JPS63168037A - 半導体材料の接続方法 - Google Patents

半導体材料の接続方法

Info

Publication number
JPS63168037A
JPS63168037A JP61314162A JP31416286A JPS63168037A JP S63168037 A JPS63168037 A JP S63168037A JP 61314162 A JP61314162 A JP 61314162A JP 31416286 A JP31416286 A JP 31416286A JP S63168037 A JPS63168037 A JP S63168037A
Authority
JP
Japan
Prior art keywords
wire
ball
amorphous alloy
semiconductor material
lead wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61314162A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0565051B2 (de
Inventor
Toshinori Kogashiwa
俊典 小柏
Yasuhiko Yoshinaga
吉永　保彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Electronics Co Ltd
Original Assignee
Tanaka Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Priority to JP61314162A priority Critical patent/JPS63168037A/ja
Publication of JPS63168037A publication Critical patent/JPS63168037A/ja
Publication of JPH0565051B2 publication Critical patent/JPH0565051B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
JP61314162A 1986-12-29 1986-12-29 半導体材料の接続方法 Granted JPS63168037A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61314162A JPS63168037A (ja) 1986-12-29 1986-12-29 半導体材料の接続方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61314162A JPS63168037A (ja) 1986-12-29 1986-12-29 半導体材料の接続方法

Publications (2)

Publication Number Publication Date
JPS63168037A true JPS63168037A (ja) 1988-07-12
JPH0565051B2 JPH0565051B2 (de) 1993-09-16

Family

ID=18049987

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61314162A Granted JPS63168037A (ja) 1986-12-29 1986-12-29 半導体材料の接続方法

Country Status (1)

Country Link
JP (1) JPS63168037A (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005005598A (ja) * 2003-06-13 2005-01-06 Fujitsu Ltd 半導体装置
JP2007083134A (ja) * 2005-09-21 2007-04-05 Kinki:Kk 剪断式破砕機

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61253384A (ja) * 1985-01-07 1986-11-11 Masami Kobayashi アモルフアス合金のメツキ方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61253384A (ja) * 1985-01-07 1986-11-11 Masami Kobayashi アモルフアス合金のメツキ方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005005598A (ja) * 2003-06-13 2005-01-06 Fujitsu Ltd 半導体装置
JP2007083134A (ja) * 2005-09-21 2007-04-05 Kinki:Kk 剪断式破砕機

Also Published As

Publication number Publication date
JPH0565051B2 (de) 1993-09-16

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