JPS63178345U - - Google Patents

Info

Publication number
JPS63178345U
JPS63178345U JP1987070404U JP7040487U JPS63178345U JP S63178345 U JPS63178345 U JP S63178345U JP 1987070404 U JP1987070404 U JP 1987070404U JP 7040487 U JP7040487 U JP 7040487U JP S63178345 U JPS63178345 U JP S63178345U
Authority
JP
Japan
Prior art keywords
semiconductor element
element support
support lead
lead
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987070404U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987070404U priority Critical patent/JPS63178345U/ja
Publication of JPS63178345U publication Critical patent/JPS63178345U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Description

【図面の簡単な説明】
第1図乃至第4図は本考案半導体装置の一つの
実施例を説明するためのもので、第1図は断面図
、第2図は第1図の2−2線に沿う断面図、第3
図は分解斜視図、第4図は半導体装置の製造に使
用するリードフレームの斜視図、第5図は本考案
半導体装置の変形例を示す断面図、第6図は従来
例を示す分解斜視図である。 符号の説明、1……ヘツダー、2……リード、
2a……半導体素子支持リード、4……半導体素
子。

Claims (1)

  1. 【実用新案登録請求の範囲】 絶縁材料からなるヘツダーに半導体素子支持リ
    ードを含む複数本のリードが貫通状に保持され、 上記半導体素子支持リードの上端側の部分が該
    リードの裏面側に折り曲げられ、更にその折り曲
    げられた部分が折り返され、その折り返された部
    分の先端部が該半導体素子支持リードの裏面に固
    定され、 上記半導体素子支持リードの上端部に半導体素
    子が固定されてなる ことを特徴とする半導体装置。
JP1987070404U 1987-05-12 1987-05-12 Pending JPS63178345U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987070404U JPS63178345U (ja) 1987-05-12 1987-05-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987070404U JPS63178345U (ja) 1987-05-12 1987-05-12

Publications (1)

Publication Number Publication Date
JPS63178345U true JPS63178345U (ja) 1988-11-18

Family

ID=30912008

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987070404U Pending JPS63178345U (ja) 1987-05-12 1987-05-12

Country Status (1)

Country Link
JP (1) JPS63178345U (ja)

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