JPS6364033U - - Google Patents

Info

Publication number
JPS6364033U
JPS6364033U JP1986158384U JP15838486U JPS6364033U JP S6364033 U JPS6364033 U JP S6364033U JP 1986158384 U JP1986158384 U JP 1986158384U JP 15838486 U JP15838486 U JP 15838486U JP S6364033 U JPS6364033 U JP S6364033U
Authority
JP
Japan
Prior art keywords
thickness
semiconductor device
metal conductor
conductor base
matching substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986158384U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986158384U priority Critical patent/JPS6364033U/ja
Publication of JPS6364033U publication Critical patent/JPS6364033U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図および第２図は、本考案の半導体装置の
２実施例の各断面側面図、第３図は、従来の半導
体装置の一例の断面側面図、第４図は、ろう材付
後の、第３図と直角方向から視た断面側面図、第
５図は、“そり”現象の説明図である。 １……半導体チツプ、２……基板、３，３ａ…
…金属導体ベース。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 内部に整合回路を有する半導体装置におい
    て、整合基板の厚さと金属導体ベースとの厚さと
    の関係を、一方を他方に比べ十分厚くしたことを
    特徴とする半導体装置。 (2) 前記金属導体ベースの厚さを前記整合基板
    の厚さの５倍以上としたことを特徴とする実用新
    案登録請求の範囲第(1)項記載の半導体装置。 (3) 前記金属導体ベースの厚さを前記整合基板
    の厚さの１／５以下としたことを特徴とする実用
    新案登録請求の範囲第(1)項記載の半導体装置。
JP1986158384U 1986-10-16 1986-10-16 Pending JPS6364033U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986158384U JPS6364033U (ja) 1986-10-16 1986-10-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986158384U JPS6364033U (ja) 1986-10-16 1986-10-16

Publications (1)

Publication Number Publication Date
JPS6364033U true JPS6364033U (ja) 1988-04-27

Family

ID=31081822

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986158384U Pending JPS6364033U (ja) 1986-10-16 1986-10-16

Country Status (1)

Country Link
JP (1) JPS6364033U (ja)

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