shaped inner lead portions are arranged radially at appropriate distances from each other on the outer periphery of the island on which the semiconductor chip is mounted, and the tips of the inner lead portions face the outer periphery of the island at appropriate distances. In the semiconductor lead frame formed as described above, an annular tape made of an insulator is attached to the surface of the tip of the inner lead portion so as to surround the outer periphery of the island to bond the inner lead portions to each other, and the semiconductor chip is A lead frame for a semiconductor, characterized in that a wire for wire bonding the inner lead portion and the annular tape is disposed so as to straddle the surface of the annular tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17152285U JPS6280344U (en) | 1985-11-07 | 1985-11-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17152285U JPS6280344U (en) | 1985-11-07 | 1985-11-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6280344U true JPS6280344U (en) | 1987-05-22 |
Family
ID=31107223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17152285U Pending JPS6280344U (en) | 1985-11-07 | 1985-11-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6280344U (en) |
-
1985
- 1985-11-07 JP JP17152285U patent/JPS6280344U/ja active Pending