JPS63256873A - 配線パネルの電気的機能試験装置 - Google Patents

配線パネルの電気的機能試験装置

Info

Publication number
JPS63256873A
JPS63256873A JP63077940A JP7794088A JPS63256873A JP S63256873 A JPS63256873 A JP S63256873A JP 63077940 A JP63077940 A JP 63077940A JP 7794088 A JP7794088 A JP 7794088A JP S63256873 A JPS63256873 A JP S63256873A
Authority
JP
Japan
Prior art keywords
wiring
wiring panel
gas discharge
contact
intermediate mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63077940A
Other languages
English (en)
Japanese (ja)
Inventor
ギユンター、デーメンス
トーマス、ローゼ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of JPS63256873A publication Critical patent/JPS63256873A/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Structure Of Printed Boards (AREA)
  • Measuring Leads Or Probes (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Tests Of Electronic Circuits (AREA)
JP63077940A 1987-03-31 1988-03-29 配線パネルの電気的機能試験装置 Pending JPS63256873A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3710594 1987-03-31
DE3710594.9 1987-03-31

Publications (1)

Publication Number Publication Date
JPS63256873A true JPS63256873A (ja) 1988-10-24

Family

ID=6324409

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63077940A Pending JPS63256873A (ja) 1987-03-31 1988-03-29 配線パネルの電気的機能試験装置

Country Status (5)

Country Link
US (2) US4897598A (fr)
EP (1) EP0285799B1 (fr)
JP (1) JPS63256873A (fr)
AT (1) ATE92191T1 (fr)
DE (1) DE3882563D1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017003295A (ja) * 2015-06-05 2017-01-05 三菱電機株式会社 測定装置、半導体装置の測定方法

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DE3903060A1 (de) * 1989-02-02 1990-08-09 Minnesota Mining & Mfg Vorrichtung zum pruefen von integrierten schaltungsanordnungen
US5574382A (en) * 1991-09-17 1996-11-12 Japan Synthetic Rubber Co., Ltd. Inspection electrode unit for printed wiring board
US5311120A (en) * 1993-01-06 1994-05-10 Bartholomew Mark R Test fixture with test function feature
US20020053734A1 (en) * 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US20030199179A1 (en) * 1993-11-16 2003-10-23 Formfactor, Inc. Contact tip structure for microelectronic interconnection elements and method of making same
US7073254B2 (en) * 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US5544174A (en) * 1994-03-17 1996-08-06 The United States Of America As Represented By The Secretary Of The Air Force Programmable boundary scan and input output parameter device for testing integrated circuits
GB2291544B (en) * 1994-07-12 1996-10-02 Everett Charles Tech Electrical connectors
US8033838B2 (en) * 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US5736279A (en) * 1996-11-06 1998-04-07 International Business Machines Corporation Accurate drilling of probe holes in the insulating plate of an electrical test head
US5921786A (en) * 1997-04-03 1999-07-13 Kinetrix, Inc. Flexible shielded laminated beam for electrical contacts and the like and method of contact operation
US5952843A (en) * 1998-03-24 1999-09-14 Vinh; Nguyen T. Variable contact pressure probe
US6788085B2 (en) 2001-07-11 2004-09-07 International Business Machines Corporation Self-aligning wafer burn-in probe
US7059046B2 (en) * 2002-06-24 2006-06-13 Delaware Capital Formation, Inc. Method for producing a captive wired test fixture and fixture therefor
KR100573089B1 (ko) * 2003-03-17 2006-04-24 주식회사 파이컴 프로브 및 그 제조방법
US9097740B2 (en) 2004-05-21 2015-08-04 Formfactor, Inc. Layered probes with core
US7659739B2 (en) 2006-09-14 2010-02-09 Micro Porbe, Inc. Knee probe having reduced thickness section for control of scrub motion
US7759949B2 (en) 2004-05-21 2010-07-20 Microprobe, Inc. Probes with self-cleaning blunt skates for contacting conductive pads
US7148709B2 (en) * 2004-05-21 2006-12-12 Microprobe, Inc. Freely deflecting knee probe with controlled scrub motion
US9476911B2 (en) 2004-05-21 2016-10-25 Microprobe, Inc. Probes with high current carrying capability and laser machining methods
US8988091B2 (en) 2004-05-21 2015-03-24 Microprobe, Inc. Multiple contact probes
USRE43503E1 (en) 2006-06-29 2012-07-10 Microprobe, Inc. Probe skates for electrical testing of convex pad topologies
US7733101B2 (en) 2004-05-21 2010-06-08 Microprobe, Inc. Knee probe having increased scrub motion
US7649367B2 (en) 2005-12-07 2010-01-19 Microprobe, Inc. Low profile probe having improved mechanical scrub and reduced contact inductance
US7312617B2 (en) 2006-03-20 2007-12-25 Microprobe, Inc. Space transformers employing wire bonds for interconnections with fine pitch contacts
US7425839B2 (en) * 2006-08-25 2008-09-16 Micron Technology, Inc. Systems and methods for testing packaged microelectronic devices
US7786740B2 (en) * 2006-10-11 2010-08-31 Astria Semiconductor Holdings, Inc. Probe cards employing probes having retaining portions for potting in a potting region
US8907689B2 (en) 2006-10-11 2014-12-09 Microprobe, Inc. Probe retention arrangement
US7514948B2 (en) 2007-04-10 2009-04-07 Microprobe, Inc. Vertical probe array arranged to provide space transformation
US8723546B2 (en) 2007-10-19 2014-05-13 Microprobe, Inc. Vertical guided layered probe
US7671610B2 (en) 2007-10-19 2010-03-02 Microprobe, Inc. Vertical guided probe array providing sideways scrub motion
US7857646B2 (en) * 2008-05-02 2010-12-28 Micron Technology, Inc. Electrical testing apparatus having masked sockets and associated systems and methods
US8230593B2 (en) 2008-05-29 2012-07-31 Microprobe, Inc. Probe bonding method having improved control of bonding material
EP3185660A1 (fr) * 2015-12-22 2017-06-28 Siemens Aktiengesellschaft Agencement de rails conducteurs
US10539592B2 (en) * 2016-10-18 2020-01-21 Texas Instruments Incorporated Systems and methods for depopulating pins from contactor test sockets for packaged semiconductor devices
JP7236848B2 (ja) * 2018-11-27 2023-03-10 日本メクトロン株式会社 プローブ装置、電気検査装置、および電気検査方法
DE102019102457B3 (de) * 2019-01-31 2020-07-09 Infineon Technologies Ag Prüfvorrichtung mit sammelschienenmechanismus zum testen einer zu testenden vorrichtung
CN212435595U (zh) * 2020-06-02 2021-01-29 精进电动科技股份有限公司 一种逆变器接线盒

