JPS6282745U - - Google Patents

Info

Publication number
JPS6282745U
JPS6282745U JP1985173351U JP17335185U JPS6282745U JP S6282745 U JPS6282745 U JP S6282745U JP 1985173351 U JP1985173351 U JP 1985173351U JP 17335185 U JP17335185 U JP 17335185U JP S6282745 U JPS6282745 U JP S6282745U
Authority
JP
Japan
Prior art keywords
package
semiconductor element
recess
die attach
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985173351U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985173351U priority Critical patent/JPS6282745U/ja
Publication of JPS6282745U publication Critical patent/JPS6282745U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/073Connecting or disconnecting of die-attach connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/075Connecting or disconnecting of bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/851Dispositions of multiple connectors or interconnections
    • H10W72/874On different surfaces
    • H10W72/884Die-attach connectors and bond wires

Landscapes

  • Die Bonding (AREA)
JP1985173351U 1985-11-11 1985-11-11 Pending JPS6282745U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985173351U JPS6282745U (fr) 1985-11-11 1985-11-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985173351U JPS6282745U (fr) 1985-11-11 1985-11-11

Publications (1)

Publication Number Publication Date
JPS6282745U true JPS6282745U (fr) 1987-05-27

Family

ID=31110731

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985173351U Pending JPS6282745U (fr) 1985-11-11 1985-11-11

Country Status (1)

Country Link
JP (1) JPS6282745U (fr)

Similar Documents

Publication Publication Date Title
JPH0369248U (fr)
JPS6282745U (fr)
JPS61144650U (fr)
JPH0268445U (fr)
JPH02132954U (fr)
JPH01174939U (fr)
JPS6278758U (fr)
JPS6298237U (fr)
JPH0167759U (fr)
JPH0356152U (fr)
JPH0263544U (fr)
JPH0233449U (fr)
JPS625644U (fr)
JPS6343443U (fr)
JPS63174459U (fr)
JPH0256449U (fr)
JPH02735U (fr)
JPS61171256U (fr)
JPH01113345U (fr)
JPS63182542U (fr)
JPS6312874U (fr)
JPS6252936U (fr)
JPS61151350U (fr)
JPH0339851U (fr)
JPS63157947U (fr)