JPS63146455A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS63146455A
JPS63146455A JP62292005A JP29200587A JPS63146455A JP S63146455 A JPS63146455 A JP S63146455A JP 62292005 A JP62292005 A JP 62292005A JP 29200587 A JP29200587 A JP 29200587A JP S63146455 A JPS63146455 A JP S63146455A
Authority
JP
Japan
Prior art keywords
wiring board
semiconductor device
lid portion
package
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62292005A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0234180B2 (2
Inventor
Kanji Otsuka
寛治 大塚
Masao Sekihashi
関端　正雄
Tamotsu Usami
保 宇佐美
Michiaki Furukawa
古川　道明
Fumiyuki Kobayashi
小林　二三幸
Masakatsu Ishida
石田　正勝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62292005A priority Critical patent/JPS63146455A/ja
Publication of JPS63146455A publication Critical patent/JPS63146455A/ja
Publication of JPH0234180B2 publication Critical patent/JPH0234180B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP62292005A 1987-11-20 1987-11-20 半導体装置 Granted JPS63146455A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62292005A JPS63146455A (ja) 1987-11-20 1987-11-20 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62292005A JPS63146455A (ja) 1987-11-20 1987-11-20 半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP13163478A Division JPS5559746A (en) 1978-10-27 1978-10-27 Semiconductor device and its mounting circuit device

Publications (2)

Publication Number Publication Date
JPS63146455A true JPS63146455A (ja) 1988-06-18
JPH0234180B2 JPH0234180B2 (2) 1990-08-01

Family

ID=17776296

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62292005A Granted JPS63146455A (ja) 1987-11-20 1987-11-20 半導体装置

Country Status (1)

Country Link
JP (1) JPS63146455A (2)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52113166A (en) * 1977-03-25 1977-09-22 Hitachi Ltd Radiating fin for power transistor
JPS53119675A (en) * 1977-03-28 1978-10-19 Fujitsu Ltd Mounting structure of lsi
JPS6220701A (ja) * 1985-07-19 1987-01-29 Araya Kogyo Kk スポークハグ組立体の移送装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52113166A (en) * 1977-03-25 1977-09-22 Hitachi Ltd Radiating fin for power transistor
JPS53119675A (en) * 1977-03-28 1978-10-19 Fujitsu Ltd Mounting structure of lsi
JPS6220701A (ja) * 1985-07-19 1987-01-29 Araya Kogyo Kk スポークハグ組立体の移送装置

Also Published As

Publication number Publication date
JPH0234180B2 (2) 1990-08-01

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