JPS6414992A - Manufacture of printed wiring board - Google Patents

Manufacture of printed wiring board

Info

Publication number
JPS6414992A
JPS6414992A JP17070887A JP17070887A JPS6414992A JP S6414992 A JPS6414992 A JP S6414992A JP 17070887 A JP17070887 A JP 17070887A JP 17070887 A JP17070887 A JP 17070887A JP S6414992 A JPS6414992 A JP S6414992A
Authority
JP
Japan
Prior art keywords
prescribed
insulating layer
paste
points
point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17070887A
Other languages
Japanese (ja)
Other versions
JPH07105592B2 (en
Inventor
Hisayasu Tsuji
Jiro Kogo
Nobumasa Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Brother Industries Ltd
Original Assignee
Brother Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brother Industries Ltd filed Critical Brother Industries Ltd
Priority to JP62170708A priority Critical patent/JPH07105592B2/en
Publication of JPS6414992A publication Critical patent/JPS6414992A/en
Publication of JPH07105592B2 publication Critical patent/JPH07105592B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

PURPOSE:To make it possible to form a prescribed exposed point with a high positional accuracy and easily by a method wherein the whole surface of a printed substrate within a range that prescribed connecting points and the prescribed exposed point are excluded from the surface is covered with an insulating layer and a conductive paste is printed between prescribed connecting points to make the connecting points conductive to each other. CONSTITUTION:A protective film 8 consisting of an insulating layer is covered on the whole surface of a printed substrate 1 excepting prescribed connecting points 2a and 5b and a prescribed exposed point X0 to protect prescribed patterns and the surface of the substrate 1 and an oblong insulating layer 9 is coated on the film 8 on the peripheries of the point 2a and a prescribed connecting point 5a to fix the layer 9 on the film 8 on a heating condition of 90 deg.X30 minutes. Then, a conductive carbon paste 10 is printed on the layer 9 to conduct the points 2a and 5a to each other and an oblong insulating layer 11 is coated with an ink agent used in a first manufacturing process as an overcoat on the paste 10 to protect the points 2a and 5a and the paste 10.
JP62170708A 1987-07-08 1987-07-08 Method for manufacturing printed wiring board Expired - Fee Related JPH07105592B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62170708A JPH07105592B2 (en) 1987-07-08 1987-07-08 Method for manufacturing printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62170708A JPH07105592B2 (en) 1987-07-08 1987-07-08 Method for manufacturing printed wiring board

Publications (2)

Publication Number Publication Date
JPS6414992A true JPS6414992A (en) 1989-01-19
JPH07105592B2 JPH07105592B2 (en) 1995-11-13

Family

ID=15909926

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62170708A Expired - Fee Related JPH07105592B2 (en) 1987-07-08 1987-07-08 Method for manufacturing printed wiring board

Country Status (1)

Country Link
JP (1) JPH07105592B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0465473U (en) * 1990-10-15 1992-06-08

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61100168U (en) * 1984-12-06 1986-06-26

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61100168U (en) * 1984-12-06 1986-06-26

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0465473U (en) * 1990-10-15 1992-06-08

Also Published As

Publication number Publication date
JPH07105592B2 (en) 1995-11-13

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees