JPS6450431U - - Google Patents

Info

Publication number
JPS6450431U
JPS6450431U JP1987145458U JP14545887U JPS6450431U JP S6450431 U JPS6450431 U JP S6450431U JP 1987145458 U JP1987145458 U JP 1987145458U JP 14545887 U JP14545887 U JP 14545887U JP S6450431 U JPS6450431 U JP S6450431U
Authority
JP
Japan
Prior art keywords
electrode structure
wiring layer
passivation film
aluminum wiring
bonding part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987145458U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987145458U priority Critical patent/JPS6450431U/ja
Publication of JPS6450431U publication Critical patent/JPS6450431U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/942—Dispositions of bond pads relative to underlying supporting features, e.g. bond pads, RDLs or vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/981—Auxiliary members, e.g. spacers
    • H10W72/983—Reinforcing structures, e.g. collars

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図はこの考案の１実施例にかかる電極構造
の断面図、第２図は第１図に示す装置の動作説明
図、第３図はこの考案の第２の実施例の断面図、
第４図はこの考案の従来例の断面図、第５図は第
４図に示す装置の動作説明図である。 １……シリコン半導体基体、３……アルミ配線
層、４……ワイヤ、５……パツシベーシヨン膜、
７……多結晶シリコン配線層、９……拡散層。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体基体上に形成したアルミ配線層を、ワイ
    ヤとのボンデイング部を除いてパツシベーシヨン
    膜で保護した半導体素子の電極構造において、上
    記アルミ配線層の下の上記ボンデイング部からパ
    ツシベーシヨン膜に至る領域に対応する部分に耐
    腐食性の導電層を設けたことを特徴とする半導体
    素子の電極構造。
JP1987145458U 1987-09-25 1987-09-25 Pending JPS6450431U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987145458U JPS6450431U (ja) 1987-09-25 1987-09-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987145458U JPS6450431U (ja) 1987-09-25 1987-09-25

Publications (1)

Publication Number Publication Date
JPS6450431U true JPS6450431U (ja) 1989-03-29

Family

ID=31414067

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987145458U Pending JPS6450431U (ja) 1987-09-25 1987-09-25

Country Status (1)

Country Link
JP (1) JPS6450431U (ja)

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