JPS64795A - Multilayer printed-interconnection board - Google Patents

Multilayer printed-interconnection board

Info

Publication number
JPS64795A
JPS64795A JP1171887A JP1171887A JPS64795A JP S64795 A JPS64795 A JP S64795A JP 1171887 A JP1171887 A JP 1171887A JP 1171887 A JP1171887 A JP 1171887A JP S64795 A JPS64795 A JP S64795A
Authority
JP
Japan
Prior art keywords
inner layer
pattern
connecting patterns
missing parts
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1171887A
Other languages
Japanese (ja)
Other versions
JPH01795A (en
JPH0519319B2 (en
Inventor
Yoshiyasu Nishikawa
Hajime Hosokawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP1171887A priority Critical patent/JPS64795A/en
Publication of JPH01795A publication Critical patent/JPH01795A/en
Publication of JPS64795A publication Critical patent/JPS64795A/en
Publication of JPH0519319B2 publication Critical patent/JPH0519319B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

PURPOSE: To improve the tight adhesiveness of a prepreg to an inner layer land part and connecting patterns by a method wherein pattern missing parts are provided around the connection part between an inner layer pattern and a via-hole and pattern removed parts are provided on the inner layer pattern outside the connecting patterns provided between the pattern missing parts.
CONSTITUTION: Pattern missing parts 3 are formed around the connection part 8 between an inner layer pattern 5 and a via-hole 2 and connecting patterns 6 which connect an inner layer land part 7 to the inner layer pattern 5 electrically are formed with the pattern missing parts 3. Further, pattern removed parts 4 which are separated from the pattern missing parts 3 and the connecting patterns 6 are formed on the inner layer pattern 5 outside the connecting patterns 6. With this constitution, the tight adhesiveness of a prepreg to the inner layer land 7 and the connecting patterns 6 can be improved. Moreover, the peeling-off of an outer layer substrate 10 formed by curing the prepreg from the inner layer land 7 and the connecting patterns 6 can be avoided and haloing in the inner layer land 7 and the connecting patterns 6 can be suppressed.
COPYRIGHT: (C)1989,JPO&Japio
JP1171887A 1987-01-20 1987-01-20 Multilayer printed-interconnection board Granted JPS64795A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1171887A JPS64795A (en) 1987-01-20 1987-01-20 Multilayer printed-interconnection board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1171887A JPS64795A (en) 1987-01-20 1987-01-20 Multilayer printed-interconnection board

Publications (3)

Publication Number Publication Date
JPH01795A JPH01795A (en) 1989-01-05
JPS64795A true JPS64795A (en) 1989-01-05
JPH0519319B2 JPH0519319B2 (en) 1993-03-16

Family

ID=11785822

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1171887A Granted JPS64795A (en) 1987-01-20 1987-01-20 Multilayer printed-interconnection board

Country Status (1)

Country Link
JP (1) JPS64795A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH044577A (en) * 1990-04-20 1992-01-09 Nec Kansai Ltd Airtight terminal and its manufacture
EP0817548A4 (en) * 1996-01-11 1999-12-01 Ibiden Co Ltd Printed wiring board and method for manufacturing the same
JP2005323288A (en) * 2004-05-11 2005-11-17 Hosiden Corp Digital microphone
JP2007250697A (en) * 2006-03-14 2007-09-27 Nec Corp Wiring board with thermal land and electronic equipment provided therewith

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59146986U (en) * 1983-03-22 1984-10-01 日本電気株式会社 multilayer printed board
JPS60121674U (en) * 1984-01-26 1985-08-16 株式会社明電舎 Printed board
JPS6157565U (en) * 1984-09-18 1986-04-17

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59146986U (en) * 1983-03-22 1984-10-01 日本電気株式会社 multilayer printed board
JPS60121674U (en) * 1984-01-26 1985-08-16 株式会社明電舎 Printed board
JPS6157565U (en) * 1984-09-18 1986-04-17

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH044577A (en) * 1990-04-20 1992-01-09 Nec Kansai Ltd Airtight terminal and its manufacture
EP0817548A4 (en) * 1996-01-11 1999-12-01 Ibiden Co Ltd Printed wiring board and method for manufacturing the same
US6316738B1 (en) 1996-01-11 2001-11-13 Ibiden Co., Ltd. Printed wiring board and manufacturing method thereof
US6342682B1 (en) 1996-01-11 2002-01-29 Ibiden Co., Ltd. Printed wiring board and manufacturing method thereof
KR100485628B1 (en) * 1996-01-11 2005-09-14 이비덴 가부시키가이샤 Printed wiring board and its manufacturing method
EP1677582A3 (en) * 1996-01-11 2007-04-11 Ibiden Co., Ltd. Printed wiring board and manufacturing method thereof
JP2005323288A (en) * 2004-05-11 2005-11-17 Hosiden Corp Digital microphone
JP2007250697A (en) * 2006-03-14 2007-09-27 Nec Corp Wiring board with thermal land and electronic equipment provided therewith

Also Published As

Publication number Publication date
JPH0519319B2 (en) 1993-03-16

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