JPS6336706Y2 - - Google Patents
Info
- Publication number
- JPS6336706Y2 JPS6336706Y2 JP1981093057U JP9305781U JPS6336706Y2 JP S6336706 Y2 JPS6336706 Y2 JP S6336706Y2 JP 1981093057 U JP1981093057 U JP 1981093057U JP 9305781 U JP9305781 U JP 9305781U JP S6336706 Y2 JPS6336706 Y2 JP S6336706Y2
- Authority
- JP
- Japan
- Prior art keywords
- base
- board
- mounting
- slot
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981093057U JPS58467U (ja) | 1981-06-25 | 1981-06-25 | 半導体素子装着用基台 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981093057U JPS58467U (ja) | 1981-06-25 | 1981-06-25 | 半導体素子装着用基台 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58467U JPS58467U (ja) | 1983-01-05 |
| JPS6336706Y2 true JPS6336706Y2 (th) | 1988-09-28 |
Family
ID=29888043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981093057U Granted JPS58467U (ja) | 1981-06-25 | 1981-06-25 | 半導体素子装着用基台 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58467U (th) |
-
1981
- 1981-06-25 JP JP1981093057U patent/JPS58467U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58467U (ja) | 1983-01-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4406508A (en) | Dual-in-line package assembly | |
| US4254301A (en) | Printed circuit board component mounting support and spacer | |
| EP0303873B1 (en) | Conductive lead arrangement | |
| JPH02247987A (ja) | 電気素子のための接続手段 | |
| JPH0138374B2 (th) | ||
| US20030060061A1 (en) | Contact array for semiconductor package | |
| US4884053A (en) | Surface mount wirewound resistor and method of making the same | |
| US4401352A (en) | Connector system for connecting a ceramic substrate to a printed circuit board | |
| JPH0261107B2 (th) | ||
| JPS5812401Y2 (ja) | 並設抵抗器 | |
| JPH0641349Y2 (ja) | 端子盤 | |
| JPH0319241Y2 (th) | ||
| JPH0454467Y2 (th) | ||
| US6045369A (en) | Device for mounting semiconductor package and method of fabricating same | |
| JPS584212Y2 (ja) | 電気部品の保持具 | |
| JPH0120701Y2 (th) | ||
| JPS6242550Y2 (th) | ||
| JPS59161057A (ja) | 半導体集積回路 | |
| JPH0810240Y2 (ja) | 電子部品装着用治具 | |
| JPH01293594A (ja) | スライドガイド板付きリード部品 | |
| JPH0433661Y2 (th) | ||
| JPS584217Y2 (ja) | プリント基板取付接続装置 | |
| JPH07270760A (ja) | 表示パネルの固定構造 | |
| JPH023272B2 (th) | ||
| JPS6317190Y2 (th) |