KR20200028488A - 실리콘-무함유 열 겔 - Google Patents
실리콘-무함유 열 겔 Download PDFInfo
- Publication number
- KR20200028488A KR20200028488A KR1020207006299A KR20207006299A KR20200028488A KR 20200028488 A KR20200028488 A KR 20200028488A KR 1020207006299 A KR1020207006299 A KR 1020207006299A KR 20207006299 A KR20207006299 A KR 20207006299A KR 20200028488 A KR20200028488 A KR 20200028488A
- Authority
- KR
- South Korea
- Prior art keywords
- thermal gel
- amount
- weight
- thermally conductive
- total weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/02—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques
- C08J3/03—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in aqueous media
- C08J3/075—Macromolecular gels
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/26—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds
- C08G65/2603—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing oxygen
- C08G65/2606—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing oxygen containing hydroxyl groups
- C08G65/2609—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing oxygen containing hydroxyl groups containing aliphatic hydroxyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/26—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds
- C08G65/2642—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds characterised by the catalyst used
- C08G65/2669—Non-metals or compounds thereof
- C08G65/2678—Sulfur or compounds thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/48—Polymers modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/005—Stabilisers against oxidation, heat, light, ozone
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
- C08L61/26—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds
- C08L61/28—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds with melamine
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/02—Polyalkylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2312/00—Crosslinking
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- General Chemical & Material Sciences (AREA)
Abstract
Description
도 1은 실리콘-무함유 열 겔의 제조 방법에 관한 흐름도이고;
도 2는 예 1과 관련되며, 열 사이클링 시험을 거친 후의 샘플을 나타내고;
도 3은 예 2와 관련되며, 베이킹 시험을 거친 후의 샘플을 나타내고;
도 4는 예 2와 관련되며, 열 사이클링 시험을 거친 후의 샘플을 나타내고;
도 5는 예 5 내지 예 7과 관련되며, 열 사이클링 시험을 거친 후의 샘플을 나타내고;
도 6은 예 5 내지 예 7과 관련되며, 베이킹 시험을 거친 후의 샘플을 나타내고;
도 7은 샘플의 분배 속도를 측정하기 위해 예 5 내지 예 7과 함께 사용되는 분배 기구를 예시하고;
도 8은 본 발명에 따른 열 겔의 제조 방법을 예시하는 흐름도이고;
도 9는 본 발명의 열 겔과 함께 사용되는 분배기의 사시도이다.
상응하는 도면 부호는 몇몇 도면 전체에 걸쳐 상응하는 부분을 나타낸다. 본 명세서에 기술된 예시는 본 발명의 예시적인 실시 형태를 예시하며, 그러한 예시는 어떠한 방식으로든 본 발명의 범주를 제한하는 것으로 해석되어서는 안 된다.
Claims (19)
- 열 겔(thermal gel)로서,
상기 열 겔의 총 중량을 기준으로 1 중량% 내지 10 중량%의 양으로 존재하는 적어도 하나의 폴리에테르 폴리올을 포함하는 매트릭스;
상기 열 겔의 총 중량을 기준으로 0.3 중량% 내지 0.6 중량%의 양으로 존재하는 촉매;
상기 열 겔의 총 중량을 기준으로 0.01 중량% 내지 10 중량%의 양으로 존재하는, 복수의 반응성 아민 기를 포함하는 가교결합제;
상기 열 겔의 총 중량을 기준으로 0.1 중량% 내지 5 중량%의 양으로 존재하는 커플링제; 및
상기 열 겔의 총 중량을 기준으로 80 중량% 내지 98 중량%의 양으로 존재하는 적어도 하나의 열 전도성 충전제
를 포함하는, 열 겔. - 제1항에 있어서,
상기 열 겔의 총 중량을 기준으로 0.2 중량% 내지 0.4 중량%의 양으로 존재하는 산화방지제를 추가로 포함하는, 열 겔. - 제1항에 있어서, 상기 열 겔은 상기 열 겔의 총 중량을 기준으로 1 중량% 미만의 양의 실리콘계 성분들을 포함하는, 열 겔.
- 제1항에 있어서, 상기 열 겔은 경화 온도가 150℃ 미만인, 열 겔.
- 제1항에 있어서, 상기 폴리올은 폴리에테르 폴리올이고, 상기 폴리에테르 폴리올은 분자량이 200 내지 10000 달톤인 바이-올 중합체인, 열 겔.
- 제5항에 있어서, 상기 적어도 하나의 폴리에테르 폴리올은 상기 열 겔의 총 중량을 기준으로 5 중량% 내지 10 중량%의 양으로 존재하는, 열 겔.
- 제1항에 있어서, 상기 가교결합제는 알킬화 멜라민 포름알데하이드 수지인, 열 겔.
- 제2항에 있어서, 상기 촉매는 아민 중화된 벤젠 설폰산, 아민 중화된 다이노닐나프탈렌 다이설폰산 또는 아민 중화된 다이노닐나프탈렌설폰산 또는 다른 유형의 열 산 발생제를 포함하는, 열 겔.
- 제2항에 있어서, 상기 산화방지제는 페놀-유형 산화방지제, 아민-유형 산화방지제, 또는 입체 장애 황 함유 페놀계 산화방지제로 이루어진 군으로부터 선택되는 적어도 하나의 산화방지제를 포함하는, 열 겔.
- 제1항에 있어서,
상기 적어도 하나의 열 전도성 충전제는 제1 열 전도성 충전제 및 제2 열 전도성 충전제를 포함하고;
상기 제1 열 전도성 충전제는 상기 열 겔의 총 중량을 기준으로 35 중량% 내지 50 중량%의 양으로 존재하고;
상기 제2 열 전도성 충전제는 상기 열 겔의 총 중량을 기준으로 15 중량% 내지 25 중량%의 양으로 존재하고;
제3 열 전도성 충전제는 상기 열 겔의 총 중량을 기준으로 15 중량% 내지 25 중량%의 양으로 존재하는, 열 겔. - 열 겔의 제조 방법으로서,
적어도 하나의 폴리에테르 폴리올, 적어도 하나의 커플링제, 적어도 하나의 산화방지제, 및 적어도 하나의 가교결합제를 반응 용기에 첨가하여 혼합물을 형성하는 단계로서,
상기 적어도 하나의 폴리에테르 폴리올은 상기 열 겔의 총 중량을 기준으로 1 중량% 내지 10 중량%의 양으로 존재하고;
상기 적어도 하나의 가교결합제는 복수의 반응성 아민 기를 포함하며, 상기 가교결합제는 상기 열 겔의 총 중량을 기준으로 0.5 중량% 내지 2 중량%의 양으로 존재하고;
상기 적어도 하나의 커플링제는 상기 열 겔의 총 중량을 기준으로 0.1 중량% 내지 5 중량%의 양으로 존재하는, 상기 단계;
상기 반응 용기에 촉매를 첨가하는 단계로서, 상기 촉매는 상기 열 겔의 총 중량을 기준으로 0.3 중량% 내지 0.6 중량%의 양으로 존재하는, 상기 단계;
상기 혼합물을 교반하는 단계;
상기 반응 용기에 적어도 하나의 열 전도성 충전제를 첨가하는 단계로서, 상기 적어도 하나의 열 전도성 충전제는 상기 열 겔의 총 중량을 기준으로 80 중량% 내지 98 중량%의 양으로 존재하는, 상기 단계; 및
상기 혼합물을 실온으로 냉각시키는 단계
를 포함하는, 방법. - 제11항에 있어서, 상기 적어도 하나의 산화방지제는 상기 열 겔의 총 중량을 기준으로 0.2 중량% 내지 0.4 중량%의 양으로 존재하는, 방법.
- 제11항에 있어서, 상기 열 겔은 1 중량% 미만의 양의 실리콘 함유 성분들을 포함하는, 방법.
- 제11항에 있어서, 상기 폴리올은 폴리에테르 폴리올이고, 상기 폴리에테르 폴리올은 분자량이 200 내지 10000 달톤인 바이-올 중합체인, 방법.
- 제14항에 있어서, 상기 적어도 하나의 폴리에테르 폴리올은 상기 열 겔의 총 중량을 기준으로 5 중량% 내지 10 중량%의 양으로 존재하는, 방법.
- 제11항에 있어서, 상기 가교결합제는 알킬화 멜라민 포름알데하이드 수지인, 방법.
- 제14항에 있어서, 상기 산화방지제는 페놀-유형 산화방지제, 아민-유형 산화방지제, 또는 입체 장애 황 함유 페놀계 산화방지제로 이루어진 군으로부터 선택되는 적어도 하나의 산화방지제를 포함하는, 방법.
- 제11항에 있어서, 상기 촉매는 아민 중화된 벤젠 설폰산, 아민 중화된 다이노닐나프탈렌 다이설폰산 또는 아민 중화된 다이노닐나프탈렌설폰산 또는 다른 유형의 열 산 발생제를 포함하는, 방법.
