JPS63127128U - - Google Patents

Info

Publication number
JPS63127128U
JPS63127128U JP1987018918U JP1891887U JPS63127128U JP S63127128 U JPS63127128 U JP S63127128U JP 1987018918 U JP1987018918 U JP 1987018918U JP 1891887 U JP1891887 U JP 1891887U JP S63127128 U JPS63127128 U JP S63127128U
Authority
JP
Japan
Prior art keywords
circuit board
chip
metal material
mounting
fixing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987018918U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987018918U priority Critical patent/JPS63127128U/ja
Publication of JPS63127128U publication Critical patent/JPS63127128U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/381—Auxiliary members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の実施例を示すＩＣ実装断面図
、第２図は本考案の実施例でＩＣチツプの各平面
形状の大きさを示す平面図、第３図、第４図、第
５図は本考案の他の実施例を示すＩＣ実装断面図
、第６図は従来の実施例を示すＩＣ実装断面図。 １……ＩＣチツプ、２……回路基板、２ａ……
回路基板のＩＣ台サライ底面、３，９……ＩＣ、
金属材料の接着材、４……封止材、５……外光、
６……プラスチツク部材の外装ケース、７……回
路基板と外装ケースの間隙、８……金属材料、８
ａ，８ｂ……プラスチツク樹脂又はフイルム樹脂
。

Claims (1)

    【実用新案登録請求の範囲】
  1. ガラスエポキシ樹脂回路基板（以下回路基板と
    言う）のＩＣ実装面との対向面上のＩＣ台サライ
    裏部と、熱可塑性プラスチツク樹脂からなる外装
    ケースとで形成される間隙に、回路基板の配線用
    パターン以外の金属材料を形成しないＩＣ実装構
    造において、回路基板のＩＣ台サライ形状内にＩ
    Ｃチツプサイズ以上の大きさからなる金属材料を
    前記ＩＣ台サライ底面に止着し、前記金属材料の
    上にＩＣチツプを止着してＩＣチツプを実装した
    ことを特徴とする小型電子装置のＩＣ実装構造。
JP1987018918U 1987-02-12 1987-02-12 Pending JPS63127128U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987018918U JPS63127128U (ja) 1987-02-12 1987-02-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987018918U JPS63127128U (ja) 1987-02-12 1987-02-12

Publications (1)

Publication Number Publication Date
JPS63127128U true JPS63127128U (ja) 1988-08-19

Family

ID=30813038

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987018918U Pending JPS63127128U (ja) 1987-02-12 1987-02-12

Country Status (1)

Country Link
JP (1) JPS63127128U (ja)

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