JPS6356948A - リ−ドフレ−ム - Google Patents

リ−ドフレ−ム

Info

Publication number
JPS6356948A
JPS6356948A JP61202442A JP20244286A JPS6356948A JP S6356948 A JPS6356948 A JP S6356948A JP 61202442 A JP61202442 A JP 61202442A JP 20244286 A JP20244286 A JP 20244286A JP S6356948 A JPS6356948 A JP S6356948A
Authority
JP
Japan
Prior art keywords
pad
tape
leads
piece
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61202442A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0579174B2 (mo
Inventor
Katsufusa Fujita
勝房 藤田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui High Tec Inc
Original Assignee
Mitsui High Tec Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui High Tec Inc filed Critical Mitsui High Tec Inc
Priority to JP61202442A priority Critical patent/JPS6356948A/ja
Publication of JPS6356948A publication Critical patent/JPS6356948A/ja
Publication of JPH0579174B2 publication Critical patent/JPH0579174B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP61202442A 1986-08-27 1986-08-27 リ−ドフレ−ム Granted JPS6356948A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61202442A JPS6356948A (ja) 1986-08-27 1986-08-27 リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61202442A JPS6356948A (ja) 1986-08-27 1986-08-27 リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS6356948A true JPS6356948A (ja) 1988-03-11
JPH0579174B2 JPH0579174B2 (mo) 1993-11-01

Family

ID=16457591

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61202442A Granted JPS6356948A (ja) 1986-08-27 1986-08-27 リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS6356948A (mo)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5021864A (en) * 1989-09-05 1991-06-04 Micron Technology, Inc. Die-mounting paddle for mechanical stress reduction in plastic IC packages
EP0747942A3 (en) * 1995-05-02 1998-07-29 Texas Instruments Incorporated Improvements in or relating to integrated circuits

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6236547U (mo) * 1985-08-20 1987-03-04

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6236547U (mo) * 1985-08-20 1987-03-04

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5021864A (en) * 1989-09-05 1991-06-04 Micron Technology, Inc. Die-mounting paddle for mechanical stress reduction in plastic IC packages
EP0747942A3 (en) * 1995-05-02 1998-07-29 Texas Instruments Incorporated Improvements in or relating to integrated circuits
US5891377A (en) * 1995-05-02 1999-04-06 Texas Instruments Incorporated Dambarless leadframe for molded component encapsulation
US5949132A (en) * 1995-05-02 1999-09-07 Texas Instruments Incorporated Dambarless leadframe for molded component encapsulation

Also Published As

Publication number Publication date
JPH0579174B2 (mo) 1993-11-01

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