JPS6346980B2 - - Google Patents

Info

Publication number
JPS6346980B2
JPS6346980B2 JP55050857A JP5085780A JPS6346980B2 JP S6346980 B2 JPS6346980 B2 JP S6346980B2 JP 55050857 A JP55050857 A JP 55050857A JP 5085780 A JP5085780 A JP 5085780A JP S6346980 B2 JPS6346980 B2 JP S6346980B2
Authority
JP
Japan
Prior art keywords
region
integrated circuit
circuit device
semiconductor
semiconductor integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55050857A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56147446A (en
Inventor
Mototaka Kamoshita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP5085780A priority Critical patent/JPS56147446A/ja
Publication of JPS56147446A publication Critical patent/JPS56147446A/ja
Publication of JPS6346980B2 publication Critical patent/JPS6346980B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/01—Manufacture or treatment
    • H10W10/011—Manufacture or treatment of isolation regions comprising dielectric materials
    • H10W10/012—Manufacture or treatment of isolation regions comprising dielectric materials using local oxidation of silicon [LOCOS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/10—Isolation regions comprising dielectric materials
    • H10W10/13—Isolation regions comprising dielectric materials formed using local oxidation of silicon [LOCOS], e.g. sealed interface localised oxidation [SILO] or side-wall mask isolation [SWAMI]

Landscapes

  • Bipolar Transistors (AREA)
  • Element Separation (AREA)
  • Semiconductor Memories (AREA)
JP5085780A 1980-04-17 1980-04-17 Semiconductor integrated circuit device Granted JPS56147446A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5085780A JPS56147446A (en) 1980-04-17 1980-04-17 Semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5085780A JPS56147446A (en) 1980-04-17 1980-04-17 Semiconductor integrated circuit device

Publications (2)

Publication Number Publication Date
JPS56147446A JPS56147446A (en) 1981-11-16
JPS6346980B2 true JPS6346980B2 (de) 1988-09-20

Family

ID=12870386

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5085780A Granted JPS56147446A (en) 1980-04-17 1980-04-17 Semiconductor integrated circuit device

Country Status (1)

Country Link
JP (1) JPS56147446A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011108490A1 (ja) 2010-03-03 2011-09-09 日東電工株式会社 導電性粘着テープ

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58212162A (ja) * 1982-06-03 1983-12-09 Matsushita Electronics Corp 半導体装置およびその製造方法
JPS5954271A (ja) * 1982-09-21 1984-03-29 Agency Of Ind Science & Technol 半導体集積回路装置
JP2008096860A (ja) * 2006-10-16 2008-04-24 Kyocera Mita Corp 画像形成装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53129591A (en) * 1977-04-18 1978-11-11 Fujitsu Ltd Production of semiconductor device
JPS5431272A (en) * 1977-08-12 1979-03-08 Nec Corp Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011108490A1 (ja) 2010-03-03 2011-09-09 日東電工株式会社 導電性粘着テープ

Also Published As

Publication number Publication date
JPS56147446A (en) 1981-11-16

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