JPS6436494A - Printed wiring board for ic card - Google Patents
Printed wiring board for ic cardInfo
- Publication number
- JPS6436494A JPS6436494A JP62193359A JP19335987A JPS6436494A JP S6436494 A JPS6436494 A JP S6436494A JP 62193359 A JP62193359 A JP 62193359A JP 19335987 A JP19335987 A JP 19335987A JP S6436494 A JPS6436494 A JP S6436494A
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- contact terminal
- card
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Credit Cards Or The Like (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE: To improve the reliability, by forming a substrate through hole closed by a conductor which is used as a bonding terminal connected with an electronic part, on a rear face side of a contact terminal, and making the thickness of the conductor of the contact terminal, thicker than that of the conductor of the other conductor part by a specific range. CONSTITUTION: A through hole 13 and a cavity hole 14 are formed on a substrate body 11, and a copper foil is laminated thereon. Then a necessary wiring pattern is formed through a process for forming and etching a resist. Then a contact terminal is projected on a wiring pattern located on the contact terminal 12 by a plating method under a condition that it is thicker than a conductor 15 of the other wiring pattern by 20-300 micron m. Then the electronic parts such as IC chips 16 or the like, are loaded on a printed wiring board 10 for an IC card, the printed wiring board is placed on a fitting part 110 formed on the IC card 100, and a plastic film 120 is laminated on the surface. Whereby the surface of the IC card and the surface of the contact terminal are aligned on the same plane, and the accumulation of the dust, water or the like thereon can be prevented.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62193359A JPS6436494A (en) | 1987-07-31 | 1987-07-31 | Printed wiring board for ic card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62193359A JPS6436494A (en) | 1987-07-31 | 1987-07-31 | Printed wiring board for ic card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6436494A true JPS6436494A (en) | 1989-02-07 |
Family
ID=16306596
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62193359A Pending JPS6436494A (en) | 1987-07-31 | 1987-07-31 | Printed wiring board for ic card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6436494A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0332895A (en) * | 1989-06-29 | 1991-02-13 | Ibiden Co Ltd | Printer wiring board for ic card |
-
1987
- 1987-07-31 JP JP62193359A patent/JPS6436494A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0332895A (en) * | 1989-06-29 | 1991-02-13 | Ibiden Co Ltd | Printer wiring board for ic card |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| MY108905A (en) | Copper-clad laminate and printed wiring board | |
| GB2341277A (en) | An electronic component package with posts on the active surface | |
| MY125599A (en) | Printed circuit boards and method of producing the same | |
| EP1259103A4 (en) | Multilayer printed wiring board and method for producing multilayer printed wiring board | |
| TW535480B (en) | Printed wiring board and method of producing the same | |
| EP0425703A4 (en) | Photo-curable resin laminate and method of producing printed wiring board using the same | |
| EP1194024A4 (en) | Multilayer printed-circuit board and method of manufacture | |
| IL102269A (en) | Integrated socket-type package for flip chip semiconductor devices and circuits | |
| TW200605373A (en) | Printed wiring board, production process thereof and semiconductor device | |
| GB2341003A (en) | Integrated passive components and package with posts | |
| JPS6436494A (en) | Printed wiring board for ic card | |
| GB2324753B (en) | Printed circuit and printed wiring boards and methods of manufacture | |
| GB1220370A (en) | Electrical circuit boards | |
| EP0231384A4 (en) | A method for preparing a printed wiring board for installation in an IC card. | |
| JPS6484788A (en) | Printed wiring board | |
| JPS6459985A (en) | Printed wiring board for ic card | |
| JPS6489392A (en) | Manufacture of printed wiring board | |
| JPS6489591A (en) | Manufacture of wiring board and that of multilayer wiring board | |
| JPS6480097A (en) | Manufacture of printed wiring board | |
| JPS6422095A (en) | Manufacture of printed wiring board | |
| GB1145771A (en) | Electrical circuit boards | |
| JPS6442140A (en) | Connection of integrated circuit | |
| Kobayashi et al. | Process for Producing a Printed Wiring Board | |
| JPS6463286A (en) | Terminal member for electronic device and manufacture thereof | |
| JPS6464390A (en) | Circuit board |