JPS6457995A - Soldering device - Google Patents

Soldering device

Info

Publication number
JPS6457995A
JPS6457995A JP62213441A JP21344187A JPS6457995A JP S6457995 A JPS6457995 A JP S6457995A JP 62213441 A JP62213441 A JP 62213441A JP 21344187 A JP21344187 A JP 21344187A JP S6457995 A JPS6457995 A JP S6457995A
Authority
JP
Japan
Prior art keywords
work
soldering
cradle
heated
subjected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62213441A
Other languages
Japanese (ja)
Inventor
Hiroaki Hiramine
Takaaki Maeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP62213441A priority Critical patent/JPS6457995A/en
Publication of JPS6457995A publication Critical patent/JPS6457995A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To raise a work temp. prior to soldering and to execute the soldering of good quality by mounting the work on the work cradle arranging a preheating heater and moving it with its sliding by a moving device. CONSTITUTION:The work 7 combining a ceramic substrate 1 and base 2 is subjected to pitch feeding with sliding on a work cradle 4' by a feeding claw 6. Then, the base 2 is heated through a contact face 26 by the heater 5 embedded on the work cradle 4' and a lead wire 3 and the ceramic substrate 1 are heated. The lead wire 3 at four places of the work 7 are then soldered in order by plural soldering irons. The soldering iron is subjected to air cleaning at its tip on each certain times of the soldering work and the soldering chip is collected in a pot.
JP62213441A 1987-08-27 1987-08-27 Soldering device Pending JPS6457995A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62213441A JPS6457995A (en) 1987-08-27 1987-08-27 Soldering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62213441A JPS6457995A (en) 1987-08-27 1987-08-27 Soldering device

Publications (1)

Publication Number Publication Date
JPS6457995A true JPS6457995A (en) 1989-03-06

Family

ID=16639282

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62213441A Pending JPS6457995A (en) 1987-08-27 1987-08-27 Soldering device

Country Status (1)

Country Link
JP (1) JPS6457995A (en)

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