JPS6454332U - - Google Patents

Info

Publication number
JPS6454332U
JPS6454332U JP1987150091U JP15009187U JPS6454332U JP S6454332 U JPS6454332 U JP S6454332U JP 1987150091 U JP1987150091 U JP 1987150091U JP 15009187 U JP15009187 U JP 15009187U JP S6454332 U JPS6454332 U JP S6454332U
Authority
JP
Japan
Prior art keywords
semiconductor device
mounting board
metal protrusion
conductor pattern
insulated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987150091U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987150091U priority Critical patent/JPS6454332U/ja
Publication of JPS6454332U publication Critical patent/JPS6454332U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
図面はこの考案の実施例を示すもので、第１図
は半導体装置の平面図、第２図は半導体装置が基
板に実装された状態において第１図の−線に
そつて切断した断面図である。 １……半導体素子基板、２……半導体素子、３
……導体パターン、４……実装用金属突起、５…
…放熱用導体、６……放熱用金属突起、１０……
実装基板、１１……導体パターン、１２……放熱
用導体。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子電極部に形成された金属突起を用い
    て実装基板に実装される半導体装置において、半
    導体装置または実装基板の少なくともいずれか一
    方の配線用導体パターンと絶縁されかつ実装され
    たときに実装基板に達する放熱用突起が設けられ
    ている半導体装置。
JP1987150091U 1987-09-30 1987-09-30 Pending JPS6454332U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987150091U JPS6454332U (ja) 1987-09-30 1987-09-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987150091U JPS6454332U (ja) 1987-09-30 1987-09-30

Publications (1)

Publication Number Publication Date
JPS6454332U true JPS6454332U (ja) 1989-04-04

Family

ID=31422917

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987150091U Pending JPS6454332U (ja) 1987-09-30 1987-09-30

Country Status (1)

Country Link
JP (1) JPS6454332U (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5923109A (ja) * 1982-07-29 1984-02-06 Yunitsuku:Kk 負荷検出用油圧シリンダ装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5923109A (ja) * 1982-07-29 1984-02-06 Yunitsuku:Kk 負荷検出用油圧シリンダ装置

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