JPS63105348U - - Google Patents

Info

Publication number
JPS63105348U
JPS63105348U JP1986198845U JP19884586U JPS63105348U JP S63105348 U JPS63105348 U JP S63105348U JP 1986198845 U JP1986198845 U JP 1986198845U JP 19884586 U JP19884586 U JP 19884586U JP S63105348 U JPS63105348 U JP S63105348U
Authority
JP
Japan
Prior art keywords
heat radiator
lead wire
bent portion
resin
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986198845U
Other languages
English (en)
Other versions
JPH0720921Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986198845U priority Critical patent/JPH0720921Y2/ja
Publication of JPS63105348U publication Critical patent/JPS63105348U/ja
Application granted granted Critical
Publication of JPH0720921Y2 publication Critical patent/JPH0720921Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図、第２図は従来装置の構造図、第３図は
本考案の実施例構造図である。図において１は放
熱体、１ａはリード線部、１ｂは端部、１′１ｃ
は立上り部、１″１ｄ，１ｄ′は折曲げ部、１ｅ
は他端の樹脂成形時の治具保持部、１ｆは位置決
部、２は半導体チツプ、３はリード線、３ａは接
続線、４は樹脂部、５は螺子用孔、６は金属放熱
体、７は螺子、８，８′は支持部、９は絶縁基板
である。

Claims (1)

    【実用新案登録請求の範囲】
  1. 板状放熱体と前記放熱体の一端に連なる立上り
    部及び折曲げ部を有するリード線部と、前記放熱
    体に固着された絶縁性回路基板及び半導体チツプ
    と前記リード線部の折曲げ部、絶縁性回路基板、
    半導体チツプ及び放熱体を封止する樹脂部よりな
    る半導体装置において、前記放熱体の他端の両端
    に夫々立上り部と折曲げ部を設けたことを特徴と
    する樹脂密封型半導体装置。
JP1986198845U 1986-12-26 1986-12-26 樹脂密封型半導体装置 Expired - Lifetime JPH0720921Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986198845U JPH0720921Y2 (ja) 1986-12-26 1986-12-26 樹脂密封型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986198845U JPH0720921Y2 (ja) 1986-12-26 1986-12-26 樹脂密封型半導体装置

Publications (2)

Publication Number Publication Date
JPS63105348U true JPS63105348U (ja) 1988-07-08
JPH0720921Y2 JPH0720921Y2 (ja) 1995-05-15

Family

ID=31159915

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986198845U Expired - Lifetime JPH0720921Y2 (ja) 1986-12-26 1986-12-26 樹脂密封型半導体装置

Country Status (1)

Country Link
JP (1) JPH0720921Y2 (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5856359A (ja) * 1981-09-30 1983-04-04 Toshiba Corp 半導体装置
JPS6115744U (ja) * 1984-06-30 1986-01-29 ロ−ム株式会社 半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5856359A (ja) * 1981-09-30 1983-04-04 Toshiba Corp 半導体装置
JPS6115744U (ja) * 1984-06-30 1986-01-29 ロ−ム株式会社 半導体装置

Also Published As

Publication number Publication date
JPH0720921Y2 (ja) 1995-05-15

Similar Documents

Publication Publication Date Title
JPS63105348U (ja)
JPS63191644U (ja)
JPH03110853U (ja)
JPS5965546U (ja) 樹脂密封型半導体装置
JPS60172346U (ja) 樹脂密封型半導体装置
JPH03122543U (ja)
JPS5821178Y2 (ja) パッケ−ジ型半導体装置
JPS63128742U (ja)
JPS6083249U (ja) 集積回路部品
JPS6258045U (ja)
JPS6163849U (ja)
JPS6351451U (ja)
JPH0288247U (ja)
JPH0179842U (ja)
JPH01176946U (ja)
JPH03122546U (ja)
JPS60153531U (ja) 樹脂密封型半導体装置
JPS6196547U (ja)
JPS62128636U (ja)
JPS62204327U (ja)
JPS63201339U (ja)
JPS59112954U (ja) 絶縁物封止半導体装置
JPS6244446U (ja)
JPS60141143U (ja) 樹脂封止型半導体装置
JPS594644U (ja) 樹脂モ−ルド半導体装置