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Publication number Priority date Publication date Assignee Title
US3806800A (en) * 1972-12-26 1974-04-23 Ibm Method and apparatus for determining the location of electrically conductive members on a structure
US3963986A (en) * 1975-02-10 1976-06-15 International Business Machines Corporation Programmable interface contactor structure
US4056773A (en) * 1976-08-25 1977-11-01 Sullivan Donald F Printed circuit board open circuit tester
US4179170A (en) * 1978-03-13 1979-12-18 Cook Electric Company Connector assembly for telephone distribution equipment
JPS55133550A (en) * 1979-04-03 1980-10-17 Yoshie Hasegawa Probe needle
US4352061A (en) * 1979-05-24 1982-09-28 Fairchild Camera & Instrument Corp. Universal test fixture employing interchangeable wired personalizers
US4353061A (en) * 1979-12-07 1982-10-05 International Business Machines Apparatus and method for providing electron beam patterns using expanded beam array
DE3038665C2 (de) * 1980-10-13 1990-03-29 Riba-Prüftechnik GmbH, 7801 Schallstadt Prüfeinrichtung zum Überprüfen von mit Leiterbahnen versehenen Leiterplatten
DE3231598A1 (de) * 1982-08-25 1984-03-01 Siemens AG, 1000 Berlin und 8000 München Verfahren und vorrichtung zur elektrischen pruefung von mikroverdrahtungen
DE3337915A1 (de) * 1982-10-21 1984-05-24 Feinmetall Gmbh, 7033 Herrenberg Kontaktiervorrichtung
DE3249770C2 (en) * 1982-11-05 1987-11-12 Martin Maelzer Device for testing electrical circuit boards
EP0115135A1 (fr) * 1982-12-27 1984-08-08 Genrad, Inc. Fixation électrique pour tester des circuits imprimés et similaires
IT1195391B (it) * 1983-03-04 1988-10-19 Circuit Line Srl Macchina analizzatrice automatica di circuiti stampati
JPS6013413A (ja) * 1983-07-05 1985-01-23 住友電気工業株式会社 ワイヤリングハ−ネスの相互接続装置
DE3414968C2 (de) * 1984-04-19 1986-07-10 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Ermittlung der unbekannten Zuordnung von Feldkoordinaten der Kontaktnadeln eines Kontaktnadelfeldes eines Prüflingsadapters zu den Adressen der Kontaktnadeln in einem Verdrahtungs-Prüfautomaten
US4724383A (en) * 1985-05-03 1988-02-09 Testsystems, Inc. PC board test fixture
DE3671106D1 (de) * 1985-09-04 1990-06-13 Siemens Ag Vorrichtung fuer die elektrische funktionspruefung von verdrahtungsfeldern, insbesondere von leiterplatten.
DE3671110D1 (de) * 1985-09-04 1990-06-13 Siemens Ag Vorrichtung fuer die elektrische funktionspruefung von verdrahtungsfeldern, insbesondere von leiterplatten.
DE3723570A1 (de) * 1986-08-29 1989-01-26 Siemens Ag Kontaktiervorrichtung in form einer sogenannten nadelkarte fuer zu pruefende hochpolige bauelemente der mikroelektronik

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017003295A (ja) * 2015-06-05 2017-01-05 三菱電機株式会社 測定装置、半導体装置の測定方法

Also Published As

Publication number Publication date
DE3882563D1 (de) 1993-09-02
EP0285799B1 (fr) 1993-07-28
EP0285799A2 (fr) 1988-10-12
EP0285799A3 (en) 1990-03-28
US4897598A (en) 1990-01-30
US4967148A (en) 1990-10-30
ATE92191T1 (de) 1993-08-15

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