JPS642861A - Polishing device - Google Patents

Polishing device

Info

Publication number
JPS642861A
JPS642861A JP62130088A JP13008887A JPS642861A JP S642861 A JPS642861 A JP S642861A JP 62130088 A JP62130088 A JP 62130088A JP 13008887 A JP13008887 A JP 13008887A JP S642861 A JPS642861 A JP S642861A
Authority
JP
Japan
Prior art keywords
reverse
obverse
workpiece
carrier
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62130088A
Other languages
English (en)
Other versions
JPH012861A (ja
Inventor
Kesahiro Koike
Kazufumi Asakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hoya Corp
Original Assignee
Hoya Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoya Corp filed Critical Hoya Corp
Priority to JP62130088A priority Critical patent/JPS642861A/ja
Publication of JPH012861A publication Critical patent/JPH012861A/ja
Publication of JPS642861A publication Critical patent/JPS642861A/ja
Pending legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP62130088A 1987-03-30 1987-05-27 Polishing device Pending JPS642861A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62130088A JPS642861A (en) 1987-03-30 1987-05-27 Polishing device

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP62-74448 1987-03-30
JP7444887 1987-03-30
JP62130088A JPS642861A (en) 1987-03-30 1987-05-27 Polishing device

Publications (2)

Publication Number Publication Date
JPH012861A JPH012861A (ja) 1989-01-06
JPS642861A true JPS642861A (en) 1989-01-06

Family

ID=26415602

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62130088A Pending JPS642861A (en) 1987-03-30 1987-05-27 Polishing device

Country Status (1)

Country Link
JP (1) JPS642861A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0425376A (ja) * 1990-05-16 1992-01-29 Showa Alum Corp 研磨装置
US7455785B2 (en) 2002-03-29 2008-11-25 Hoya Corporation Method of determining a flatness of an electronic device substrate, method of producing the substrate, method of producing a mask blank, method of producing a transfer mask, polishing method, electronic device substrate, mask blank, transfer mask, and polishing apparatus
JP2010099830A (ja) * 2008-10-22 2010-05-06 Siltronic Ag 平坦なワークピースを両面加工する装置、ならびに複数の半導体ウェハを両面で同時に材料切削加工する方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0425376A (ja) * 1990-05-16 1992-01-29 Showa Alum Corp 研磨装置
US7455785B2 (en) 2002-03-29 2008-11-25 Hoya Corporation Method of determining a flatness of an electronic device substrate, method of producing the substrate, method of producing a mask blank, method of producing a transfer mask, polishing method, electronic device substrate, mask blank, transfer mask, and polishing apparatus
JP2010099830A (ja) * 2008-10-22 2010-05-06 Siltronic Ag 平坦なワークピースを両面加工する装置、ならびに複数の半導体ウェハを両面で同時に材料切削加工する方法
US8512099B2 (en) 2008-10-22 2013-08-20 Siltronic Ag Method for the simultaneous double-sided material removal processing of a plurality of semiconductor wafers

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