JPS636759Y2 - - Google Patents

Info

Publication number
JPS636759Y2
JPS636759Y2 JP12100580U JP12100580U JPS636759Y2 JP S636759 Y2 JPS636759 Y2 JP S636759Y2 JP 12100580 U JP12100580 U JP 12100580U JP 12100580 U JP12100580 U JP 12100580U JP S636759 Y2 JPS636759 Y2 JP S636759Y2
Authority
JP
Japan
Prior art keywords
group
light emitting
wiring
wire bond
wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP12100580U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5743496U (mo
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12100580U priority Critical patent/JPS636759Y2/ja
Publication of JPS5743496U publication Critical patent/JPS5743496U/ja
Application granted granted Critical
Publication of JPS636759Y2 publication Critical patent/JPS636759Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Digital Computer Display Output (AREA)
  • Control Of Indicators Other Than Cathode Ray Tubes (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP12100580U 1980-08-25 1980-08-25 Expired JPS636759Y2 (mo)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12100580U JPS636759Y2 (mo) 1980-08-25 1980-08-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12100580U JPS636759Y2 (mo) 1980-08-25 1980-08-25

Publications (2)

Publication Number Publication Date
JPS5743496U JPS5743496U (mo) 1982-03-10
JPS636759Y2 true JPS636759Y2 (mo) 1988-02-26

Family

ID=29481687

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12100580U Expired JPS636759Y2 (mo) 1980-08-25 1980-08-25

Country Status (1)

Country Link
JP (1) JPS636759Y2 (mo)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9722160B2 (en) 2014-10-31 2017-08-01 Nichia Corporation Light emitting device and adaptive driving beam headlamp system

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1908124B1 (en) * 2005-07-15 2015-06-24 Panasonic Intellectual Property Management Co., Ltd. Light-emitting module and corresponding circuit board
KR101506264B1 (ko) 2008-06-13 2015-03-30 삼성전자주식회사 발광 소자, 발광 장치 및 상기 발광 소자의 제조 방법

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9722160B2 (en) 2014-10-31 2017-08-01 Nichia Corporation Light emitting device and adaptive driving beam headlamp system
US10256386B2 (en) 2014-10-31 2019-04-09 Nichia Corporation Light emitting device and adaptive driving beam headlamp system
US10468571B2 (en) 2014-10-31 2019-11-05 Nichia Corporation Light distribution method for adaptive driving beam headlamp system, and adaptive driving beam headlamp system

Also Published As

Publication number Publication date
JPS5743496U (mo) 1982-03-10

Similar Documents

Publication Publication Date Title
JP2535651B2 (ja) 半導体装置
EP0182254B1 (en) Dot matrix luminous display
JP2001515276A (ja) 高密度ｉ／ｏカウント付集積回路装置用電気インタフェース
JPH07281619A (ja) Ｌｅｄランプ、およびその基板への取付け構造
JPH1084069A (ja) ボトムリード型半導体パッケージ
KR102772593B1 (ko) 칩 온 필름 패키지 및 이를 포함하는 표시 장치
EP1923916A2 (en) Semiconductor device
JP4062640B2 (ja) Ｌｅｄ表示装置
JP3254230B2 (ja) 液晶ディスプレイパネルの配線構造
CN212461694U (zh) 一种Micro-LED芯片封装结构
JPH10154727A (ja) 細長型ドライバｉｃ及びこれを用いた平面表示装置
JP2506452Y2 (ja) 側面発光表示装置
JP2588956B2 (ja) ジグザグインライン型モジュ−ルおよびジグザグインライン型モジュ−ルの製造方法
JPS61290780A (ja) 光電変換装置
JPH03109760A (ja) 半導体装置
JPH06278313A (ja) 画像装置
JPH0119166Y2 (mo)
JPH0353313Y2 (mo)
JPH0449650A (ja) モールドパッケージ型ハイブリッドｉｃ
JPH085508Y2 (ja) 発光ダイオード表示装置
JPS61237482A (ja) 発光ダイオ−ド
JP3199564B2 (ja) 表示装置
JP2002169176A (ja) 液晶表示装置の構造
JPH0345264Y2 (mo)
JPH10229104A (ja) 半導体装置およびその製造に用いるテープキャリヤ