JPS6284928U - - Google Patents
Info
- Publication number
- JPS6284928U JPS6284928U JP1985177605U JP17760585U JPS6284928U JP S6284928 U JPS6284928 U JP S6284928U JP 1985177605 U JP1985177605 U JP 1985177605U JP 17760585 U JP17760585 U JP 17760585U JP S6284928 U JPS6284928 U JP S6284928U
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- main surface
- island
- lead
- external connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Description
第１図は本考案による半導体装置を示す断面図
、第２図は従来の半導体装置を示す断面図である
。 図番の説明、１は半導体ペレツト、２はアイラ
ンド、３は外部接続リード、４は内部接続リード
、５はパツケージ材料である。
、第２図は従来の半導体装置を示す断面図である
。 図番の説明、１は半導体ペレツト、２はアイラ
ンド、３は外部接続リード、４は内部接続リード
、５はパツケージ材料である。
Claims (1)
- 一主面にメモリ素子を形成した半導体ペレツト
と、該ペレツトを載置するアイランドと、外部接
続リードと、前記ペレツト一主面に形成した電極
と前記外部接続リードとを電気的に接続する内部
接続リードと、前記ペレツトを含む主要部を封止
したモールド樹脂とを具備した半導体装置におい
て、前記ペレツトの一主面を前記アイランドに対
向接着したことを特徴とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985177605U JPS6284928U (ja) | 1985-11-19 | 1985-11-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985177605U JPS6284928U (ja) | 1985-11-19 | 1985-11-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6284928U true JPS6284928U (ja) | 1987-05-30 |
Family
ID=31118959
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985177605U Pending JPS6284928U (ja) | 1985-11-19 | 1985-11-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6284928U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09199528A (ja) * | 1996-01-22 | 1997-07-31 | Nec Corp | 樹脂封止型半導体装置 |
-
1985
- 1985-11-19 JP JP1985177605U patent/JPS6284928U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09199528A (ja) * | 1996-01-22 | 1997-07-31 | Nec Corp | 樹脂封止型半導体装置 |