JPS6339956U - - Google Patents

Info

Publication number
JPS6339956U
JPS6339956U JP1986134408U JP13440886U JPS6339956U JP S6339956 U JPS6339956 U JP S6339956U JP 1986134408 U JP1986134408 U JP 1986134408U JP 13440886 U JP13440886 U JP 13440886U JP S6339956 U JPS6339956 U JP S6339956U
Authority
JP
Japan
Prior art keywords
solid
state image
image sensor
flat plate
color filter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986134408U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986134408U priority Critical patent/JPS6339956U/ja
Publication of JPS6339956U publication Critical patent/JPS6339956U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
JP1986134408U 1986-09-01 1986-09-01 Pending JPS6339956U (id)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986134408U JPS6339956U (id) 1986-09-01 1986-09-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986134408U JPS6339956U (id) 1986-09-01 1986-09-01

Publications (1)

Publication Number Publication Date
JPS6339956U true JPS6339956U (id) 1988-03-15

Family

ID=31035625

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986134408U Pending JPS6339956U (id) 1986-09-01 1986-09-01

Country Status (1)

Country Link
JP (1) JPS6339956U (id)

Similar Documents

Publication Publication Date Title
JP2008283002A (ja) 撮像素子モジュールおよびその製造方法
JPH0653462A (ja) 樹脂封合形固体撮像素子パッケージおよびその製造方法
JPS61134187A (ja) 固体撮像デバイス
JP3166216B2 (ja) オンチップレンズ付固体撮像装置およびその製造方法
JPH0226080A (ja) 半導体素子
JPH08116042A (ja) 固体撮像装置及びその製造方法
JPH067587B2 (ja) 固体撮像装置
JP2878875B2 (ja) Ｃｃｄモジュール
JPH05191733A (ja) 固体撮像装置
JPS61199059U (id)
JPS62154667A (ja) 固体撮像装置
JPH11354764A (ja) 固体撮像装置及びその製造方法
JP2588043B2 (ja) 固体撮像装置
JPH065717B2 (ja) 固 体 撮 像 装 置
JPH0349403Y2 (id)
JPH0410445A (ja) 固体撮像素子の製造方法
JPS61222384A (ja) 半導体装置およびその製造方法
JPS6398660U (id)
JPH045660U (id)
JPH01169050U (id)
JPS6161430U (id)
JPH0330446U (id)
JPS61106050U (id)
JPH0369255U (id)
JPS60250653A (ja) 半導体装置