JPS6316455U - - Google Patents
Info
- Publication number
- JPS6316455U JPS6316455U JP1986110466U JP11046686U JPS6316455U JP S6316455 U JPS6316455 U JP S6316455U JP 1986110466 U JP1986110466 U JP 1986110466U JP 11046686 U JP11046686 U JP 11046686U JP S6316455 U JPS6316455 U JP S6316455U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- cutout
- insulating film
- lead frame
- island
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例の断面図、第２図は
従来の混成集積回路装置の断面図である。 １……リードフレームのアイランド、２……絶
縁膜、３……リード端子、４，５……配線基板、
６……ＩＣペレツト、７……金属細線、８……外
装樹脂。
従来の混成集積回路装置の断面図である。 １……リードフレームのアイランド、２……絶
縁膜、３……リード端子、４，５……配線基板、
６……ＩＣペレツト、７……金属細線、８……外
装樹脂。
Claims (1)
- 絶縁膜で被われたリードフレームのアイランド
上面に切抜き加工された配線基板が接合され、こ
の配線基板の切抜き部に能動および受動回路素子
が搭載されていることを特徴とする混成集積回路
装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986110466U JPS6316455U (ja) | 1986-07-17 | 1986-07-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986110466U JPS6316455U (ja) | 1986-07-17 | 1986-07-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6316455U true JPS6316455U (ja) | 1988-02-03 |
Family
ID=30989491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986110466U Pending JPS6316455U (ja) | 1986-07-17 | 1986-07-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6316455U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02196450A (ja) * | 1989-01-25 | 1990-08-03 | Nec Corp | 樹脂封止型半導体装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61136249A (ja) * | 1984-12-06 | 1986-06-24 | Nec Kansai Ltd | ハイブリツドｉｃ |
-
1986
- 1986-07-17 JP JP1986110466U patent/JPS6316455U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61136249A (ja) * | 1984-12-06 | 1986-06-24 | Nec Kansai Ltd | ハイブリツドｉｃ |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02196450A (ja) * | 1989-01-25 | 1990-08-03 | Nec Corp | 樹脂封止型半導体装置 |