- 제11 항에 있어서,
상기 적어도 하나의 열 전도성 충전제는 제1 열 전도성 충전제, 제2 열 전도성 충전제, 및 제3 전도성 충전제를 포함하고;
상기 제1 열 전도성 충전제는 상기 열 겔의 총 중량을 기준으로 35 중량% 내지 50 중량%의 양으로 존재하고;
상기 제2 열 전도성 충전제는 상기 열 겔의 총 중량을 기준으로 15 중량% 내지 25 중량%의 양으로 존재하고;
상기 제3 열 전도성 충전제는 상기 열 겔의 총 중량을 기준으로 15 중량% 내지 25 중량%의 양으로 존재하는, 방법.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020227012192A KR102487816B1 (ko) | 2017-09-08 | 2018-08-31 | 실리콘-무함유 열 겔 |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762555954P | 2017-09-08 | 2017-09-08 | |
| US62/555,954 | 2017-09-08 | ||
| US16/105,456 US11041103B2 (en) | 2017-09-08 | 2018-08-20 | Silicone-free thermal gel |
| US16/105,456 | 2018-08-20 | ||
| PCT/US2018/049218 WO2019050806A1 (en) | 2017-09-08 | 2018-08-31 | THERMAL GEL WITHOUT SILICONE |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020227012192A Division KR102487816B1 (ko) | 2017-09-08 | 2018-08-31 | 실리콘-무함유 열 겔 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20200028488A true KR20200028488A (ko) | 2020-03-16 |
| KR102388580B1 KR102388580B1 (ko) | 2022-04-20 |
Family
ID=65630662
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020227012192A Active KR102487816B1 (ko) | 2017-09-08 | 2018-08-31 | 실리콘-무함유 열 겔 |
| KR1020207006299A Active KR102388580B1 (ko) | 2017-09-08 | 2018-08-31 | 실리콘-무함유 열 겔 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020227012192A Active KR102487816B1 (ko) | 2017-09-08 | 2018-08-31 | 실리콘-무함유 열 겔 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11041103B2 (ko) |
| EP (1) | EP3679087B1 (ko) |
| JP (1) | JP6902163B2 (ko) |
| KR (2) | KR102487816B1 (ko) |
| CN (1) | CN111051392B (ko) |
| TW (1) | TWI780220B (ko) |
| WO (1) | WO2019050806A1 (ko) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3426746B1 (en) | 2016-03-08 | 2021-07-14 | Honeywell International Inc. | Phase change material |
| US10501671B2 (en) | 2016-07-26 | 2019-12-10 | Honeywell International Inc. | Gel-type thermal interface material |
| JP6973875B2 (ja) * | 2017-08-22 | 2021-12-01 | エルジー・ケム・リミテッド | 放熱素材の混合方法 |
| US10428256B2 (en) | 2017-10-23 | 2019-10-01 | Honeywell International Inc. | Releasable thermal gel |
| US11072706B2 (en) | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
| US11373921B2 (en) | 2019-04-23 | 2022-06-28 | Honeywell International Inc. | Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing |
| KR20220119031A (ko) * | 2019-12-19 | 2022-08-26 | 헨켈 아게 운트 코. 카게아아 | 반응성 희석제를 갖는 실리콘 무함유 열 계면 물질 |
| CN111777993B (zh) * | 2020-07-14 | 2022-03-25 | 深圳陆祥科技股份有限公司 | 一种无硅导热膏及其制备方法 |
| US20230051813A1 (en) * | 2021-08-11 | 2023-02-16 | Ford Global Technologies, Llc | Graphene/carbon nanostructure heating element |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040002866A (ko) * | 2001-05-30 | 2004-01-07 | 허니웰 인터내셔날 인코포레이티드 | 인터페이스 재료 및 인터페이스 재료의 생산과 사용방법 |
| US20040097635A1 (en) * | 2002-11-14 | 2004-05-20 | Shoushan Fan | Thermal interface material and method for making same |
Family Cites Families (397)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1655133A (en) | 1926-11-09 | 1928-01-03 | Charles A Clase | Inside micrometer gauge |
| US2451600A (en) | 1945-02-03 | 1948-10-19 | Atlantic Refining Co | Tube gauge |
| US2810203A (en) | 1954-08-06 | 1957-10-22 | Sun Oil Co | Tube calipering device |
| GB989845A (en) | 1963-05-03 | 1965-04-22 | Polymer Corp | Improved butyl rubber-polyolefine blends |
| US4006530A (en) | 1974-04-09 | 1977-02-08 | Schlumberger Technology Corporation | Apparatus for measuring the diameter of a well bore |
| JPS5314131A (en) | 1975-05-02 | 1978-02-08 | Nobuyasu Doi | Luster tinnlead alloy electroplating method |
| CH588683A5 (ko) | 1975-07-28 | 1977-06-15 | Concast Ag | |
| US4180498A (en) | 1976-07-30 | 1979-12-25 | Ciba-Geigy Corporation | Hindered phenyl phosphites |
| CH630174A5 (de) | 1978-04-05 | 1982-05-28 | Hans Meyer | Innenmessgeraet. |
| DE2933870A1 (de) | 1979-08-21 | 1981-03-12 | Siemens AG, 1000 Berlin und 8000 München | N.n'-bis-salicyloyl-hydrazin als metalldesaktivator. |
| FR2518738B1 (fr) | 1981-12-23 | 1985-10-18 | Flopetrol Etu Fabrications | Dispositif pour la mesure de dimensions internes d'un tube, notamment dans un puits et procede de mesure de deplacement applicable a un tel dispositif |
| IT1157405B (it) | 1982-01-15 | 1987-02-11 | Finike Italiana Marposs | Comparatore per il controllo delle dimensioni lineari di pezzi meccanici |
| JPS5967387A (ja) | 1982-10-08 | 1984-04-17 | Hiyougoken | すず、鉛及びすず―鉛合金メッキ浴 |
| US4565610A (en) | 1983-12-22 | 1986-01-21 | Learonal, Inc. | Bath and process for plating lead and lead/tin alloys |
| US4604424A (en) | 1986-01-29 | 1986-08-05 | Dow Corning Corporation | Thermally conductive polyorganosiloxane elastomer composition |
| AU7395887A (en) | 1986-04-23 | 1987-11-24 | Battelle Development Corporation | Chromatographic apparatus and process |
| FR2607431B1 (fr) | 1986-12-02 | 1989-03-10 | Clextral | Procede et installation de montage et demontage des vis d'une machine d'extrusion |
| US4832781A (en) | 1988-01-07 | 1989-05-23 | Varian Associates, Inc. | Methods and apparatus for thermal transfer with a semiconductor wafer in vacuum |
| US4816086A (en) | 1988-04-25 | 1989-03-28 | Armstrong World Industries, Inc. | Compositions useful in copper oxidation, and a method to prepare copper oxidation solutions |
| US4910050A (en) | 1988-08-04 | 1990-03-20 | Hughes Aircraft Company | Method and composition for providing electrostatic discharge protection for spacecraft |
| JP2611364B2 (ja) | 1988-08-26 | 1997-05-21 | 上村工業株式会社 | 無電解錫めっき浴及び無電解錫めっき方法 |
| DE59005446D1 (de) | 1989-12-18 | 1994-05-26 | Riedel De Haen Ag | Verfahren und Vorrichtung zur Herstellung einer Lösung eines Buntmetallsulfonats. |
| JP2745438B2 (ja) | 1990-07-13 | 1998-04-28 | 株式会社荏原製作所 | 加熱用伝熱材料及び発熱体とそれを用いた加熱装置 |
| US5403580A (en) | 1991-01-22 | 1995-04-04 | Dow Corning Corporation | Organosilicon gels and method of making |
| US5167851A (en) | 1991-04-22 | 1992-12-01 | Thermoset Plastics, Inc. | Hydrophilic thermally conductive grease |
| US5084099A (en) | 1991-06-17 | 1992-01-28 | Tektronix, Inc. | Phase change ink colorants and phase change inks produced therefrom |
| US5294923A (en) | 1992-01-31 | 1994-03-15 | Baker Hughes Incorporated | Method and apparatus for relaying downhole data to the surface |
| JP3256587B2 (ja) | 1992-02-21 | 2002-02-12 | 株式会社東芝 | 高熱伝導性放熱体およびその製造方法 |
| JP3175979B2 (ja) | 1992-09-14 | 2001-06-11 | 株式会社東芝 | 樹脂封止型半導体装置 |
| US6197859B1 (en) | 1993-06-14 | 2001-03-06 | The Bergquist Company | Thermally conductive interface pads for electronic devices |
| EP0661916B1 (en) | 1993-07-06 | 2000-05-17 | Kabushiki Kaisha Toshiba | Thermal conductivity sheet |
| US6090484A (en) | 1995-05-19 | 2000-07-18 | The Bergquist Company | Thermally conductive filled polymer composites for mounting electronic devices and method of application |
| US5562814A (en) | 1995-09-01 | 1996-10-08 | Dale Electronics, Inc. | Sludge-limiting tin and/or lead electroplating bath |
| EP0876427B1 (en) | 1996-01-22 | 2002-09-25 | The Dow Chemical Company | Polyolefin elastomer blends exhibiting improved properties |
| US6054198A (en) | 1996-04-29 | 2000-04-25 | Parker-Hannifin Corporation | Conformal thermal interface material for electronic components |
| US5950066A (en) | 1996-06-14 | 1999-09-07 | The Bergquist Company | Semisolid thermal interface with low flow resistance |
| US5738936A (en) | 1996-06-27 | 1998-04-14 | W. L. Gore & Associates, Inc. | Thermally conductive polytetrafluoroethylene article |
| US5930115A (en) | 1996-08-26 | 1999-07-27 | Compaq Computer Corp. | Apparatus, method and system for thermal management of a semiconductor device |
