KR870000002B1 - 보호필름의 박리방법 - Google Patents
보호필름의 박리방법 Download PDFInfo
- Publication number
- KR870000002B1 KR870000002B1 KR1019840002489A KR840002489A KR870000002B1 KR 870000002 B1 KR870000002 B1 KR 870000002B1 KR 1019840002489 A KR1019840002489 A KR 1019840002489A KR 840002489 A KR840002489 A KR 840002489A KR 870000002 B1 KR870000002 B1 KR 870000002B1
- Authority
- KR
- South Korea
- Prior art keywords
- protective film
- adhesive tape
- article
- adhesive
- peeling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D491/00—Heterocyclic compounds containing in the condensed ring system both one or more rings having oxygen atoms as the only ring hetero atoms and one or more rings having nitrogen atoms as the only ring hetero atoms, not provided for by groups C07D451/00 - C07D459/00, C07D463/00, C07D477/00 or C07D489/00
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/0004—Component parts, details or accessories; Auxiliary operations
- B29C63/0013—Removing old coatings
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44D—PAINTING OR ARTISTIC DRAWING, NOT OTHERWISE PROVIDED FOR; PRESERVING PAINTINGS; SURFACE TREATMENT TO OBTAIN SPECIAL ARTISTIC SURFACE EFFECTS OR FINISHES
- B44D3/00—Accessories or implements for use in connection with painting or artistic drawing, not otherwise provided for; Methods or devices for colour determination, selection, or synthesis, e.g. use of colour tables
- B44D3/16—Implements or apparatus for removing dry paint from surfaces, e.g. by scraping, by burning
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
- H05B3/34—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater flexible, e.g. heating nets or webs
- H05B3/36—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater flexible, e.g. heating nets or webs heating conductor embedded in insulating material
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10S156/918—Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
- Y10S156/93—Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1168—Gripping and pulling work apart during delaminating
- Y10T156/1179—Gripping and pulling work apart during delaminating with poking during delaminating [e.g., jabbing, etc.]
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
- Separation, Sorting, Adjustment, Or Bending Of Sheets To Be Conveyed (AREA)
Abstract
Description
Claims (3)
- 박판형상 물품의 표면에 첩부된 점착성의 보호필름 표면에 점착테이프를 압착하여, 이 점착테이프의 점착력에 의해서 보호필름을 박판형상으로부터 박리시키는 것에 있어서, 진공흡인대 위에 흡착고정된 박판형상물품의 상면에 첨부된 보호필름의 상면에 점착테이프의 점착면을 압착시킨 다음 이 점착테이프를 사이에 낀 한쌍의 피일링로울러를 박판형상 물품의 상면과 거의 평행으로 이동시키므로서 점착테이프와 함께 보호필름을 박리하거나 박판형상물품의 표면에 첩부된 점착성의 보호필름의 상방에 점착성을 밑으로한 점착테이프를 약간의 간극을 떼서 걸치게 하고, 이어서 이 점착테이프를 이완시켜 보호필름의 표면에 접촉시켜서 이 점착테이프의 점착력에 의한 벗겨지는 힘만으로 보호필름을 박리시켜 이 점착테이프를 권취하는 것을 특징으로 하는 보호필름의 박리방법.
- 제1항에 있어서, 진공흡인대 위에 흡착고정된 박판형성물품의 상면에 첩부된 보호필름의 상방에, 점착층을 밑으로 한 점착테이프를 사이에 낀 한쌍의 피일링로울러를 돌려서, 점착테이프와 약간의 간극을 떼서 보호필름 위에 걸치게 한 뒤, 이 피일링로울러를 역행시켜서 점착테이프를 이완시키므로서, 점착테이프를 보호필름 위에 접촉시키고, 이어서, 피일링로울러를 원위치까지 되돌리므로서 점착테이프와 함께 보호필름을 박리함과 동시에, 이 점착테이프를 감아올리는 것을 특징으로 하는 보호필름의 박리방법.
- 제1항에 있어서, 박리시에 있어서의 피일링로울러의 되돌림 개시로부터 필름의 감아을림을 개시할때까지에 시간차를 설정해서 권상개시를 늦추므로서 박판형상 물품에 기계적인 영향을 주지 않고 보호필름을 벗겨내는 것을 특징으로 하는 보호필름의 박리방법.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58051182A JPS59174677A (ja) | 1983-03-24 | 1983-03-24 | 保護フイルムの剥離方法 |
| JP58-51182 | 1983-03-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR850000297A KR850000297A (ko) | 1985-02-26 |
| KR870000002B1 true KR870000002B1 (ko) | 1987-01-28 |
Family
ID=12879701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019840002489A Expired KR870000002B1 (ko) | 1983-03-24 | 1984-05-09 | 보호필름의 박리방법 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US4775438A (ko) |
| JP (1) | JPS59174677A (ko) |
| KR (1) | KR870000002B1 (ko) |
Families Citing this family (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6155332U (ko) * | 1984-09-17 | 1986-04-14 | ||
| JP2589678B2 (ja) * | 1986-09-03 | 1997-03-12 | 松下電子工業株式会社 | 半導体基板の裏面処理方法 |
| JPH01125947A (ja) * | 1987-11-11 | 1989-05-18 | Ryoji Wakabayashi | 半導体ウェハーの保護膜剥離装置 |
| JP2628349B2 (ja) * | 1988-07-19 | 1997-07-09 | 日東電工株式会社 | 半導体ウエハ保護フィルムの剥離方法 |
| US5154793A (en) * | 1988-09-27 | 1992-10-13 | General Electric Company | Method and apparatus for removing components bonded to a substrate |
| JPH0734433B2 (ja) * | 1988-11-21 | 1995-04-12 | 日東電工株式会社 | 半導体ウエハのテープ貼付け方法およびテープ剥離方法 |
| AT392949B (de) * | 1989-03-17 | 1991-07-10 | Gfm Holding Ag | Vorrichtung zum abnehmen eines flaechigen werkstueckes von einer anklebenden unterfolie |
| JPH0682750B2 (ja) * | 1989-08-30 | 1994-10-19 | 日東電工株式会社 | ウエハ保護シートの剥離方法 |
| JPH04336428A (ja) * | 1991-05-13 | 1992-11-24 | Nitto Denko Corp | ウエハのテープ貼合わせ剥離装置 |
| JP3156419B2 (ja) * | 1993-02-15 | 2001-04-16 | 松下電器産業株式会社 | 異方性導電フィルム保護用セパレータの剥離方法 |
| US5482899A (en) * | 1994-03-21 | 1996-01-09 | Texas Instruments Incorporated | Leveling block for semiconductor demounter |
| US5609714A (en) * | 1994-05-10 | 1997-03-11 | Sterling Dry Imaging, Inc. | Apparatus for dry processing of optical print media |
| US5651846A (en) * | 1995-08-17 | 1997-07-29 | Hurst; Richard Francis | Method and apparatus for removing the printed layer of labels from semirigid containers |
| KR19990028523A (ko) * | 1995-08-31 | 1999-04-15 | 야마모토 히데키 | 반도체웨이퍼의 보호점착테이프의 박리방법 및 그 장치 |
| US5810962A (en) * | 1996-09-30 | 1998-09-22 | Magnatech Computer Services, Inc. | Apparatus and process for removing computer diskette labels |
| US5833073A (en) * | 1997-06-02 | 1998-11-10 | Fluoroware, Inc. | Tacky film frame for electronic device |
| US6149758A (en) * | 1997-06-20 | 2000-11-21 | Lintec Corporation | Sheet removing apparatus and method |
| JPH11162805A (ja) * | 1997-12-02 | 1999-06-18 | Nitto Denko Corp | レジスト除去方法 |
| JP3888754B2 (ja) * | 1997-12-08 | 2007-03-07 | 日東電工株式会社 | 半導体ウエハの自動貼付け装置 |
| JP3504543B2 (ja) * | 1999-03-03 | 2004-03-08 | 株式会社日立製作所 | 半導体素子の分離方法およびその装置並びに半導体素子の搭載方法 |
| JP4166920B2 (ja) * | 2000-02-24 | 2008-10-15 | リンテック株式会社 | シート剥離装置および方法 |
| US7413626B2 (en) * | 2001-01-12 | 2008-08-19 | 3M Innovative Properties Company | Adhesive film removal method and apparatus |
| JP4502547B2 (ja) * | 2000-08-07 | 2010-07-14 | 日東電工株式会社 | 半導体ウエハの保護テープ除去方法およびその装置 |
| DE10046594A1 (de) * | 2000-09-20 | 2002-04-25 | Hermann Werner | Entetikettierverfahren und zugehörige Vorrichtung |
| US20030037877A1 (en) * | 2000-10-18 | 2003-02-27 | Fritz Brinkmann | Delabelling method and device for carrying out said method |
| JP2004512557A (ja) * | 2000-10-18 | 2004-04-22 | ノルデニア ドイチュラント パシメックス ゲーエムベーハー | ラベル除去方法とその方法を実行するための装置 |
| KR100425429B1 (ko) * | 2001-05-02 | 2004-04-08 | 주식회사 엠앤엘 | 코팅 비닐 제거용 진공롤러 장치 |
| JP2003147300A (ja) * | 2001-11-12 | 2003-05-21 | Lintec Corp | ウエハ裏面研削時の表面保護シートおよび半導体チップの製造方法 |
| TWI336603B (en) * | 2004-12-03 | 2011-01-21 | Ngk Spark Plug Co | Method and apparatus for producing a wiring board, including film-peeling |
| JP2007230740A (ja) * | 2006-03-02 | 2007-09-13 | Tokyo Seimitsu Co Ltd | 表面保護フィルム剥離方法および表面保護フィルム剥離装置 |
| JP6099343B2 (ja) * | 2012-09-21 | 2017-03-22 | 株式会社ディスコ | 樹脂剥がし方法及び樹脂剥がし装置 |
| EP2950989B1 (en) * | 2013-01-31 | 2020-03-11 | Compagnie Générale des Etablissements Michelin | Method and apparatus for demolding a tread from a mold |
| JP6914587B2 (ja) * | 2017-05-25 | 2021-08-04 | 株式会社ディスコ | ウェーハの加工方法 |
| CN110938386B (zh) * | 2018-09-25 | 2022-06-28 | 上海和辉光电股份有限公司 | 一种薄膜封装结构保护膜及其褪膜方法 |
| US11130329B2 (en) | 2020-02-07 | 2021-09-28 | The Boeing Company | Apparatus and method for peeling a liner away from a substrate |
| JP2022074816A (ja) * | 2020-11-05 | 2022-05-18 | 三菱電機株式会社 | 清掃装置および清掃方法 |
| CN119176305A (zh) * | 2023-06-21 | 2024-12-24 | 纬创资通(重庆)有限公司 | 除膜设备与揭膜机构 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE791797A (fr) * | 1971-11-23 | 1973-05-23 | Du Pont | Procede et appareil de reproduction d'images par destratification d'unefeuille receptrice qui adhere a un element sensibilise |
| US4029536A (en) * | 1976-04-07 | 1977-06-14 | Western Electric Company, Inc. | Methods of and apparatus for mounting articles to a carrier member |
| JPS5374534A (en) * | 1976-12-15 | 1978-07-03 | Seiko Epson Corp | Method and apparatus for peeling protector paper or release paper |
| US4285759A (en) * | 1979-11-19 | 1981-08-25 | E. I. Du Pont De Nemours And Company | Apparatus for stripping a cover sheet |
| US4421586A (en) * | 1982-09-20 | 1983-12-20 | Ronald Bargman | Process, disposable roller cover, and masking preform for removing adhesive tape |
| JPS59104649A (ja) * | 1982-12-08 | 1984-06-16 | Somar Corp | 保護膜の剥離装置 |
| US4466852A (en) * | 1983-10-27 | 1984-08-21 | At&T Technologies, Inc. | Method and apparatus for demounting wafers |
-
1983
- 1983-03-24 JP JP58051182A patent/JPS59174677A/ja active Granted
-
1984
- 1984-05-09 KR KR1019840002489A patent/KR870000002B1/ko not_active Expired
-
1986
- 1986-10-07 US US06/917,236 patent/US4775438A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59174677A (ja) | 1984-10-03 |
| KR850000297A (ko) | 1985-02-26 |
| JPS6322235B2 (ko) | 1988-05-11 |
| US4775438A (en) | 1988-10-04 |
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