JPS6461981A - Manufacture of wiring board - Google Patents

Manufacture of wiring board

Info

Publication number: JPS6461981A
Authority: JP; Japan
Prior art keywords: slits; hard substrate; circuit; bending; substrate
Prior art date: 1987-09-02
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP21939487A

Other languages

English (en)

Inventor

Munehiko Fukushima

Daizo Baba

Taizo Kitamura

Hajime Kawakami

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Panasonic Electric Works Co Ltd

Original Assignee

Matsushita Electric Works Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1987-09-02

Filing date

1987-09-02

Publication date

1989-03-08

1987-09-02 Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd

1987-09-02 Priority to JP21939487A priority Critical patent/JPS6461981A/ja

1989-03-08 Publication of JPS6461981A publication Critical patent/JPS6461981A/ja

Status Pending legal-status Critical Current

Links

238000004519 manufacturing process Methods 0.000 title 1
239000000758 substrate Substances 0.000 abstract 8
229910052751 metal Inorganic materials 0.000 abstract 4
239000002184 metal Substances 0.000 abstract 4
238000005452 bending Methods 0.000 abstract 3
XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract 2
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 2
239000011888 foil Substances 0.000 abstract 2
238000003475 lamination Methods 0.000 abstract 2
239000002985 plastic film Substances 0.000 abstract 2
229920006255 plastic film Polymers 0.000 abstract 2
VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 abstract 1
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract 1
239000000956 alloy Substances 0.000 abstract 1
229910045601 alloy Inorganic materials 0.000 abstract 1
229910052782 aluminium Inorganic materials 0.000 abstract 1
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
230000015572 biosynthetic process Effects 0.000 abstract 1
229910052804 chromium Inorganic materials 0.000 abstract 1
239000011651 chromium Substances 0.000 abstract 1
229910052802 copper Inorganic materials 0.000 abstract 1
239000010949 copper Substances 0.000 abstract 1
238000005530 etching Methods 0.000 abstract 1
229910052742 iron Inorganic materials 0.000 abstract 1
150000002739 metals Chemical class 0.000 abstract 1
238000000034 method Methods 0.000 abstract 1
229910052759 nickel Inorganic materials 0.000 abstract 1
239000000126 substance Substances 0.000 abstract 1
239000011701 zinc Substances 0.000 abstract 1
229910052725 zinc Inorganic materials 0.000 abstract 1

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers

Landscapes

Insulated Metal Substrates For Printed Circuits (AREA)

JP21939487A 1987-09-02 1987-09-02 Manufacture of wiring board Pending JPS6461981A (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP21939487A JPS6461981A (en)	1987-09-02	1987-09-02	Manufacture of wiring board

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP21939487A JPS6461981A (en)	1987-09-02	1987-09-02	Manufacture of wiring board

Publications (1)

Publication Number	Publication Date
JPS6461981A true JPS6461981A (en)	1989-03-08

Family

ID=16734726

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP21939487A Pending JPS6461981A (en)	1987-09-02	1987-09-02	Manufacture of wiring board

Country Status (1)

Country	Link
JP (1)	JPS6461981A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5398128A (en) *	1991-05-21	1995-03-14	Sharp Kabushiki Kaisha	Wiring board for use in a liquid crystal panel and method of making including forming resin over slit before bending
FR2871334A1 (fr) *	2004-06-03	2005-12-09	Bree Beauce Realisations Et Et	Circuit imprime semi-flexible

1987
- 1987-09-02 JP JP21939487A patent/JPS6461981A/ja active Pending

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5398128A (en) *	1991-05-21	1995-03-14	Sharp Kabushiki Kaisha	Wiring board for use in a liquid crystal panel and method of making including forming resin over slit before bending
FR2871334A1 (fr) *	2004-06-03	2005-12-09	Bree Beauce Realisations Et Et	Circuit imprime semi-flexible

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