| US5816699A (en) | 1997-06-13 | 1998-10-06 | Entek Manufacturing Inc. | Twin screw extruder barrel with an easily removable seamless insert having a wear and corrosion resistant lining |
| JP3662715B2 (ja) | 1997-06-16 | 2005-06-22 | アルプス電気株式会社 | 導電性材料および導電ペーストと電子機器 |
| JP4015722B2 (ja) | 1997-06-20 | 2007-11-28 | 東レ・ダウコーニング株式会社 | 熱伝導性ポリマー組成物 |
| US6432497B2 (en) | 1997-07-28 | 2002-08-13 | Parker-Hannifin Corporation | Double-side thermally conductive adhesive tape for plastic-packaged electronic components |
| US6096414A (en) | 1997-11-25 | 2000-08-01 | Parker-Hannifin Corporation | High dielectric strength thermal interface material |
| FR2775481B1 (fr) | 1998-02-27 | 2003-10-24 | Rhodia Chimie Sa | Composition silicone adhesive reticulable et utilisation de cette composition pour le collage de substrats divers |
| JP3948642B2 (ja) | 1998-08-21 | 2007-07-25 | 信越化学工業株式会社 | 熱伝導性グリース組成物及びそれを使用した半導体装置 |
| US6432320B1 (en) | 1998-11-02 | 2002-08-13 | Patrick Bonsignore | Refrigerant and heat transfer fluid additive |
| US20040069454A1 (en) | 1998-11-02 | 2004-04-15 | Bonsignore Patrick V. | Composition for enhancing thermal conductivity of a heat transfer medium and method of use thereof |
| JP2000143808A (ja) | 1998-11-17 | 2000-05-26 | Fuji Kobunshi Kogyo Kk | 熱伝導性・電気絶縁性シリコーンゲル組成物 |
| US6299721B1 (en) | 1998-12-14 | 2001-10-09 | Gould Electronics Incl | Coatings for improved resin dust resistance |
| WO2000036893A2 (en) | 1998-12-15 | 2000-06-22 | Parker-Hannifin Corporation | Method of applying a phase change thermal interface material |
| US6238596B1 (en) | 1999-03-09 | 2001-05-29 | Johnson Matthey Electronics, Inc. | Compliant and crosslinkable thermal interface materials |
| US6165612A (en) | 1999-05-14 | 2000-12-26 | The Bergquist Company | Thermally conductive interface layers |
| US6391442B1 (en) | 1999-07-08 | 2002-05-21 | Saint-Gobain Performance Plastics Corporation | Phase change thermal interface material |
| US20070241303A1 (en) | 1999-08-31 | 2007-10-18 | General Electric Company | Thermally conductive composition and method for preparing the same |
| US6706219B2 (en) | 1999-09-17 | 2004-03-16 | Honeywell International Inc. | Interface materials and methods of production and use thereof |
| US6605238B2 (en) | 1999-09-17 | 2003-08-12 | Honeywell International Inc. | Compliant and crosslinkable thermal interface materials |
| US6975944B1 (en) | 1999-09-28 | 2005-12-13 | Alpha Mos | Method and apparatus for monitoring materials used in electronics |
| US6496373B1 (en) | 1999-11-04 | 2002-12-17 | Amerasia International Technology, Inc. | Compressible thermally-conductive interface |
| US6395811B1 (en) | 1999-11-11 | 2002-05-28 | 3D Systems, Inc. | Phase change solid imaging material |
| JP2001139818A (ja) | 1999-11-12 | 2001-05-22 | Dow Corning Toray Silicone Co Ltd | 熱伝導性シリコーンゴム組成物 |
| US6797382B2 (en) * | 1999-12-01 | 2004-09-28 | Honeywell International Inc. | Thermal interface materials |
| US6451422B1 (en) | 1999-12-01 | 2002-09-17 | Johnson Matthey, Inc. | Thermal interface materials |
| US6673434B2 (en) | 1999-12-01 | 2004-01-06 | Honeywell International, Inc. | Thermal interface materials |
| DE19959262A1 (de) | 1999-12-09 | 2001-06-21 | Altoflex S A | Leitfähiges pastöses Material und dessen Verwendung |
| US7369411B2 (en) | 2000-02-25 | 2008-05-06 | Thermagon, Inc. | Thermal interface assembly and method for forming a thermal interface between a microelectronic component package and heat sink |
| US7078109B2 (en) | 2000-02-25 | 2006-07-18 | Thermagon Inc. | Heat spreading thermal interface structure |
| US6940721B2 (en) | 2000-02-25 | 2005-09-06 | Richard F. Hill | Thermal interface structure for placement between a microelectronic component package and heat sink |
| US6372997B1 (en) | 2000-02-25 | 2002-04-16 | Thermagon, Inc. | Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink |
| US6649325B1 (en) | 2001-05-25 | 2003-11-18 | The Bergquist Company | Thermally conductive dielectric mounts for printed circuitry and semi-conductor devices and method of preparation |
| US6339120B1 (en) | 2000-04-05 | 2002-01-15 | The Bergquist Company | Method of preparing thermally conductive compounds by liquid metal bridged particle clusters |
| US6797758B2 (en) | 2000-04-05 | 2004-09-28 | The Bergquist Company | Morphing fillers and thermal interface materials |
| US6984685B2 (en) | 2000-04-05 | 2006-01-10 | The Bergquist Company | Thermal interface pad utilizing low melting metal with retention matrix |
| US20030207128A1 (en) | 2000-04-10 | 2003-11-06 | Tomoaki Uchiya | Thermally conductive sheet |
| US6400565B1 (en) | 2000-04-21 | 2002-06-04 | Dell Products L.P. | Thermally conductive interface member |
| EP1149864A1 (en) | 2000-04-28 | 2001-10-31 | STMicroelectronics S.r.l. | Polymeric composition for packaging a semiconductor electronic device and packaging obtained therefrom |
| US6616999B1 (en) | 2000-05-17 | 2003-09-09 | Raymond G. Freuler | Preapplicable phase change thermal interface pad |
| US6500891B1 (en) | 2000-05-19 | 2002-12-31 | Loctite Corporation | Low viscosity thermally conductive compositions containing spherical thermally conductive particles |
| CN1444840A (zh) | 2000-05-31 | 2003-09-24 | 霍尼韦尔国际公司 | 填充装置 |
| US6506332B2 (en) | 2000-05-31 | 2003-01-14 | Honeywell International Inc. | Filling method |
| GB0014622D0 (en) | 2000-06-16 | 2000-08-09 | D C Heat Limited | Clothing or footwear with heating element |
| JP2002003830A (ja) | 2000-06-26 | 2002-01-09 | Denki Kagaku Kogyo Kk | 高熱伝導性組成物とその用途 |
| US6610635B2 (en) | 2000-09-14 | 2003-08-26 | Aos Thermal Compounds | Dry thermal interface material |
| US6475962B1 (en) | 2000-09-14 | 2002-11-05 | Aos Thermal Compounds, Llc | Dry thermal grease |
| US20030151030A1 (en) | 2000-11-22 | 2003-08-14 | Gurin Michael H. | Enhanced conductivity nanocomposites and method of use thereof |
| US20040206941A1 (en) | 2000-11-22 | 2004-10-21 | Gurin Michael H. | Composition for enhancing conductivity of a carrier medium and method of use thereof |
| US6573328B2 (en) | 2001-01-03 | 2003-06-03 | Loctite Corporation | Low temperature, fast curing silicone compositions |
| MXPA03006498A (es) | 2001-01-22 | 2003-10-15 | Parker Hannifin Corp | Entrecara termica de cambio de fase, de liberacion limpia. |
| US20020187364A1 (en) | 2001-03-16 | 2002-12-12 | Shipley Company, L.L.C. | Tin plating |
| US6469379B1 (en) | 2001-03-30 | 2002-10-22 | Intel Corporation | Chain extension for thermal materials |
| US7060747B2 (en) | 2001-03-30 | 2006-06-13 | Intel Corporation | Chain extension for thermal materials |
| US7608324B2 (en) | 2001-05-30 | 2009-10-27 | Honeywell International Inc. | Interface materials and methods of production and use thereof |
| US6818301B2 (en) | 2001-06-01 | 2004-11-16 | Psiloquest Inc. | Thermal management with filled polymeric polishing pads and applications therefor |
| US7038009B2 (en) | 2001-08-31 | 2006-05-02 | Cool Shield, Inc. | Thermally conductive elastomeric pad and method of manufacturing same |
| CN1260399C (zh) | 2001-08-31 | 2006-06-21 | 罗姆和哈斯电子材料有限责任公司 | 电解镀锡溶液和用于电镀的方法 |
| FR2831548B1 (fr) | 2001-10-31 | 2004-01-30 | Rhodia Chimie Sa | Composition silicone adhesive reticulable comprenant comme agent thixotropant un compose a fonction amine cyclique portee par une chaine siloxanique |
| US20030112603A1 (en) | 2001-12-13 | 2003-06-19 | Roesner Arlen L. | Thermal interface |
| US6620515B2 (en) | 2001-12-14 | 2003-09-16 | Dow Corning Corporation | Thermally conductive phase change materials |
