JPS63208253A - 半導体回路装置 - Google Patents

半導体回路装置

Info

Publication number
JPS63208253A
JPS63208253A JP4014787A JP4014787A JPS63208253A JP S63208253 A JPS63208253 A JP S63208253A JP 4014787 A JP4014787 A JP 4014787A JP 4014787 A JP4014787 A JP 4014787A JP S63208253 A JPS63208253 A JP S63208253A
Authority
JP
Japan
Prior art keywords
case
resin
envelope
mounting
circuit device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4014787A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0511665B2 (cs
Inventor
Ko Saito
洸 斉藤
Takehiko Kobayashi
武彦 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP4014787A priority Critical patent/JPS63208253A/ja
Publication of JPS63208253A publication Critical patent/JPS63208253A/ja
Publication of JPH0511665B2 publication Critical patent/JPH0511665B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP4014787A 1987-02-25 1987-02-25 半導体回路装置 Granted JPS63208253A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4014787A JPS63208253A (ja) 1987-02-25 1987-02-25 半導体回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4014787A JPS63208253A (ja) 1987-02-25 1987-02-25 半導体回路装置

Publications (2)

Publication Number Publication Date
JPS63208253A true JPS63208253A (ja) 1988-08-29
JPH0511665B2 JPH0511665B2 (cs) 1993-02-16

Family

ID=12572657

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4014787A Granted JPS63208253A (ja) 1987-02-25 1987-02-25 半導体回路装置

Country Status (1)

Country Link
JP (1) JPS63208253A (cs)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009069308A1 (ja) * 2007-11-30 2009-06-04 Panasonic Corporation 放熱構造体基板とこれを用いたモジュール及び放熱構造体基板の製造方法
JP2017212344A (ja) * 2016-05-25 2017-11-30 株式会社三社電機製作所 半導体装置
JP2023181607A (ja) * 2022-06-13 2023-12-25 富士電機株式会社 半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60244051A (ja) * 1984-05-17 1985-12-03 Mitsubishi Electric Corp 半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60244051A (ja) * 1984-05-17 1985-12-03 Mitsubishi Electric Corp 半導体装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009069308A1 (ja) * 2007-11-30 2009-06-04 Panasonic Corporation 放熱構造体基板とこれを用いたモジュール及び放熱構造体基板の製造方法
EP2120263A4 (en) * 2007-11-30 2010-10-13 Panasonic Corp BASE PLATE FOR A HITZEABLEITENDE STRUCTURE, MODULE WITH THE BASE PLATE FOR THE HITZEABLEITENDE STRUCTURE AND METHOD FOR THE PRODUCTION OF THE BASE PLATE FOR THE HITZEABLEITENDE STRUCTURE
US8130499B2 (en) 2007-11-30 2012-03-06 Panasonic Corporation Heat dissipating structure base board, module using heat dissipating structure base board, and method for manufacturing heat dissipating structure base board
JP2017212344A (ja) * 2016-05-25 2017-11-30 株式会社三社電機製作所 半導体装置
JP2023181607A (ja) * 2022-06-13 2023-12-25 富士電機株式会社 半導体装置

Also Published As

Publication number Publication date
JPH0511665B2 (cs) 1993-02-16

Similar Documents

Publication Publication Date Title
JP2509607B2 (ja) 樹脂封止型半導体装置
KR100229858B1 (ko) 반도체 장치
KR960019689A (ko) 다운세트된 노출 다이 장착 패드 리드프레임 및 패키지
JPH06209054A (ja) 半導体装置
US5814882A (en) Seal structure for tape carrier package
KR910009419B1 (ko) 수지절연형 반도체장치
EP1396886A2 (en) Semiconductor device having the inner end of connector leads placed onto the surface of semiconductor chip
JP3479121B2 (ja) Ｂｇａパッケージの樹脂モールド方法
JPH04306865A (ja) 半導体装置及びその製造方法
JPH0511665B2 (cs)
JPH0828443B2 (ja) 半導体装置
JPH09234757A (ja) モールド成型品および混成集積回路装置
JP2577639Y2 (ja) 回路基板を有する半導体装置
JP2795063B2 (ja) 混成集積回路装置
JPH0653681A (ja) 電子部品実装済み基板の樹脂被覆方法及び被覆生成物
JPH03161958A (ja) プラスチックピングリッドアレイ型半導体パッケージ構造
JP2882101B2 (ja) 半導体装置
JP2563171Y2 (ja) 樹脂封止型半導体装置
KR100244721B1 (ko) 반도체패키지
KR20000073112A (ko) 내장형 히트 슬러그
JPS6139554A (ja) 樹脂封止型半導体装置
JPH0623254U (ja) 基板の固定構造
JPS6127909B2 (cs)
JPS6288347A (ja) 樹脂封止型半導体装置
JPH065687B2 (ja) 樹脂封止型半導体装置の製造方法

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees