JPS6373337U - - Google Patents
Info
- Publication number
- JPS6373337U JPS6373337U JP1986168197U JP16819786U JPS6373337U JP S6373337 U JPS6373337 U JP S6373337U JP 1986168197 U JP1986168197 U JP 1986168197U JP 16819786 U JP16819786 U JP 16819786U JP S6373337 U JPS6373337 U JP S6373337U
- Authority
- JP
- Japan
- Prior art keywords
- container
- workpiece
- carry
- adhesive
- arm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Description
第１図は本考案の実施例の全体正面図、第２図
は第１図の平面図、第３図は第１図の一部を截除
した左側面図、第４図は第１図の―線断面図
、第５図はカセツトケースの斜視図、第６図はワ
ークの斜視図、第７図は密閉状態の密閉容器の拡
大断面図、第８図はワークの回転状態を示す平面
線図、第９図は第２図の―線部分の側面図で
ある。
６…密閉容器、１２…光源、１４…搬出コンベ
ア、１７…ワーク、２１…搬入アーム、２２…搬
出アーム、２５…接着剤、２６…薄板、２７…半
導体ウエハ、３２…蓋体、３３…透光窓、３５…
脱酸素装置、３９…テーブル。
Fig. 1 is an overall front view of an embodiment of the present invention, Fig. 2 is a plan view of Fig. 1, Fig. 3 is a left side view with a part of Fig. 1 cut away, and Fig. 4 is a view similar to Fig. 1. Fig. 5 is a perspective view of the cassette case, Fig. 6 is a perspective view of the workpiece, Fig. 7 is an enlarged sectional view of the sealed container in the sealed state, and Fig. 8 is a plane showing the rotating state of the workpiece. 9 is a side view of the portion lined with - in FIG. 2. 6... Airtight container, 12... Light source, 14... Carrying out conveyor, 17... Work, 21... Carrying in arm, 22... Carrying out arm, 25... Adhesive, 26... Thin plate, 27... Semiconductor wafer, 32... Lid, 33... Transparent Light window, 35...
Oxygen absorber, 39...table.
Claims (1)
体ウエハを光硬化性の接着剤により透光性の合成
樹脂フイルム等の薄板に接着したワークが収容さ
れる密閉容器と、該容器の透光窓に対向する水銀
灯等の光源とを有し、該容器にその内部の雰囲気
から酸素成分を排除する脱酸素装置を接続し、さ
らに該密閉容器の側方に、該容器の外部から内部
へ該ワークを搬入する旋回自在の搬入アームと、
該容器の内部から外部へ該ワークを搬出する旋回
自在の搬出アームとを設けるようにしたものに於
て、該搬出アームの搬出移動位置に、搬出された
ワークを受取つてこれに所定の角度の旋回を与え
ると共に下方の搬出コンベア上へ移送するテーブ
ルを設けたことを特徴とする半導体ウエハと薄板
を接着する接着剤の接着力制御装置。 A sealed container is equipped with a transparent window and a cover body that can be opened and closed, and a sealed container that houses a workpiece in which a semiconductor wafer is bonded to a thin plate such as a transparent synthetic resin film using a light-curing adhesive. A light source such as a mercury lamp facing a light window is connected to the container, and a deoxidizing device for removing oxygen components from the atmosphere inside the container is connected to the container. a rotatable loading arm for loading the work;
A rotatable carry-out arm for carrying out the workpiece from the inside of the container to the outside is provided, and the carry-out arm receives the carried-out workpiece at a carry-out movement position and holds it at a predetermined angle. A device for controlling the adhesive force of an adhesive for bonding a semiconductor wafer and a thin plate, characterized in that it is provided with a table that gives rotation and transfers onto a lower delivery conveyor.
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986168197U JPH0543079Y2 (en) | 1986-11-04 | 1986-11-04 | |
| PH34571A PH25206A (en) | 1985-12-12 | 1986-12-09 | Control apparatus for reducing adhesive force of adhesive agent adhering between semiconductor wafer and substrate |
| DE8686117185T DE3686314T2 (en) | 1985-12-12 | 1986-12-10 | DEVICE FOR DETERMINING THE ADHESIVE FORCE OF AN ADHESIVE BETWEEN A SEMICONDUCTOR AND ITS SUBSTRATE. |
| EP86117185A EP0226949B1 (en) | 1985-12-12 | 1986-12-10 | Control apparatus for adhesive force of adhesive agent adhering between semiconductor wafer and substrate |
| US06/940,328 US4718967A (en) | 1985-12-12 | 1986-12-11 | Control apparatus for reducing adhesive force of adhesive agent adhering between semiconductor wafer and substrate |
| KR1019860010635A KR900004688B1 (en) | 1985-12-12 | 1986-12-12 | Control apparatus for reducting adhesive force of adhesive agent adhering between semiconductor wafer |
| SG1063/92A SG106392G (en) | 1985-12-12 | 1992-10-13 | Control apparatus for adhesive force of adhesive agent adhering between semiconductor wafer and substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986168197U JPH0543079Y2 (en) | 1986-11-04 | 1986-11-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6373337U true JPS6373337U (en) | 1988-05-16 |
| JPH0543079Y2 JPH0543079Y2 (en) | 1993-10-29 |
Family
ID=31100851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986168197U Expired - Lifetime JPH0543079Y2 (en) | 1985-12-12 | 1986-11-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0543079Y2 (en) |
-
1986
- 1986-11-04 JP JP1986168197U patent/JPH0543079Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0543079Y2 (en) | 1993-10-29 |
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