| KR100479857B1 (ko) | 2001-12-28 | 2005-03-30 | 제일모직주식회사 | 반도체 패키지용 실리콘 수지 조성물 |
| US6597575B1 (en) | 2002-01-04 | 2003-07-22 | Intel Corporation | Electronic packages having good reliability comprising low modulus thermal interface materials |
| JP3844125B2 (ja) | 2002-01-22 | 2006-11-08 | 信越化学工業株式会社 | 放熱部材、その製造方法及びその敷設方法 |
| DE60229072D1 (de) | 2002-02-06 | 2008-11-06 | Parker Hannifin Corp | Wärmesteuerungsmaterialien mit phasenumwandlungsdispersion |
| US6946190B2 (en) | 2002-02-06 | 2005-09-20 | Parker-Hannifin Corporation | Thermal management materials |
| US6926955B2 (en) | 2002-02-08 | 2005-08-09 | Intel Corporation | Phase change material containing fusible particles as thermally conductive filler |
| US7846778B2 (en) | 2002-02-08 | 2010-12-07 | Intel Corporation | Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly |
| US20040149587A1 (en) | 2002-02-15 | 2004-08-05 | George Hradil | Electroplating solution containing organic acid complexing agent |
| US20030159938A1 (en) | 2002-02-15 | 2003-08-28 | George Hradil | Electroplating solution containing organic acid complexing agent |
| TWI268292B (en) | 2002-03-05 | 2006-12-11 | Shipley Co Llc | Limiting the loss of tin through oxidation in tin or tin alloy electroplating bath solutions |
| US6913686B2 (en) | 2002-12-10 | 2005-07-05 | Advanced Technology Materials, Inc. | Methods for analyzing solder plating solutions |
| US20030171487A1 (en) | 2002-03-11 | 2003-09-11 | Tyco Electronics Corporation | Curable silicone gum thermal interface material |
| US6815486B2 (en) | 2002-04-12 | 2004-11-09 | Dow Corning Corporation | Thermally conductive phase change materials and methods for their preparation and use |
| US7208191B2 (en) | 2002-04-23 | 2007-04-24 | Freedman Philip D | Structure with heat dissipating device and method |
| US20030203181A1 (en) | 2002-04-29 | 2003-10-30 | International Business Machines Corporation | Interstitial material with enhanced thermal conductance for semiconductor device packaging |
| US7147367B2 (en) | 2002-06-11 | 2006-12-12 | Saint-Gobain Performance Plastics Corporation | Thermal interface material with low melting alloy |
| US20030230403A1 (en) | 2002-06-14 | 2003-12-18 | Webb Brent J. | Conductive thermal interface and compound |
| US6791839B2 (en) | 2002-06-25 | 2004-09-14 | Dow Corning Corporation | Thermal interface materials and methods for their preparation and use |
| CN1681648A (zh) | 2002-07-15 | 2005-10-12 | 霍尼韦尔国际公司 | 热互连和界面系统,其制备方法及其应用 |
| JP4016326B2 (ja) | 2002-08-02 | 2007-12-05 | 石原薬品株式会社 | 無電解スズメッキ浴 |
| US6657297B1 (en) | 2002-08-15 | 2003-12-02 | The Bergquist Company | Flexible surface layer film for delivery of highly filled or low cross-linked thermally conductive interface pads |
| US6761932B2 (en) | 2002-08-23 | 2004-07-13 | Basf Corporation | Method to improve adhesion of primers to substrates |
| US7775685B2 (en) | 2003-05-27 | 2010-08-17 | Cree, Inc. | Power surface mount light emitting die package |
| US6908682B2 (en) | 2002-09-12 | 2005-06-21 | 3M Innovative Properties Company | Photocured silicone sealant having improved adhesion to plastic |
| EP1599428A4 (en) | 2002-09-25 | 2007-09-05 | Intertech Group Inc | FIBER-REINFORCED CEMENT MATERIAL |
| US6783692B2 (en) | 2002-10-17 | 2004-08-31 | Dow Corning Corporation | Heat softening thermally conductive compositions and methods for their preparation |
| US7608326B2 (en) | 2002-10-21 | 2009-10-27 | Laird Technologies, Inc. | Thermally conductive EMI shield |
| US6956739B2 (en) | 2002-10-29 | 2005-10-18 | Parker-Hannifin Corporation | High temperature stable thermal interface material |
| FR2848215B1 (fr) | 2002-12-04 | 2006-08-04 | Rhodia Chimie Sa | Composition elastomere silicone, adhesive, monocomposante et reticulable par polyaddition |
| US7326042B2 (en) | 2002-12-24 | 2008-02-05 | Bostik Findley, Inc. | Apparatus for packaging hot melt adhesives using a mold and carrier |
| JP4288469B2 (ja) | 2003-03-12 | 2009-07-01 | 石原薬品株式会社 | 銅侵食防止用の無電解スズメッキ浴、及び銅侵食防止方法 |
| US6924027B2 (en) | 2003-03-31 | 2005-08-02 | Intel Corporation | Phase change thermal interface materials including exfoliated clay |
| EP1616337A2 (en) | 2003-04-02 | 2006-01-18 | Honeywell International, Inc. | Thermal interconnect and interface systems, methods of production and uses thereof |
| US7013965B2 (en) | 2003-04-29 | 2006-03-21 | General Electric Company | Organic matrices containing nanomaterials to enhance bulk thermal conductivity |
| US6901675B2 (en) | 2003-05-27 | 2005-06-07 | Bristol Compressors, Inc. | System and method for sizing a center bore of a laminated rotor |
| US7744991B2 (en) | 2003-05-30 | 2010-06-29 | 3M Innovative Properties Company | Thermally conducting foam interface materials |
| US7229683B2 (en) | 2003-05-30 | 2007-06-12 | 3M Innovative Properties Company | Thermal interface materials and method of making thermal interface materials |
| TWI251320B (en) | 2003-07-04 | 2006-03-11 | Fuji Polymer Ind | Thermal conductive composition, a heat-dissipating putty sheet and heat-dissipating structure using the same |
| JP4337433B2 (ja) | 2003-07-08 | 2009-09-30 | パナソニック株式会社 | プラズマディスプレイパネルのエージング方法およびエージング装置 |
| KR100981571B1 (ko) | 2003-07-26 | 2010-09-10 | 삼성전자주식회사 | 다중 입력 다중 출력 적응 안테나 어레이 방식을 사용하는이동 통신 시스템에서 신호 송수신 시스템 및 방법 |
| US7253523B2 (en) | 2003-07-29 | 2007-08-07 | Intel Corporation | Reworkable thermal interface material |
| US6951182B2 (en) | 2003-07-29 | 2005-10-04 | Onweller Arthur E | Marine Mooring Line Vermin Shield |
| US6985690B2 (en) | 2003-07-31 | 2006-01-10 | Xerox Corporation | Fuser and fixing members containing PEI-PDMS block copolymers |
| US6874573B2 (en) | 2003-07-31 | 2005-04-05 | National Starch And Chemical Investment Holding Corporation | Thermal interface material |
| JP2005060822A (ja) | 2003-08-08 | 2005-03-10 | Rohm & Haas Electronic Materials Llc | 複合基体の電気メッキ |
| CN1580116A (zh) | 2003-08-15 | 2005-02-16 | 台盐实业股份有限公司 | 散热界面材料组成 |
| US8039961B2 (en) | 2003-08-25 | 2011-10-18 | Samsung Electronics Co., Ltd. | Composite carbon nanotube-based structures and methods for removing heat from solid-state devices |
| US20050049350A1 (en) | 2003-08-25 | 2005-03-03 | Sandeep Tonapi | Thin bond-line silicone adhesive composition and method for preparing the same |
| US7550097B2 (en) | 2003-09-03 | 2009-06-23 | Momentive Performance Materials, Inc. | Thermal conductive material utilizing electrically conductive nanoparticles |
| US20050072334A1 (en) | 2003-10-07 | 2005-04-07 | Saint-Gobain Performance Plastics, Inc. | Thermal interface material |
| US7695817B2 (en) | 2003-11-05 | 2010-04-13 | Dow Corning Corporation | Thermally conductive grease and methods and devices in which said grease is used |
| JP4219793B2 (ja) | 2003-11-25 | 2009-02-04 | 信越化学工業株式会社 | 放熱用シリコーングリース組成物 |
| US7306823B2 (en) | 2004-09-18 | 2007-12-11 | Nanosolar, Inc. | Coated nanoparticles and quantum dots for solution-based fabrication of photovoltaic cells |
| US7119143B2 (en) | 2004-03-04 | 2006-10-10 | Laird Technologies, Inc. | Silicone pads for electronics thermal management |
| US20050228097A1 (en) | 2004-03-30 | 2005-10-13 | General Electric Company | Thermally conductive compositions and methods of making thereof |
| WO2005097906A1 (ja) | 2004-04-01 | 2005-10-20 | Kaneka Corporation | 一液型硬化性組成物 |
| WO2005108491A1 (ja) | 2004-05-07 | 2005-11-17 | Kaneka Corporation | 硬化性組成物 |
| JP4501526B2 (ja) | 2004-05-14 | 2010-07-14 | 住友化学株式会社 | 高熱伝導性樹脂組成物 |
| JP4480457B2 (ja) | 2004-05-17 | 2010-06-16 | 株式会社カネカ | 硬化性組成物 |
| WO2005111146A1 (ja) | 2004-05-17 | 2005-11-24 | Techno Polymer Co., Ltd. | 熱伝導性樹脂組成物及びその製造方法並びにハウジング |
