JPS6370155U - - Google Patents

Info

Publication number
JPS6370155U
JPS6370155U JP16306486U JP16306486U JPS6370155U JP S6370155 U JPS6370155 U JP S6370155U JP 16306486 U JP16306486 U JP 16306486U JP 16306486 U JP16306486 U JP 16306486U JP S6370155 U JPS6370155 U JP S6370155U
Authority
JP
Japan
Prior art keywords
semiconductor chip
semiconductor package
semiconductor
chip
attached
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16306486U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16306486U priority Critical patent/JPS6370155U/ja
Publication of JPS6370155U publication Critical patent/JPS6370155U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の半導体パツケージの実施例の
断面図、第２図は多端子、高放熱、高速性を目的
とする従来の半導体パツケージの断面図である。 １……チツプ搭載基材、２……半導体チツプ、
３……外部リード端子、４……ボンデイングワイ
ア、５……パツケージ内配線、６……熱拡散板、
７……キヤツプ支持部材、８……キヤツプ、９…
…フレキシブル配線基板基材、１０……チツプ搭
載基材。

Claims (1)

  1. 【実用新案登録請求の範囲】 半導体チツプを搭載する半導体パツケージにお
    いて、 半導体チツプ２を、 熱伝導率の高い材質からなり、前記半導体パツ
    ケージ全体を支持するチツプ搭載基材１０に取り
    付け、 前記チツプ搭載基材１０に、 フレキシブルプリント配線技術により外部リー
    ド端子３を形成したフレキシブル配線基板基材９
    を、前記半導体チツプ２に近接配置して取り付け
    、 前記半導体チツプ２と前記外部リード端子３を
    相互にボンデイングワイヤ４により接続する構造
    を備えてなる ことを特徴とする半導体パツケージ。
JP16306486U 1986-10-24 1986-10-24 Pending JPS6370155U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16306486U JPS6370155U (ja) 1986-10-24 1986-10-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16306486U JPS6370155U (ja) 1986-10-24 1986-10-24

Publications (1)

Publication Number Publication Date
JPS6370155U true JPS6370155U (ja) 1988-05-11

Family

ID=31090913

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16306486U Pending JPS6370155U (ja) 1986-10-24 1986-10-24

Country Status (1)

Country Link
JP (1) JPS6370155U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02278856A (ja) * 1989-04-20 1990-11-15 Nec Corp 半導体集積回路装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02278856A (ja) * 1989-04-20 1990-11-15 Nec Corp 半導体集積回路装置

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