JPS63107157A - 冷却回路基板 - Google Patents

冷却回路基板

Info

Publication number
JPS63107157A
JPS63107157A JP61252014A JP25201486A JPS63107157A JP S63107157 A JPS63107157 A JP S63107157A JP 61252014 A JP61252014 A JP 61252014A JP 25201486 A JP25201486 A JP 25201486A JP S63107157 A JPS63107157 A JP S63107157A
Authority
JP
Japan
Prior art keywords
circuit board
chip
refrigerant
flow path
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61252014A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0466391B2 (2
Inventor
Kishio Yokouchi
貴志男 横内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP61252014A priority Critical patent/JPS63107157A/ja
Publication of JPS63107157A publication Critical patent/JPS63107157A/ja
Publication of JPH0466391B2 publication Critical patent/JPH0466391B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP61252014A 1986-10-24 1986-10-24 冷却回路基板 Granted JPS63107157A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61252014A JPS63107157A (ja) 1986-10-24 1986-10-24 冷却回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61252014A JPS63107157A (ja) 1986-10-24 1986-10-24 冷却回路基板

Publications (2)

Publication Number Publication Date
JPS63107157A true JPS63107157A (ja) 1988-05-12
JPH0466391B2 JPH0466391B2 (2) 1992-10-23

Family

ID=17231373

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61252014A Granted JPS63107157A (ja) 1986-10-24 1986-10-24 冷却回路基板

Country Status (1)

Country Link
JP (1) JPS63107157A (2)

Also Published As

Publication number Publication date
JPH0466391B2 (2) 1992-10-23

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