| EP1751796A1 (en) | 2004-05-20 | 2007-02-14 | General Electric Company, (a New York Corporation) | Organic matrices containing nanomaterials to enhance bulk thermal conductivity |
| US20050287362A1 (en) | 2004-06-23 | 2005-12-29 | 3M Innovative Properties Company | Halogen free tapes & method of making same |
| US20080302064A1 (en) | 2004-07-13 | 2008-12-11 | Rauch Robert A | Novel Packaging Solution for Highly Filled Phase-Change Thermal Interface Material |
| KR101261064B1 (ko) | 2004-08-23 | 2013-05-06 | 제너럴 일렉트릭 캄파니 | 열 전도성 조성물 및 그의 제조 방법 |
| US8105504B2 (en) | 2004-08-31 | 2012-01-31 | Basf Se | Stabilization of organic materials |
| US20060060980A1 (en) | 2004-09-22 | 2006-03-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Ic package having ground ic chip and method of manufacturing same |
| US7850870B2 (en) | 2004-10-28 | 2010-12-14 | Dow Corning Corporation | Conductive curable compositions |
| US7328547B2 (en) | 2004-10-29 | 2008-02-12 | Bostik, Inc. | Process for packaging plastic materials like hot melt adhesives |
| US20060094809A1 (en) | 2004-11-02 | 2006-05-04 | Simone Davide L | Electrically and thermally conductive silicone adhesive compositions |
| JP5226217B2 (ja) | 2004-11-10 | 2013-07-03 | 株式会社カネカ | 硬化性組成物 |
| KR101164438B1 (ko) | 2004-12-16 | 2012-07-13 | 다우 코닝 코포레이션 | 아미드 치환된 실리콘, 이의 제조방법 및 이의 용도 |
| JP4954090B2 (ja) | 2005-02-01 | 2012-06-13 | ダウ・コーニング・コーポレイション | 接着促進添加剤組成物、硬化性被覆組成物、合成繊維材料及び合成繊維材料の被覆方法 |
| US7241707B2 (en) | 2005-02-17 | 2007-07-10 | Intel Corporation | Layered films formed by controlled phase segregation |
| CN100543103C (zh) | 2005-03-19 | 2009-09-23 | 清华大学 | 热界面材料及其制备方法 |
| US20060228542A1 (en) | 2005-04-08 | 2006-10-12 | Saint-Gobain Performance Plastics Corporation | Thermal interface material having spheroidal particulate filler |
| CN100404242C (zh) | 2005-04-14 | 2008-07-23 | 清华大学 | 热界面材料及其制造方法 |
| US20060260948A2 (en) | 2005-04-14 | 2006-11-23 | Enthone Inc. | Method for electrodeposition of bronzes |
| WO2006117920A1 (ja) | 2005-04-28 | 2006-11-09 | Meltex Inc. | スズめっき液、そのスズめっき液を用いためっき方法、スズめっき液調整方法及びそのスズめっき液を用いてスズめっき層を形成したチップ部品 |
| US20070116626A1 (en) | 2005-05-11 | 2007-05-24 | Molecular Nanosystems, Inc. | Methods for forming carbon nanotube thermal pads |
| US20060264566A1 (en) | 2005-05-19 | 2006-11-23 | Wacker Chemical Corporation | HCR room temperature curable rubber composition |
| AU2006249601B2 (en) | 2005-05-26 | 2011-08-11 | Nanocomp Technologies, Inc. | Systems and methods for thermal management of electronic components |
| JP2007002002A (ja) | 2005-06-21 | 2007-01-11 | Idemitsu Kosan Co Ltd | 伝熱性樹脂組成物 |
| US20070013054A1 (en) | 2005-07-12 | 2007-01-18 | Ruchert Brian D | Thermally conductive materials, solder preform constructions, assemblies and semiconductor packages |
| US20070051773A1 (en) | 2005-09-02 | 2007-03-08 | Ruchert Brian D | Thermal interface materials, methods of preparation thereof and their applications |
| JP4860229B2 (ja) | 2005-10-11 | 2012-01-25 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 熱伝導性グリース組成物 |
| WO2007053571A2 (en) | 2005-11-01 | 2007-05-10 | Techfilm, Llc | Thermal interface material with multiple size distribution thermally conductive fillers |
| JP2007131798A (ja) | 2005-11-14 | 2007-05-31 | Kaneka Corp | 硬化性組成物 |
| CN1970666A (zh) | 2005-11-24 | 2007-05-30 | 鸿富锦精密工业(深圳)有限公司 | 导热胶 |
| CN1978582A (zh) | 2005-12-09 | 2007-06-13 | 富准精密工业(深圳)有限公司 | 导热膏及使用该导热膏的电子装置 |
| US7465605B2 (en) | 2005-12-14 | 2008-12-16 | Intel Corporation | In-situ functionalization of carbon nanotubes |
| US7262369B1 (en) | 2006-03-09 | 2007-08-28 | Laird Technologies, Inc. | Combined board level EMI shielding and thermal management |
| JP4933094B2 (ja) | 2005-12-27 | 2012-05-16 | 信越化学工業株式会社 | 熱伝導性シリコーングリース組成物 |
| US7964542B2 (en) | 2006-01-12 | 2011-06-21 | International Business Machines Corporation | Enhanced thermo-oxidative stability thermal interface compositions and use thereof in microelectronics assembly |
| US20070166554A1 (en) | 2006-01-18 | 2007-07-19 | Ruchert Brian D | Thermal interconnect and interface systems, methods of production and uses thereof |
| US20070179232A1 (en) | 2006-01-30 | 2007-08-02 | National Starch And Chemical Investment Holding Corporation | Thermal Interface Material |
| US7440281B2 (en) | 2006-02-01 | 2008-10-21 | Apple Inc. | Thermal interface apparatus |
| US7463496B2 (en) | 2006-03-09 | 2008-12-09 | Laird Technologies, Inc. | Low-profile board level EMI shielding and thermal management apparatus and spring clips for use therewith |
| US20070219312A1 (en) | 2006-03-17 | 2007-09-20 | Jennifer Lynn David | Silicone adhesive composition and method for preparing the same |
| US7955900B2 (en) | 2006-03-31 | 2011-06-07 | Intel Corporation | Coated thermal interface in integrated circuit die |
| TWI313695B (en) | 2006-04-20 | 2009-08-21 | Taiwan Textile Res Inst | Melted-spinning grains containing thermal-stable phase-change polymer and preparation method thereof |
| US7514485B2 (en) | 2006-06-20 | 2009-04-07 | Chemtura Corporation | Compatibilizers for composites of PVC and cellulosic materials |
| JP2008050555A (ja) | 2006-07-24 | 2008-03-06 | Sumitomo Chemical Co Ltd | 熱伝導性樹脂組成物およびその用途 |
| US20080023665A1 (en) | 2006-07-25 | 2008-01-31 | Weiser Martin W | Thermal interconnect and interface materials, methods of production and uses thereof |
| KR20090045931A (ko) | 2006-09-05 | 2009-05-08 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 열전도성 그리스 |
| JP2008063412A (ja) | 2006-09-06 | 2008-03-21 | Showa Denko Kk | 熱伝導性樹脂組成物およびシート |
| WO2008047809A1 (en) | 2006-10-17 | 2008-04-24 | Denki Kagaku Kogyo Kabushiki Kaisha | Grease |
| KR100820902B1 (ko) | 2006-11-08 | 2008-04-11 | 조인셋 주식회사 | 다층 열 전도성 패드 |
| TWI344196B (en) | 2006-11-15 | 2011-06-21 | Ind Tech Res Inst | Melting temperature adjustable metal thermal interface materials and use thereof |
| US7554793B2 (en) | 2006-11-16 | 2009-06-30 | Kemet Electronics Corporation | Low temperature curable conductive adhesive and capacitors formed thereby |
| US8431647B2 (en) | 2006-12-27 | 2013-04-30 | Bluestar Silicones France Sas | Adhesive silicone compositions and adhesive bonding/seaming therewith |
| JP5197631B2 (ja) | 2007-02-20 | 2013-05-15 | ダウ コーニング コーポレーション | 水素結合性ポリオルガノシロキサンベースの充填材処理剤 |
| CN101067030A (zh) | 2007-03-30 | 2007-11-07 | 广东华南精细化工研究院有限公司 | 新型聚烯烃高效耐热氧化复合型抗氧剂及其生产工艺和应用 |
| US20100075135A1 (en) | 2007-04-02 | 2010-03-25 | Kendall Philip E | Thermal grease article and method |
| US8431655B2 (en) | 2007-04-09 | 2013-04-30 | Designer Molecules, Inc. | Curatives for epoxy compositions |
| GB0707176D0 (en) | 2007-04-16 | 2007-05-23 | Dow Corning | Hydrosilylation curable compositions |
| US7462294B2 (en) | 2007-04-25 | 2008-12-09 | International Business Machines Corporation | Enhanced thermal conducting formulations |
| US7646778B2 (en) | 2007-04-27 | 2010-01-12 | Cisco Technology, Inc. | Support of C-tagged service interface in an IEEE 802.1ah bridge |
| US20080291634A1 (en) | 2007-05-22 | 2008-11-27 | Weiser Martin W | Thermal interconnect and interface materials, methods of production and uses thereof |
| US7765811B2 (en) | 2007-06-29 | 2010-08-03 | Laird Technologies, Inc. | Flexible assemblies with integrated thermoelectric modules suitable for use in extracting power from or dissipating heat from fluid conduits |
| FR2919615A1 (fr) | 2007-08-02 | 2009-02-06 | Bluestar Silicones France Soc | Composition elastomere silicone adhesive |
| DE102007037435B4 (de) | 2007-08-08 | 2012-03-22 | Sgl Carbon Se | Schichtstoff |
| JP5269366B2 (ja) | 2007-08-22 | 2013-08-21 | コスモ石油ルブリカンツ株式会社 | 耐熱型熱伝導性グリース |
| CN101372614B (zh) | 2007-08-24 | 2011-06-08 | 清华大学 | 碳纳米管阵列复合导热片及其制备方法 |
| CN101835830B (zh) | 2007-08-31 | 2013-02-20 | 卡伯特公司 | 热界面材料 |
| KR101487346B1 (ko) | 2007-09-12 | 2015-01-28 | 스몰텍 에이비 | 인접 층들을 나노구조들과 연결하고 결합하는 방법 |
| US8586650B2 (en) | 2007-09-14 | 2013-11-19 | Henkel US IP LLC | Thermally conductive composition |
| US8112884B2 (en) | 2007-10-08 | 2012-02-14 | Honeywell International Inc. | Method for providing an efficient thermal transfer through a printed circuit board |
| WO2009054995A1 (en) | 2007-10-22 | 2009-04-30 | Flexible Ceramics, Inc. | Fire resistant flexible ceramic resin blend and composite products formed therefrom |
| JP2009102577A (ja) | 2007-10-25 | 2009-05-14 | Polymatech Co Ltd | 熱伝導性組成物 |
| US20090111925A1 (en) | 2007-10-31 | 2009-04-30 | Burnham Kikue S | Thermal interface materials, methods of production and uses thereof |
| US8445102B2 (en) | 2007-11-05 | 2013-05-21 | Laird Technologies, Inc. | Thermal interface material with thin transfer film or metallization |
| US9795059B2 (en) | 2007-11-05 | 2017-10-17 | Laird Technologies, Inc. | Thermal interface materials with thin film or metallization |
| JP5137538B2 (ja) | 2007-11-28 | 2013-02-06 | リンテック株式会社 | 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法 |
| JP2009138036A (ja) | 2007-12-04 | 2009-06-25 | Momentive Performance Materials Japan Kk | 熱伝導性シリコーングリース組成物 |
| US8076773B2 (en) | 2007-12-26 | 2011-12-13 | The Bergquist Company | Thermal interface with non-tacky surface |
| KR101184467B1 (ko) | 2008-01-16 | 2012-09-19 | 히다치 가세고교 가부시끼가이샤 | 감광성 접착제 조성물, 필름상 접착제, 접착 시트, 접착제 패턴, 접착제층 부착 반도체 웨이퍼, 반도체 장치, 및, 반도체 장치의 제조방법 |
| US20090184283A1 (en) | 2008-01-18 | 2009-07-23 | Deborah Duen Ling Chung | Antioxidants for phase change ability and thermal stability enhancement |
| US7732829B2 (en) | 2008-02-05 | 2010-06-08 | Hymite A/S | Optoelectronic device submount |
| US20090215225A1 (en) | 2008-02-24 | 2009-08-27 | Advanced Technology Materials, Inc. | Tellurium compounds useful for deposition of tellurium containing materials |
| JP4656340B2 (ja) | 2008-03-03 | 2011-03-23 | 信越化学工業株式会社 | 熱伝導性シリコーングリース組成物 |
| WO2009131913A2 (en) | 2008-04-21 | 2009-10-29 | Honeywell International Inc. | Thermal interconnect and interface materials, methods of production and uses thereof |
| US8632879B2 (en) | 2008-04-25 | 2014-01-21 | The University Of Kentucky Research Foundation | Lightweight thermal management material for enhancement of through-thickness thermal conductivity |
| US10358535B2 (en) | 2008-04-25 | 2019-07-23 | The University Of Kentucky Research Foundation | Thermal interface material |
| WO2009136508A1 (ja) | 2008-05-08 | 2009-11-12 | 富士高分子工業株式会社 | 熱伝導性樹脂組成物 |
| US8115303B2 (en) | 2008-05-13 | 2012-02-14 | International Business Machines Corporation | Semiconductor package structures having liquid coolers integrated with first level chip package modules |
| JP5607298B2 (ja) | 2008-07-29 | 2014-10-15 | 株式会社カネカ | 熱伝導材料 |
| KR20110034038A (ko) | 2008-08-04 | 2011-04-04 | 히다치 가세고교 가부시끼가이샤 | 접착제 조성물, 필름형 접착제, 접착 시트 및 반도체 장치 |
| US8449679B2 (en) | 2008-08-15 | 2013-05-28 | Lam Research Corporation | Temperature controlled hot edge ring assembly |
| US8394746B2 (en) | 2008-08-22 | 2013-03-12 | Exxonmobil Research And Engineering Company | Low sulfur and low metal additive formulations for high performance industrial oils |
| EP2194165A1 (en) | 2008-10-21 | 2010-06-09 | Rohm and Haas Electronic Materials LLC | Method for replenishing tin and its alloying metals in electrolyte solutions |
| JP2010120979A (ja) | 2008-11-17 | 2010-06-03 | Taika:Kk | 熱伝導性シリコーンゲル硬化物 |
| US20100129648A1 (en) | 2008-11-26 | 2010-05-27 | Jun Xu | Electronic packaging and heat sink bonding enhancements, methods of production and uses thereof |
| CN101445627A (zh) | 2008-12-11 | 2009-06-03 | 上海交通大学 | 高压直流电缆绝缘材料及其制备方法 |
| US8138239B2 (en) | 2008-12-23 | 2012-03-20 | Intel Corporation | Polymer thermal interface materials |
| JP5390202B2 (ja) | 2009-01-21 | 2014-01-15 | 株式会社カネカ | 放熱構造体 |
| US7816785B2 (en) | 2009-01-22 | 2010-10-19 | International Business Machines Corporation | Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package |
| US9080000B2 (en) | 2009-02-04 | 2015-07-14 | Dow Corning Corporation | Method of forming a non-random copolymer |
| WO2010104542A1 (en) | 2009-03-02 | 2010-09-16 | Honeywell International Inc. | Thermal interface material and method of making and using the same |
| EP2406321A1 (en) | 2009-03-12 | 2012-01-18 | Dow Corning Corporation | Thermal interface materials and methods for their preparation and use |
| EP2408860B1 (en) | 2009-03-16 | 2020-03-18 | Dow Silicones Corporation | Thermally conductive grease and methods and devices in which said grease is used |
| DE102009001722B4 (de) | 2009-03-20 | 2012-04-05 | Infineon Technologies Ag | Verfahren zum Aufbringen eines Wärmeleitmediums auf eine Wärmeableitfläche |
| WO2010115173A1 (en) | 2009-04-03 | 2010-10-07 | Vorbeck Materials Corp | Polymer compositions containing graphene sheets and graphite |
| US20100256280A1 (en) | 2009-04-07 | 2010-10-07 | Laird Technologies, Inc. | Methods of forming resin and filler composite systems |
| JP2010248277A (ja) | 2009-04-10 | 2010-11-04 | Panasonic Corp | 熱伝導性樹脂ペーストおよびそれを用いた光ディスク装置 |
| JP5562574B2 (ja) | 2009-04-14 | 2014-07-30 | 信越化学工業株式会社 | 熱伝導性接着剤 |
| US8758892B2 (en) | 2009-05-05 | 2014-06-24 | Parker Hannifin Corporation | Thermally conductive foam product |
| JP5577553B2 (ja) | 2009-05-27 | 2014-08-27 | 協同油脂株式会社 | 放熱コンパウンド組成物 |
| US8362607B2 (en) | 2009-06-03 | 2013-01-29 | Honeywell International Inc. | Integrated circuit package including a thermally and electrically conductive package lid |
| KR100953679B1 (ko) | 2009-06-15 | 2010-04-20 | 두성산업 주식회사 | 방열재 및 그 제조 방법 |
| US8081468B2 (en) | 2009-06-17 | 2011-12-20 | Laird Technologies, Inc. | Memory modules including compliant multilayered thermally-conductive interface assemblies |
| CN102804367A (zh) | 2009-06-19 | 2012-11-28 | 道康宁公司 | 离聚硅酮热塑性弹性体在电子器件中的用途 |
| US8535787B1 (en) | 2009-06-29 | 2013-09-17 | Juniper Networks, Inc. | Heat sinks having a thermal interface for cooling electronic devices |
| CN101942197B (zh) | 2009-07-09 | 2012-06-27 | 昆山伟翰电子有限公司 | 导热硅橡胶复合材料及其制作方法 |
| US20120174956A1 (en) | 2009-08-06 | 2012-07-12 | Laird Technologies, Inc. | Thermoelectric Modules, Thermoelectric Assemblies, and Related Methods |
| WO2011035261A1 (en) * | 2009-09-18 | 2011-03-24 | Protherics Salt Lake City, Inc. | Reconstitutable reverse thermal gelling polymers |
| US20130199724A1 (en) | 2009-10-09 | 2013-08-08 | Designer Molecules, Inc. | Curatives for epoxy compositions |
| JP5463116B2 (ja) | 2009-10-14 | 2014-04-09 | 電気化学工業株式会社 | 熱伝導性材料 |
| US9593209B2 (en) | 2009-10-22 | 2017-03-14 | Dow Corning Corporation | Process for preparing clustered functional polyorganosiloxanes, and methods for their use |
| US8223498B2 (en) | 2009-11-11 | 2012-07-17 | Juniper Networks, Inc. | Thermal interface members for removable electronic devices |
| TWI370532B (en) | 2009-11-12 | 2012-08-11 | Ind Tech Res Inst | Chip package structure and method for fabricating the same |
| JP5318733B2 (ja) | 2009-11-26 | 2013-10-16 | コスモ石油ルブリカンツ株式会社 | 熱伝導性グリース |
| GB2508320B (en) | 2009-12-09 | 2014-07-23 | Intel Corp | Polymer thermal interface materials |
| TWI475103B (zh) | 2009-12-15 | 2015-03-01 | 財團法人工業技術研究院 | 散熱結構 |
| KR101524506B1 (ko) * | 2009-12-21 | 2015-06-01 | 생-고뱅 퍼포먼스 플라스틱스 코포레이션 | 열전도성 폼 재료 |
| CN101735619B (zh) | 2009-12-28 | 2011-11-09 | 华南理工大学 | 一种无卤阻燃导热有机硅电子灌封胶及其制备方法 |
| KR101023241B1 (ko) | 2009-12-28 | 2011-03-21 | 제일모직주식회사 | 반도체용 접착제 조성물 및 이를 이용한 접착 필름 |
| JP5497458B2 (ja) | 2010-01-13 | 2014-05-21 | 電気化学工業株式会社 | 熱伝導性樹脂組成物 |
| JP2011165792A (ja) | 2010-02-08 | 2011-08-25 | Teijin Dupont Films Japan Ltd | 放熱性二軸延伸フィルム |
| US9260645B2 (en) | 2010-02-23 | 2016-02-16 | Laird Technologies, Inc. | Thermal interface materials including thermally reversible gels |
| US9771508B2 (en) | 2010-02-23 | 2017-09-26 | Laird Technologies, Inc. | Thermal interface materials including thermally reversible gels |
| US7990711B1 (en) | 2010-02-24 | 2011-08-02 | International Business Machines Corporation | Double-face heat removal of vertically integrated chip-stacks utilizing combined symmetric silicon carrier fluid cavity and micro-channel cold plate |
| WO2011114665A1 (ja) | 2010-03-15 | 2011-09-22 | 日本化薬株式会社 | 耐熱用接着剤 |
| US8009429B1 (en) | 2010-03-22 | 2011-08-30 | Honeywell International Inc. | Electrical component thermal management |
| CN102893391B (zh) | 2010-04-30 | 2017-08-29 | 铟泰公司 | 具有良好可靠性的热界面材料 |
| US8308861B2 (en) | 2010-05-13 | 2012-11-13 | E I Du Pont De Nemours And Company | Phase change material compositions |
| US8647752B2 (en) | 2010-06-16 | 2014-02-11 | Laird Technologies, Inc. | Thermal interface material assemblies, and related methods |
| CN102134474B (zh) | 2010-12-29 | 2013-10-02 | 深圳市优宝惠新材料科技有限公司 | 导热硅脂组合物 |
| US8917510B2 (en) | 2011-01-14 | 2014-12-23 | International Business Machines Corporation | Reversibly adhesive thermal interface material |
| KR101866299B1 (ko) | 2011-01-26 | 2018-06-12 | 다우 실리콘즈 코포레이션 | 고온 안정성 열 전도성 재료 |
| US8277774B2 (en) | 2011-01-27 | 2012-10-02 | Honeywell International | Method for the preparation of high purity stannous oxide |
| JP5749536B2 (ja) | 2011-03-28 | 2015-07-15 | 電気化学工業株式会社 | 熱伝導性成形体とその用途 |
| ES2609110T3 (es) | 2011-03-30 | 2017-04-18 | Infacare Pharmaceutical Corporation | Procedimientos de síntesis de mesoporfirinas metálicas |
| KR101800437B1 (ko) | 2011-05-02 | 2017-11-22 | 삼성전자주식회사 | 반도체 패키지 |
| US20120285673A1 (en) | 2011-05-11 | 2012-11-15 | Georgia Tech Research Corporation | Nanostructured composite polymer thermal/electrical interface material and method for making the same |
| JP2012241063A (ja) | 2011-05-17 | 2012-12-10 | Nitto Denko Corp | 半導体装置製造用の接着シート |
| US20120292005A1 (en) | 2011-05-19 | 2012-11-22 | Laird Technologies, Inc. | Thermal interface materials and methods for processing the same |
| CN103748171B (zh) | 2011-08-10 | 2016-03-16 | 株式会社艾迪科 | 含硅固化性组合物及其固化物 |
| JP5687167B2 (ja) | 2011-09-27 | 2015-03-18 | コスモ石油ルブリカンツ株式会社 | 耐熱型熱伝導性グリース |
| CN103102689B (zh) | 2011-11-15 | 2015-04-01 | 佛山市金戈消防材料有限公司 | 一种高导热有机硅灌封胶组合物及其应用 |
| WO2013074920A1 (en) | 2011-11-17 | 2013-05-23 | Reliabulb, Llc | Low thermal impedance interface for an led bulb |
| US20130127069A1 (en) | 2011-11-17 | 2013-05-23 | International Business Machines Corporation | Matrices for rapid alignment of graphitic structures for stacked chip cooling applications |
| CN103131138B (zh) | 2011-11-23 | 2016-05-11 | 合肥杰事杰新材料股份有限公司 | 一种热塑性聚酯组合物及其制备方法 |
| CN103254647A (zh) | 2012-02-20 | 2013-08-21 | 深圳德邦界面材料有限公司 | 一种导热缝隙界面材料及其制备方法 |
| JP5614909B2 (ja) | 2012-03-02 | 2014-10-29 | 富士高分子工業株式会社 | パテ状伝熱材及びその製造方法 |
| CN102627943A (zh) | 2012-04-11 | 2012-08-08 | 北京化工大学常州先进材料研究院 | 一种湿气/紫外光双固化有机硅胶粘剂 |
| CN102634212B (zh) | 2012-04-23 | 2015-11-25 | 湖州明朔光电科技有限公司 | 一种导热硅脂组合物 |
| JP5783128B2 (ja) | 2012-04-24 | 2015-09-24 | 信越化学工業株式会社 | 加熱硬化型熱伝導性シリコーングリース組成物 |
| US8937384B2 (en) | 2012-04-25 | 2015-01-20 | Qualcomm Incorporated | Thermal management of integrated circuits using phase change material and heat spreaders |
| TWI598385B (zh) | 2012-05-10 | 2017-09-11 | 國立清華大學 | 絕緣化熱介面材料 |
| CN103827277B (zh) | 2012-05-11 | 2016-07-06 | 信越化学工业株式会社 | 导热性硅脂组合物 |
| JP2014003152A (ja) | 2012-06-18 | 2014-01-09 | Dow Corning Toray Co Ltd | サーマルインターフェース材の形成方法および放熱構造体 |
| KR102020257B1 (ko) | 2012-07-04 | 2019-09-10 | 디아이씨 가부시끼가이샤 | 히트 시일제, 그것을 사용한 적층체 및 태양 전지 모듈 |
| US8587945B1 (en) | 2012-07-27 | 2013-11-19 | Outlast Technologies Llc | Systems structures and materials for electronic device cooling |
| US9752007B2 (en) | 2012-07-30 | 2017-09-05 | Dow Corning Corporation | Thermally conductive condensation reaction curable polyorganosiloxane composition and methods for the preparation and use of the composition |
| GB201220099D0 (en) | 2012-09-19 | 2012-12-26 | Dow Corning | Production of blend of polyolefin and organopolysiloxane |
| JP2014105283A (ja) | 2012-11-28 | 2014-06-09 | Shin Etsu Chem Co Ltd | 熱伝導性シリコーングリース組成物 |
| FR3000090A1 (fr) | 2012-12-20 | 2014-06-27 | Bluestar Silicones France | Procede et compositions utiles pour l'etancheification et l'assemblage de composants d'un groupe moto-propulseur |
| JP5944306B2 (ja) | 2012-12-21 | 2016-07-05 | コスモ石油ルブリカンツ株式会社 | 高熱伝導性グリース |
| CN103087389B (zh) | 2013-01-31 | 2015-06-10 | 合肥工业大学 | 一种高导热高韧性复合材料及其制备方法 |
| CN104968750B (zh) | 2013-02-11 | 2017-04-19 | 道康宁公司 | 簇合官能化聚有机硅氧烷、形成所述簇合官能化聚有机硅氧烷的工艺及其使用方法 |
| JP6408491B2 (ja) | 2013-02-11 | 2018-10-17 | ダウ シリコーンズ コーポレーション | 熱伝導性熱ラジカル硬化性シリコーン組成物を形成するためのinsitu法 |
| JP5372270B1 (ja) | 2013-02-19 | 2013-12-18 | ビッグテクノス株式会社 | 熱放射性フィルム及び熱放射性粘着テープ |
| JP6263042B2 (ja) | 2013-02-28 | 2018-01-17 | コスモ石油ルブリカンツ株式会社 | 基油拡散防止性能を有する熱伝導性グリース |
| CN103102552A (zh) | 2013-03-12 | 2013-05-15 | 泰山体育产业集团有限公司 | 一种相变保温聚烯烃泡沫材料及其制备方法 |
| WO2014160067A1 (en) | 2013-03-14 | 2014-10-02 | Dow Corning Corporation | Thermally curable silicone compositions as temporary bonding adhesives |
| US9070660B2 (en) | 2013-03-15 | 2015-06-30 | Intel Corporation | Polymer thermal interface material having enhanced thermal conductivity |
| CN103214848B (zh) | 2013-04-28 | 2015-07-22 | 深圳市新亚新材料有限公司 | 一种用于cpu散热的相变导热硅脂组合物及其制备方法 |
| CN103333447A (zh) | 2013-06-26 | 2013-10-02 | 苏州天脉导热科技有限公司 | 一种相变化热界面材料及其制备方法 |
| US9464879B2 (en) | 2013-06-28 | 2016-10-11 | Buhler, Inc. | Barrel measuring device |
| WO2015008330A1 (ja) | 2013-07-16 | 2015-01-22 | 日立化成株式会社 | 感光性樹脂組成物、フィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ及び半導体装置 |
| CN103409116B (zh) | 2013-07-30 | 2015-07-22 | 深圳德邦界面材料有限公司 | 一种绝缘增强型导热界面材料及其制备方法 |
| CN103436027B (zh) | 2013-09-09 | 2015-10-28 | 北京化工大学 | 一种导热电绝缘硅橡胶热界面材料及其制备方法 |
| KR101917164B1 (ko) | 2013-10-30 | 2018-11-09 | 에스케이이노베이션 주식회사 | 열전도성 폴리머의 제조방법 |
| US20150125646A1 (en) | 2013-11-05 | 2015-05-07 | Espci Innov | Self-Healing Thermally Conductive Polymer Materials |
| WO2015068551A1 (ja) | 2013-11-08 | 2015-05-14 | リンテック株式会社 | 保護膜形成用組成物、保護膜形成用シート、及び保護膜付きチップ |
| JP2015097134A (ja) | 2013-11-15 | 2015-05-21 | 日東電工株式会社 | 回路付サスペンション基板 |
| CN103756631B (zh) | 2013-11-28 | 2015-06-03 | 常熟市恒信粘胶有限公司 | 双组份自粘性加成型阻燃导热室温固化有机硅灌封胶 |
| CN105899714B (zh) | 2013-12-05 | 2018-09-21 | 霍尼韦尔国际公司 | 具有经调节的pH的甲基磺酸亚锡溶液 |
| CN104152103B (zh) | 2013-12-23 | 2016-08-17 | 郑州中原应用技术研究开发有限公司 | 一种加成型双组分导热灌封胶及其制备方法 |
| CN103709757A (zh) | 2013-12-30 | 2014-04-09 | 无锡中石油润滑脂有限责任公司 | 一种绝缘导热硅脂及其制备方法 |
| CN104449550B (zh) | 2013-12-31 | 2016-08-17 | 弗洛里光电材料(苏州)有限公司 | 有机硅组合物及其应用 |
| CN103773322A (zh) | 2014-02-08 | 2014-05-07 | 中国电子科技集团公司第三十三研究所 | 一种相变微胶囊导热材料及其制备方法 |
| KR20160122172A (ko) | 2014-02-13 | 2016-10-21 | 허니웰 인터내셔날 인코포레이티드 | 압축성 열전도 재료 |
| CN106661331B (zh) | 2014-03-06 | 2020-10-23 | 汉高股份有限及两合公司 | 单晶氧化铝填充的管芯粘结膏 |
| CN103865271B (zh) | 2014-03-20 | 2017-04-05 | 北京化工大学 | 一种纳米杂化材料改性的有机硅导热电子灌封胶的制备方法 |
| CN103849356A (zh) | 2014-03-20 | 2014-06-11 | 中国电子科技集团公司第三十三研究所 | 一种电气绝缘相变导热材料及其制备方法 |
| JP6348434B2 (ja) | 2014-03-28 | 2018-06-27 | 信越化学工業株式会社 | シリコーン粘着剤組成物、その製造法及び粘着フィルム |
