JPS6431425A - Resin sealing apparatus for semiconductor device - Google Patents

Resin sealing apparatus for semiconductor device

Info

Publication number
JPS6431425A
JPS6431425A JP18731787A JP18731787A JPS6431425A JP S6431425 A JPS6431425 A JP S6431425A JP 18731787 A JP18731787 A JP 18731787A JP 18731787 A JP18731787 A JP 18731787A JP S6431425 A JPS6431425 A JP S6431425A
Authority
JP
Japan
Prior art keywords
block
prevent
blocks
chase
clamping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18731787A
Other languages
Japanese (ja)
Other versions
JP2531689B2 (en
Inventor
Suekichi Tanaka
Koji Tsutsumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP62187317A priority Critical patent/JP2531689B2/en
Priority to US07/219,483 priority patent/US4915608A/en
Publication of JPS6431425A publication Critical patent/JPS6431425A/en
Priority to US07/447,866 priority patent/US4983111A/en
Priority to US07/447,917 priority patent/US5059379A/en
Application granted granted Critical
Publication of JP2531689B2 publication Critical patent/JP2531689B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/1742—Mounting of moulds; Mould supports
    • B29C45/1744—Mould support platens

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent a resin burr from generating at a lead frame on a cavity block by providing chase blocks at an interval on a surface plate by many supporting pins. CONSTITUTION:The sidewall 22a of a chase block 22 is set to a height size smaller than the height of a supporting pin 21. A cavity 23 opening at a parting face 22b is formed on the block 22, and an ejector mechanism 24 is contained therein. Accordingly, only the pin 21 can be axially and elastically contracted or deformed at the time of clamping a mold to prevent both upper and lower chase blocks 22 from deforming. Therefore, the parting faces 22 of the blocks 22 are contacted each other at the time of clamping, pressing forces are uniformed acted on both the parting faces 22a to prevent a resin burr from generating at the lead frame on the block 22.
JP62187317A 1987-07-20 1987-07-27 Resin encapsulation equipment for semiconductor devices Expired - Fee Related JP2531689B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP62187317A JP2531689B2 (en) 1987-07-27 1987-07-27 Resin encapsulation equipment for semiconductor devices
US07/219,483 US4915608A (en) 1987-07-20 1988-07-15 Device for resin sealing semiconductor devices
US07/447,866 US4983111A (en) 1987-07-20 1989-12-08 Device for resin sealing semiconductor devices
US07/447,917 US5059379A (en) 1987-07-20 1989-12-08 Method of resin sealing semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62187317A JP2531689B2 (en) 1987-07-27 1987-07-27 Resin encapsulation equipment for semiconductor devices

Publications (2)

Publication Number Publication Date
JPS6431425A true JPS6431425A (en) 1989-02-01
JP2531689B2 JP2531689B2 (en) 1996-09-04

Family

ID=16203888

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62187317A Expired - Fee Related JP2531689B2 (en) 1987-07-20 1987-07-27 Resin encapsulation equipment for semiconductor devices

Country Status (1)

Country Link
JP (1) JP2531689B2 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5538088A (en) * 1978-09-11 1980-03-17 Nec Kyushu Ltd Resin sealing device
JPS5842101U (en) * 1981-09-14 1983-03-19 明浦　康子 window cufflinks
JPS6226827A (en) * 1985-07-27 1987-02-04 Mitsubishi Electric Corp Resin sealing device for semiconductor element
JPS6244441U (en) * 1985-09-05 1987-03-17

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5538088A (en) * 1978-09-11 1980-03-17 Nec Kyushu Ltd Resin sealing device
JPS5842101U (en) * 1981-09-14 1983-03-19 明浦　康子 window cufflinks
JPS6226827A (en) * 1985-07-27 1987-02-04 Mitsubishi Electric Corp Resin sealing device for semiconductor element
JPS6244441U (en) * 1985-09-05 1987-03-17

Also Published As

Publication number Publication date
JP2531689B2 (en) 1996-09-04

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Legal Events

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S111 Request for change of ownership or part of ownership

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R350 Written notification of registration of transfer

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LAPS Cancellation because of no payment of annual fees