JPS6480055A - Resin sealed semiconductor device - Google Patents

Resin sealed semiconductor device

Info

Publication number
JPS6480055A
JPS6480055A JP62234947A JP23494787A JPS6480055A JP S6480055 A JPS6480055 A JP S6480055A JP 62234947 A JP62234947 A JP 62234947A JP 23494787 A JP23494787 A JP 23494787A JP S6480055 A JPS6480055 A JP S6480055A
Authority
JP
Japan
Prior art keywords
island
pellet
pins
base
come
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62234947A
Other languages
Japanese (ja)
Inventor
Atsushi Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62234947A priority Critical patent/JPS6480055A/en
Publication of JPS6480055A publication Critical patent/JPS6480055A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To improve a moisture resistance of a semiconductor pellet, by making an island smaller than the base of the semiconductor pellet and making its island come into contact with the center part at the inside of each edge part in all sides of the pellet. CONSTITUTION:An island 11 has a rectangular form and two pins 13 for suspending the island extend in opposite directions from both edge parts of the island. The island 11 has an area which is smaller than the base area of the pellet 2. The base center of the pellet 2 is fixed to the island 11 after bonding it on to the island. The edge parts 4 of the pellet come into contact neither with the island 11 nor with the above pins 13, by which the island 11 is supported. Thus, even though moisture and the like enter into the island through the pins 13, it is required for them to move a long distance so as to reach a diffused plane 5 on the upper face of the pellet 2 and then, they find difficulty in reaching the diffused plane 5. In this way, such a structure improves a moisture resistance of the pellet 2.
JP62234947A 1987-09-21 1987-09-21 Resin sealed semiconductor device Pending JPS6480055A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62234947A JPS6480055A (en) 1987-09-21 1987-09-21 Resin sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62234947A JPS6480055A (en) 1987-09-21 1987-09-21 Resin sealed semiconductor device

Publications (1)

Publication Number Publication Date
JPS6480055A true JPS6480055A (en) 1989-03-24

Family

ID=16978754

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62234947A Pending JPS6480055A (en) 1987-09-21 1987-09-21 Resin sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS6480055A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0332048A (en) * 1989-06-29 1991-02-12 Seiko Epson Corp Semiconductor device
DE4041346A1 (en) * 1990-12-21 1992-06-25 Siemens Ag Plastic housing containing encapsulated semiconductor chips - has chips protruding on all sides beyond metal islands below
JPH05211271A (en) * 1992-01-30 1993-08-20 Nec Corp Semiconductor device
EP0582084A3 (en) * 1992-08-06 1994-07-27 Motorola Inc Semiconductor leadframe and package
US5724726A (en) * 1992-06-05 1998-03-10 Mitsubishi Denki Kabushiki Kaisha Method of making leadframe for lead-on-chip (LOC) semiconductor device
US5942794A (en) * 1996-10-22 1999-08-24 Matsushita Electronics Corporation Plastic encapsulated semiconductor device and method of manufacturing the same
US6101101A (en) * 1998-05-28 2000-08-08 Sampo Semiconductor Corporation Universal leadframe for semiconductor devices

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0332048A (en) * 1989-06-29 1991-02-12 Seiko Epson Corp Semiconductor device
DE4041346A1 (en) * 1990-12-21 1992-06-25 Siemens Ag Plastic housing containing encapsulated semiconductor chips - has chips protruding on all sides beyond metal islands below
DE4041346B4 (en) * 1990-12-21 2005-10-06 Infineon Technologies Ag Standard plastic housing with encapsulated semiconductor chips
JPH05211271A (en) * 1992-01-30 1993-08-20 Nec Corp Semiconductor device
US5724726A (en) * 1992-06-05 1998-03-10 Mitsubishi Denki Kabushiki Kaisha Method of making leadframe for lead-on-chip (LOC) semiconductor device
US5900582A (en) * 1992-06-05 1999-05-04 Mitsubishi Denki Kabushiki Kaisha Lead frame including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the lead frame
EP0582084A3 (en) * 1992-08-06 1994-07-27 Motorola Inc Semiconductor leadframe and package
US5942794A (en) * 1996-10-22 1999-08-24 Matsushita Electronics Corporation Plastic encapsulated semiconductor device and method of manufacturing the same
US6130115A (en) * 1996-10-22 2000-10-10 Matsushita Electronics Corporation Plastic encapsulated semiconductor device and method of manufacturing the same
US6101101A (en) * 1998-05-28 2000-08-08 Sampo Semiconductor Corporation Universal leadframe for semiconductor devices

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