| JP2015212318A (ja) | 2014-05-01 | 2015-11-26 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物 |
| US20150334871A1 (en) | 2014-05-19 | 2015-11-19 | Laird Technologies, Inc. | Thermal interface materials with thin film sealants |
| CN104140678B (zh) | 2014-06-29 | 2017-04-12 | 惠州市永卓科技有限公司 | 一种具有自粘性的导热硅脂及其制备方法 |
| CN104098914B (zh) | 2014-07-02 | 2017-09-29 | 深圳市安品有机硅材料有限公司 | 有机硅导热界面材料 |
| PL3166999T3 (pl) | 2014-07-07 | 2023-07-03 | Honeywell International Inc. | Materiał termoprzewodzący ze zmiataczem jonów |
| WO2016035680A1 (ja) | 2014-09-01 | 2016-03-10 | 株式会社カネカ | 自動車用ledランプヒートシンク |
| CN107075400B (zh) | 2014-09-22 | 2020-06-23 | 陶氏环球技术有限责任公司 | 基于超支化烯烃流体的导热油脂 |
| JP6600314B2 (ja) | 2014-10-23 | 2019-10-30 | 株式会社カネカ | Ledランプヒートシンク |
| CN106795375B (zh) | 2014-10-24 | 2020-08-21 | 纳美仕股份有限公司 | 导电性组合物和使用该导电性组合物的电子部件 |
| CN104479623B (zh) | 2014-12-03 | 2016-05-18 | 湖南皓志科技股份有限公司 | 一种高导热常温固化有机硅灌封胶 |
| EP3227399B1 (en) | 2014-12-05 | 2021-07-14 | Honeywell International Inc. | High performance thermal interface materials with low thermal impedance |
| CN104497574A (zh) | 2014-12-10 | 2015-04-08 | 深圳市博恩实业有限公司 | 多功能有机硅热界面材料 |
| CN104513487B (zh) | 2014-12-10 | 2017-05-10 | 东莞兆舜有机硅科技股份有限公司 | 一种双组分导热硅凝胶及其用途 |
| DE112014007281B4 (de) | 2014-12-25 | 2022-07-07 | Sekisui Polymatech Co., Ltd. | Silikonzusammensetzung |
| WO2016111139A1 (ja) | 2015-01-06 | 2016-07-14 | 富士高分子工業株式会社 | 蓄熱性熱伝導シート |
| US10431858B2 (en) | 2015-02-04 | 2019-10-01 | Global Web Horizons, Llc | Systems, structures and materials for electrochemical device thermal management |
| CN104804705A (zh) | 2015-05-06 | 2015-07-29 | 成都拓利化工实业有限公司 | 低释气量加成型无卤阻燃导热有机硅灌封胶及其制备方法 |
| CN104861661A (zh) | 2015-05-13 | 2015-08-26 | 浙江中天氟硅材料有限公司 | 一种低密度导热灌封胶及其制备方法 |
| JP6510315B2 (ja) | 2015-05-14 | 2019-05-08 | デンカ株式会社 | 熱伝導性グリース用組成物、熱伝導性グリースおよび放熱部材 |
| CN107708998A (zh) | 2015-06-03 | 2018-02-16 | 株式会社钟化 | 金属树脂复合体 |
| JP6323398B2 (ja) | 2015-06-10 | 2018-05-16 | 信越化学工業株式会社 | 熱伝導性シリコーンパテ組成物 |
| US10692797B2 (en) | 2015-06-30 | 2020-06-23 | Laird Technologies, Inc. | Thermal interface materials with low secant modulus of elasticity and high thermal conductivity |
| CN106467668B (zh) | 2015-08-19 | 2021-07-30 | 广东生益科技股份有限公司 | 一种有机硅树脂铝基覆铜板及其制备方法 |
| CN105111750A (zh) | 2015-09-09 | 2015-12-02 | 蓝星(成都)新材料有限公司 | 一种led灌封用有机硅密封胶 |
| JP7089876B2 (ja) | 2015-09-09 | 2022-06-23 | 株式会社カネカ | 熱伝導性樹脂組成物 |
| JP6497291B2 (ja) | 2015-10-14 | 2019-04-10 | 信越化学工業株式会社 | 絶縁放熱シート |
| CN105349113A (zh) | 2015-10-14 | 2016-02-24 | 文雪烽 | 一种导热界面材料 |
| US10312177B2 (en) | 2015-11-17 | 2019-06-04 | Honeywell International Inc. | Thermal interface materials including a coloring agent |
| CN105419339A (zh) | 2015-12-01 | 2016-03-23 | 江苏晶河电子科技有限公司 | 一种高性能硅基导热凝胶及其制备方法 |
| CN105566920A (zh) | 2015-12-24 | 2016-05-11 | 平湖阿莱德实业有限公司 | 低渗油超软导热硅胶组合物及导热硅胶垫片及其制备方法 |
| CN105670555A (zh) | 2016-01-22 | 2016-06-15 | 何挺 | 一种高导热型的有机硅灌封胶 |
| EP3426746B1 (en) | 2016-03-08 | 2021-07-14 | Honeywell International Inc. | Phase change material |
| CN105925243A (zh) | 2016-05-23 | 2016-09-07 | 东莞珂洛赫慕电子材料科技有限公司 | 一种室温固化型高导热柔性硅胶 |
| CN105838322A (zh) | 2016-05-26 | 2016-08-10 | 张学健 | 一种新型有机硅灌封胶 |
| US20180030328A1 (en) | 2016-07-26 | 2018-02-01 | Honeywell International Inc. | Gel-type thermal interface material |
| CN106221236B (zh) | 2016-07-26 | 2019-09-10 | 深圳市金无曼工业新材料有限公司 | 可常温或加温凝胶化制备的双组份导热硅脂及其制备方法 |
| US10501671B2 (en) | 2016-07-26 | 2019-12-10 | Honeywell International Inc. | Gel-type thermal interface material |
| CN109844056B (zh) | 2016-10-12 | 2021-11-09 | 霍尼韦尔国际公司 | 包含着色剂的热界面材料 |
| JP7129181B2 (ja) | 2017-03-17 | 2022-09-01 | 旭化成株式会社 | ヘッドマウントディスプレイ用部材 |
| CN107057370A (zh) | 2017-05-18 | 2017-08-18 | 平湖阿莱德实业有限公司 | 一种高导热填隙界面材料及其制备方法 |
| US10344194B2 (en) | 2017-09-27 | 2019-07-09 | Momentive Performance Materials Inc. | Thermal interface composition comprising ionically modified siloxane |
| US10428256B2 (en) | 2017-10-23 | 2019-10-01 | Honeywell International Inc. | Releasable thermal gel |
| US11072706B2 (en) | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
-
2018
- 2018-08-20 US US16/105,456 patent/US11041103B2/en active Active
- 2018-08-31 EP EP18853151.1A patent/EP3679087B1/en active Active
- 2018-08-31 KR KR1020227012192A patent/KR102487816B1/ko active Active
- 2018-08-31 CN CN201880057543.3A patent/CN111051392B/zh active Active
- 2018-08-31 JP JP2020513513A patent/JP6902163B2/ja active Active
- 2018-08-31 WO PCT/US2018/049218 patent/WO2019050806A1/en not_active Ceased
- 2018-08-31 KR KR1020207006299A patent/KR102388580B1/ko active Active
- 2018-09-07 TW TW107131409A patent/TWI780220B/zh active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040002866A (ko) * | 2001-05-30 | 2004-01-07 | 허니웰 인터내셔날 인코포레이티드 | 인터페이스 재료 및 인터페이스 재료의 생산과 사용방법 |
| US20040097635A1 (en) * | 2002-11-14 | 2004-05-20 | Shoushan Fan | Thermal interface material and method for making same |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3679087A1 (en) | 2020-07-15 |
| EP3679087A4 (en) | 2021-05-26 |
| KR102388580B1 (ko) | 2022-04-20 |
| CN111051392B (zh) | 2022-08-30 |
| TWI780220B (zh) | 2022-10-11 |
| WO2019050806A1 (en) | 2019-03-14 |
| KR20220050241A (ko) | 2022-04-22 |
| TW201920447A (zh) | 2019-06-01 |
| JP6902163B2 (ja) | 2021-07-14 |
| US11041103B2 (en) | 2021-06-22 |
| US20190078007A1 (en) | 2019-03-14 |
| JP2020532632A (ja) | 2020-11-12 |
| EP3679087B1 (en) | 2024-02-14 |
| CN111051392A (zh) | 2020-04-21 |
| KR102487816B1 (ko) | 2023-01-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102487816B1 (ko) | 실리콘-무함유 열 겔 | |
| CN113166545B (zh) | 包含mgo填料的导热组合物以及使用所述组合物的方法和装置 | |
| KR20220112797A (ko) | 고열 전도성 유동성 실리콘 조성물 | |
| TWI740449B (zh) | 聚有機矽氧烷及其導熱矽氧烷組合物 | |
| JP2022060339A (ja) | 熱伝導性シリコーン組成物 | |
| KR20170114184A (ko) | 고방열 액상 실리콘 부가형 접착제 조성물 | |
| TW202321374A (zh) | 含有鑽石粒子之可固化導熱組成物 | |
| WO2022240037A1 (ko) | 에폭시 수지 조성물 | |
| US20250129281A1 (en) | Curable thermally conductive composition | |
| JP2018028042A (ja) | 縮合硬化性シリコーン樹脂組成物 | |
| JP7653579B2 (ja) | 垂直安定性を有する室温貯蔵可能な一液型後硬化性熱伝導性シリコーン | |
| TW202309210A (zh) | 低相對介電常數絕緣塗料組合物,其固化物和顯示裝置 | |
| US20220389169A1 (en) | Thermally-conductive curable composition | |
| KR20230071158A (ko) | 낮은 분배 점도, 분배 후 낮은 수직 유동 및 경화 후 낮은 열 임피던스를 갖는 열 계면 재료 | |
| TWI860145B (zh) | 聚矽氧烷組合物及其用途 | |
| TWI886796B (zh) | 經處理的填料、處理導熱性填料的方法及其應用 | |
| JP2987179B2 (ja) | 硬化性エポキシ樹脂組成物 | |
| JPH04108851A (ja) | 硬化性エポキシ樹脂組成物 | |
| JPH03275710A (ja) | 硬化性エポキシ樹脂組成物 | |
| JP2888887B2 (ja) | 硬化性エポキシ樹脂組成物 | |
| US20250092259A1 (en) | Thermally conductive silicone composition | |
| WO2025166614A2 (en) | Method of making curable thermally conductive composition | |
| TW202428771A (zh) | 熱傳導性矽酮組合物 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0105 | International application |
Patent event date: 20200303 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20200303 Comment text: Request for Examination of Application |
|
| PG1501 | Laying open of application | ||
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20210906 Patent event code: PE09021S01D |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20220314 |
|
| A107 | Divisional application of patent | ||
| PA0104 | Divisional application for international application |
Comment text: Divisional Application for International Patent Patent event code: PA01041R01D Patent event date: 20220412 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20220415 Patent event code: PR07011E01D |
|
| PR1002 | Payment of registration fee |
Payment date: 20220418 End annual number: 3 Start annual number: 1 |
|
| PG1601 | Publication of registration |



























