KR20020026080A - 필름부착방법 - Google Patents
필름부착방법 Download PDFInfo
- Publication number
- KR20020026080A KR20020026080A KR1020000057695A KR20000057695A KR20020026080A KR 20020026080 A KR20020026080 A KR 20020026080A KR 1020000057695 A KR1020000057695 A KR 1020000057695A KR 20000057695 A KR20000057695 A KR 20000057695A KR 20020026080 A KR20020026080 A KR 20020026080A
- Authority
- KR
- South Korea
- Prior art keywords
- film
- substrate
- attaching
- tip
- supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000000034 method Methods 0.000 title claims abstract description 7
- 239000000758 substrate Substances 0.000 claims abstract description 84
- 238000005520 cutting process Methods 0.000 claims abstract description 27
- 238000003825 pressing Methods 0.000 claims abstract description 22
- 238000001179 sorption measurement Methods 0.000 claims abstract description 5
- 239000010408 film Substances 0.000 description 167
- 238000004804 winding Methods 0.000 description 20
- 239000005001 laminate film Substances 0.000 description 15
- 239000011347 resin Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 238000001514 detection method Methods 0.000 description 6
- 238000012546 transfer Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- 230000037303 wrinkles Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D5/02—Means for moving the cutting member into its operative position for cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
- B32B37/0053—Constructional details of laminating machines comprising rollers; Constructional features of the rollers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
Description
Claims (1)
- 기판의 필름부착면에 기판의 길이에 대응하는 필름을 압착롤러로 부착하는 필름부착방법에 있어서, 초회의 부착용 연속필름의 선단측을 필름공급방향에 대해서 직각으로 절단하는 단계와, 상기 연속필름의 선단을 필름공급부재의 선단에 설치해서 흡착시키는 단계와, 필름부착위치에 반송된 기판 반송방향의 선단부의 필름부착면측에 상기한 필름공급부재를 근접시켜서 연속필름의 선단을 공급하는 단계와, 이 연속필름의 선단을 필름부착위치에 부착시키는 단계와, 상기한 필름공급부재의 흡착을 해제해서 상기한 기판의 필름부착면측으로부터 그 부재를 이반시킴과 동시에, 압착롤러로 상기한 필름을 공급하면서 필름의 선단으로부터 기판에 순차 압착시키는 단계와, 필름의 공급속도와 상기한 필름공급부재의 이동속도를 동기시키면서 공급필름을 흡착시키는 단계와, 상기한 연속필름의 공급방향의 후단측을 기판 반송방향의 길이에 대응시켜서 그 공급필름을 느슨해지게 하는 일이 없이 회전절단기로 필름공급방향에 대해서 직각으로 절단하는 단계와, 이 절단된 필름의 공급방향의 후단측을 상기한 압착롤러로 기판 반송방향의 후단측의 필름부착면에 부착하는 단계를 구비한 것을 특징으로 하는 필름부착방법.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020000057695A KR20020026080A (ko) | 2000-09-30 | 2000-09-30 | 필름부착방법 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020000057695A KR20020026080A (ko) | 2000-09-30 | 2000-09-30 | 필름부착방법 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20020026080A true KR20020026080A (ko) | 2002-04-06 |
Family
ID=37479456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020000057695A Ceased KR20020026080A (ko) | 2000-09-30 | 2000-09-30 | 필름부착방법 |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR20020026080A (ko) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4338152A (en) * | 1981-02-17 | 1982-07-06 | E. I. Du Pont De Nemours And Company | Gripping arrangement for an apparatus for automatically laminating circuit boards |
| KR850000166A (ko) * | 1983-05-11 | 1985-02-25 | 다까야마 시게오 | 필름판을 파넬표면에 접착하는 방법과 그 접착작업을 위한 전층기 |
| JPH07154054A (ja) * | 1992-09-24 | 1995-06-16 | Hakuto Co Ltd | ラミネータ |
| KR19980065044A (ko) * | 1998-06-19 | 1998-10-07 | 정도화 | 플렉시블 볼그리드어레이 회로기판의 제조장치 |
| KR19980074195A (ko) * | 1997-03-21 | 1998-11-05 | 안민혁 | 회로기판용 라미네이팅기 |
| KR20020018813A (ko) * | 2000-09-04 | 2002-03-09 | 안민혁 | 인쇄회로기판의 라미네이팅 방법 및 그 장치 |
-
2000
- 2000-09-30 KR KR1020000057695A patent/KR20020026080A/ko not_active Ceased
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4338152A (en) * | 1981-02-17 | 1982-07-06 | E. I. Du Pont De Nemours And Company | Gripping arrangement for an apparatus for automatically laminating circuit boards |
| KR850000166A (ko) * | 1983-05-11 | 1985-02-25 | 다까야마 시게오 | 필름판을 파넬표면에 접착하는 방법과 그 접착작업을 위한 전층기 |
| JPH07154054A (ja) * | 1992-09-24 | 1995-06-16 | Hakuto Co Ltd | ラミネータ |
| KR19980074195A (ko) * | 1997-03-21 | 1998-11-05 | 안민혁 | 회로기판용 라미네이팅기 |
| KR19980065044A (ko) * | 1998-06-19 | 1998-10-07 | 정도화 | 플렉시블 볼그리드어레이 회로기판의 제조장치 |
| KR20020018813A (ko) * | 2000-09-04 | 2002-03-09 | 안민혁 | 인쇄회로기판의 라미네이팅 방법 및 그 장치 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20000930 |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20021111 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 20000930 Comment text: Patent Application |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20041027 Patent event code: PE09021S01D |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 20050419 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20041027 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |