JPS6466228A - Thermosetting resin composition - Google Patents

Thermosetting resin composition

Info

Publication number
JPS6466228A
JPS6466228A JP22475087A JP22475087A JPS6466228A JP S6466228 A JPS6466228 A JP S6466228A JP 22475087 A JP22475087 A JP 22475087A JP 22475087 A JP22475087 A JP 22475087A JP S6466228 A JPS6466228 A JP S6466228A
Authority
JP
Japan
Prior art keywords
compound
resin composition
thermosetting resin
molecule
containing diamine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22475087A
Other languages
Japanese (ja)
Inventor
Kaoru Kanayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Original Assignee
Mitsubishi Petrochemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Petrochemical Co Ltd filed Critical Mitsubishi Petrochemical Co Ltd
Priority to JP22475087A priority Critical patent/JPS6466228A/en
Publication of JPS6466228A publication Critical patent/JPS6466228A/en
Pending legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)

Abstract

PURPOSE:To obtain the titled composition, containing a polymaleimide compound, specific polyepoxy compound and spiroacetal ring-containing diamine in a specific proportion, capable of improving brittleness, having excellent moldability, heat and impact resistance and useful for producing molded products and sealing. CONSTITUTION:The aimed composition consisting of (A) 2-10wt.% polymaleimide compound having >=2 maleimide groups in one molecule (e.g., diaminodiphenylmethanebismaleimide), (B) 40-80wt.% polyepoxy compound, having >=2 epoxy groups in one molecule and capable of providing a liquid state at 80 deg.C and (C) 15-50wt.% spiroacetal ring-containing diamine.
JP22475087A 1987-09-08 1987-09-08 Thermosetting resin composition Pending JPS6466228A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22475087A JPS6466228A (en) 1987-09-08 1987-09-08 Thermosetting resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22475087A JPS6466228A (en) 1987-09-08 1987-09-08 Thermosetting resin composition

Publications (1)

Publication Number Publication Date
JPS6466228A true JPS6466228A (en) 1989-03-13

Family

ID=16818651

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22475087A Pending JPS6466228A (en) 1987-09-08 1987-09-08 Thermosetting resin composition

Country Status (1)

Country Link
JP (1) JPS6466228A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4949034A (en) * 1988-09-07 1990-08-14 Mitsubishi Kinzoku Kabushiki Kaisha Method for contactless evaluation of characteristics of semiconductor wafers and devices
JP2017071705A (en) * 2015-10-08 2017-04-13 日本化薬株式会社 Epoxy resin mixture, epoxy resin composition and cured product thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5010900A (en) * 1973-06-01 1975-02-04
JPS5046799A (en) * 1972-10-31 1975-04-25
JPS6121132A (en) * 1984-07-10 1986-01-29 Mitsubishi Petrochem Co Ltd Resin composition for solder resist

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5046799A (en) * 1972-10-31 1975-04-25
JPS5010900A (en) * 1973-06-01 1975-02-04
JPS6121132A (en) * 1984-07-10 1986-01-29 Mitsubishi Petrochem Co Ltd Resin composition for solder resist

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4949034A (en) * 1988-09-07 1990-08-14 Mitsubishi Kinzoku Kabushiki Kaisha Method for contactless evaluation of characteristics of semiconductor wafers and devices
JP2017071705A (en) * 2015-10-08 2017-04-13 日本化薬株式会社 Epoxy resin mixture, epoxy resin composition and cured product thereof

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