JPS6431444A - Porcelain substrate for surface mounting - Google Patents

Porcelain substrate for surface mounting

Info

Publication number
JPS6431444A
JPS6431444A JP62188626A JP18862687A JPS6431444A JP S6431444 A JPS6431444 A JP S6431444A JP 62188626 A JP62188626 A JP 62188626A JP 18862687 A JP18862687 A JP 18862687A JP S6431444 A JPS6431444 A JP S6431444A
Authority
JP
Japan
Prior art keywords
layer
porcelain
surface mounting
placing
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62188626A
Other languages
English (en)
Inventor
Fumiya Numajiri
Kenji Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP62188626A priority Critical patent/JPS6431444A/ja
Publication of JPS6431444A publication Critical patent/JPS6431444A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP62188626A 1987-07-28 1987-07-28 Porcelain substrate for surface mounting Pending JPS6431444A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62188626A JPS6431444A (en) 1987-07-28 1987-07-28 Porcelain substrate for surface mounting

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62188626A JPS6431444A (en) 1987-07-28 1987-07-28 Porcelain substrate for surface mounting

Publications (1)

Publication Number Publication Date
JPS6431444A true JPS6431444A (en) 1989-02-01

Family

ID=16226982

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62188626A Pending JPS6431444A (en) 1987-07-28 1987-07-28 Porcelain substrate for surface mounting

Country Status (1)

Country Link
JP (1) JPS6431444A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5338967A (en) * 1993-01-12 1994-08-16 Mitsubishi Denki Kabushiki Kaisha Semiconductor device structure with plated heat sink and supporting substrate
JP2006179791A (ja) * 2004-12-24 2006-07-06 Toshiba Corp 半導体装置
CN102468395A (zh) * 2010-11-04 2012-05-23 浙江雄邦节能产品有限公司 一种陶瓷基板led装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5338967A (en) * 1993-01-12 1994-08-16 Mitsubishi Denki Kabushiki Kaisha Semiconductor device structure with plated heat sink and supporting substrate
US5770468A (en) * 1993-01-12 1998-06-23 Mitsubishi Denki Kabushiki Kaisha Process for mounting a semiconductor chip to a chip carrier by exposing a solder layer to a reducing atmosphere
JP2006179791A (ja) * 2004-12-24 2006-07-06 Toshiba Corp 半導体装置
CN102468395A (zh) * 2010-11-04 2012-05-23 浙江雄邦节能产品有限公司 一种陶瓷基板led装置

Similar Documents

Publication Publication Date Title
US4612601A (en) Heat dissipative integrated circuit chip package
CA1037615A (en) Functional package for complex electronic systems and method of fabrication
EP1020914A3 (en) Ceramic substrate used for fabricating electric or electronic circuit
GB1419193A (en) Hybrid circuit panel
JPS57201058A (en) Insulated semiconductor device
US5355280A (en) Connection arrangement with PC board
JP2930133B2 (ja) 印刷配線板複合構造体
JP2566341B2 (ja) 半導体装置
JPS59198790A (ja) プリント配線基板
EP1705966A2 (en) Circuit board and manufacturing method thereof
JPS6431444A (en) Porcelain substrate for surface mounting
CA1235528A (en) Heat dissipation for electronic components on ceramic substrate
US6175148B1 (en) Electrical connection for a power semiconductor component
JP3077399B2 (ja) 電気回路用基板およびその製造方法
JP2847949B2 (ja) 半導体装置
JP3170005B2 (ja) セラミック回路基板
US6755229B2 (en) Method for preparing high performance ball grid array board and jig applicable to said method
JP3170004B2 (ja) セラミック回路基板
JPH0246741A (ja) 混成集積回路
JPS6317263Y2 (ja)
JPH08264910A (ja) 放熱板付きプリント配線板の作製方法及びプリント配線板へのハイパワー部品の実装方法
JPS59227132A (ja) 半導体装置
JPS6457653A (en) Mounting structure of hybrid integrated circuit component
JPH0513023Y2 (ja)
JPH0442989A (ja) 電子部品搭載用基板及びその製造方法