JPS6427246U - - Google Patents

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Publication number
JPS6427246U
JPS6427246U JP12198187U JP12198187U JPS6427246U JP S6427246 U JPS6427246 U JP S6427246U JP 12198187 U JP12198187 U JP 12198187U JP 12198187 U JP12198187 U JP 12198187U JP S6427246 U JPS6427246 U JP S6427246U
Authority
JP
Japan
Prior art keywords
wiring pattern
pressure contact
printed circuit
circuit board
protrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12198187U
Other languages
English (en)
Other versions
JPH078208Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12198187U priority Critical patent/JPH078208Y2/ja
Publication of JPS6427246U publication Critical patent/JPS6427246U/ja
Application granted granted Critical
Publication of JPH078208Y2 publication Critical patent/JPH078208Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

【図面の簡単な説明】
第１図は、実施例サーマルヘツドを示す側面図
、第２図は、実施例サーマルヘツドの圧接手段を
示す要部拡大正面図、第３図は、従来のサーマル
ヘツドを示す側面図である。 １：放熱板、２：プリント基板、３：補強板、
４：フレキシブル基板、５：コネクタ、２１：配
線パターン、２２：発熱ドツト、２３：ＩＣ、６
１：カバー体、６３：突子、６４：圧接用弾性樹
脂層。

Claims (1)

  1. 【実用新案登録請求の範囲】 放熱板の上面に、配線パターンを備えたプリン
    ト基板を載置し、上記プリント基板の配線パター
    ン上に発熱ドツトを形成すると共に、一端部が前
    記配線パターンの端部に重合する外部回路接続用
    のフレキシブル基板を配備し、前記プリント基板
    、配線パターン及びフレキシブル基板の重合部に
    対し圧接手段を備えたサーマルヘツドにおいて、 前記圧接手段は、上記重合部へ突出する突子を
    突設し、この突子の先端に圧接用弾性樹脂層を一
    体に配備したことを特徴とするサーマルヘツド。
JP12198187U 1987-08-07 1987-08-07 サ−マルヘツド Expired - Lifetime JPH078208Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12198187U JPH078208Y2 (ja) 1987-08-07 1987-08-07 サ−マルヘツド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12198187U JPH078208Y2 (ja) 1987-08-07 1987-08-07 サ−マルヘツド

Publications (2)

Publication Number Publication Date
JPS6427246U true JPS6427246U (ja) 1989-02-16
JPH078208Y2 JPH078208Y2 (ja) 1995-03-01

Family

ID=31369488

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12198187U Expired - Lifetime JPH078208Y2 (ja) 1987-08-07 1987-08-07 サ−マルヘツド

Country Status (1)

Country Link
JP (1) JPH078208Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7420282B2 (en) 2004-10-18 2008-09-02 Sharp Kabushiki Kaisha Connection structure for connecting semiconductor element and wiring board, and semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7420282B2 (en) 2004-10-18 2008-09-02 Sharp Kabushiki Kaisha Connection structure for connecting semiconductor element and wiring board, and semiconductor device

Also Published As

Publication number Publication date
JPH078208Y2 (ja) 1995-03-01

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