JPH024247U - - Google Patents
Info
- Publication number
- JPH024247U JPH024247U JP8180688U JP8180688U JPH024247U JP H024247 U JPH024247 U JP H024247U JP 8180688 U JP8180688 U JP 8180688U JP 8180688 U JP8180688 U JP 8180688U JP H024247 U JPH024247 U JP H024247U
- Authority
- JP
- Japan
- Prior art keywords
- package
- resin layer
- utility
- semiconductor device
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は、本考案の一実施例の断面図である。
１……捺印面、２……薄い樹脂層、３……パツ
ケージ本体、４……端子、５……捺印面、６……
パツケージ、７……端子。
ケージ本体、４……端子、５……捺印面、６……
パツケージ、７……端子。
Claims (1)
- パツケージ表面に薄い樹脂層を有する構造を特
徴とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8180688U JPH024247U (ja) | 1988-06-20 | 1988-06-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8180688U JPH024247U (ja) | 1988-06-20 | 1988-06-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH024247U true JPH024247U (ja) | 1990-01-11 |
Family
ID=31306576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8180688U Pending JPH024247U (ja) | 1988-06-20 | 1988-06-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH024247U (ja) |
-
1988
- 1988-06-20 JP JP8180688U patent/JPH024247U/ja active Pending