KR920019902A - 내열성접착제 및 이 접착제를 사용한 접착방법 - Google Patents

내열성접착제 및 이 접착제를 사용한 접착방법 Download PDF

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KR920019902A
KR920019902A KR1019920007352A KR920007352A KR920019902A KR 920019902 A KR920019902 A KR 920019902A KR 1019920007352 A KR1019920007352 A KR 1019920007352A KR 920007352 A KR920007352 A KR 920007352A KR 920019902 A KR920019902 A KR 920019902A
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aromatic
polyimide
formula
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KR950011211B1 (ko
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히데아끼 오이까와
쇼오지 타마이
카쯔아끼 이이야마
사부로 카와시마
아끼히로 야마구찌
타다시 아사누마
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사와무라 하루오
미쯔이도오아쯔가가꾸 가부시기가이샤
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • C08G73/1014—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents in the form of (mono)anhydrid
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • C08G73/1017—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents in the form of (mono)amine
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S525/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S525/928—Polyimide or polyamide-acid formed by condensation of a polyamine with a polycarboxylic acid having at least three carboxyl groups or derivatives thereof

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)

Abstract

내용 없음

Description

내열성 접착제 및 이 접착제를 사용한 접착 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (12)

  1. 폴리머사슬말단이 식 (1)
    (식 중, Z은 모노방향족기, 축합폴리방향족기 및 직결 또는 가교원을 통해 서로 연결된 비축합방향족기로 이루어진 군에서 선택된 2가지이다)로 표현된 방향족디카르복실산 무수물로 블록되어 있으며, 실질적으로 식 (2)
    (식 중, Y는
    또는,
    이며, X는 직결, -CO- 또는 -O-의 2가기)로 표현된 반복구조단위로 이뤄진 폴리아미드산 및/또는 폴리이미드로 이루어진 내열성 접착제.
  2. 제 1항에 있어서 식(1)로 표현된 방향족 디카르복실산무수물은 프탈산무수물인 것을 특징으로 하는 내열성 접착제.
  3. 폴리머사슬말단이 식 (3)
    Q-NH2
    (식 중, Q는 모노방향족기, 축향폴리방향족기 및 직결 또는 가교원을 통해 서로 연결된 비축합방향족기로 이루어진 군에서 선택된 1가기이다)로 표현된 방향족모노아민으로 볼록되어 있으며, 실질적으로 식 (2)
    (식 중 Y는
    또는
    이며, X는 직결, -CO- 또는 -O-의 2가기)로 표현된 반복구조단위로 이루어진 폴리아미드산 및/또는 폴리이미드로 이루어진 내열성 접착제.
  4. 제 3항에 있어서, 식 (3)으로 표현된 방향족모노아민은 아닐린인 것을 특징으로 하는 내열성 접착제.
  5. 폴리머사슬말단이 식 (1)
    (식 중, Z은 모노방향족기, 축합폴리방향족기 및 직결 또는 가교원을 통해 서로 연결된 비축합방향족기로 이루어진 군에서 선택된 2가기이다)로 표현된 방향족 디카르복실산 무수물로 블록되어 있으며, 실질적으로, 식 (2)
    (식 중, Y는
    이며, X는 직결, -CO- 또는 -O-의 2가기이다)로 표현된 반복구조단위로 이루어지는 폴리이미드를 가용성용매에 용해시켜 이루어진 폴리이미드계 내열성 접착제.
  6. 제 5항에 있어서, 식 (1)로 표현된 방향족 디카르복실산 무수물은 프탈산 무수물인 것을 특징으로 하는 내열성 접착제.
  7. 폴리머사슬말단이 식 (3)
    Q-NH2
    (식 중, Q는 모노방향족기, 축합폴리방향족기 및 직결 또는 가교원을 통해 서로 연결된 비축합방향족기로 이루어진 군에서 선택된 1가기이다)로 표현된 방향족 모노아민으로 블록되어 있으며, 실질적으로 식 (2)
    (식 중, Y는
    이며, X는 직결, -CO- 또는 -O-의 2가기이다)로 표현된 반복구조단위로 이루어지는 폴리이미드를 가용성 용매에 용해시켜 이루어진 폴리이미드계 내열성 접착제.
  8. 제 7항에 있어서, 식 (3)으로 표현된 방향족 모노아민은 아닐린인 것을 특징으로 하는 내열성 접착제.
  9. 폴리머사슬말단이 식 (1)
    (식 중, Z은 모노방향족기, 축합폴리방향족기 및 직결 또는 가교원에 서로 연결된 비축합방향족기로 이루어지는 군에서 선택된 2가기이다)로 표현된 방향족 디카르복실산 무수물로 블록되어 있으며, 실질적으로 식 (2)
    (식 중, Y는
    이며, X는 직결, -CO- 또는 -O-의 2가기)로 표현된 반복구조단위로 이루어진 폴리이미드를 가용성 용매에 함유하는 폴리이미드 용액을 사용하는 접착 방법.
  10. 제 9항에 있어서, 방향족 디카르복실산 무수물은 프탈산 무수물인 것을 특징으로 하는 접착 방법.
  11. 폴리머사슬말단이 식 (3)
    Q-NH2
    (식 중, Q는 모노방향족기, 축합폴리방향족기 및 직결 또는 가교원을 통해 서로연결된 비축합방향족기로 이루어진 군에서 선택된 1가기이다)로 표현된 방향족 모노아민으로 블록되어 있고, 실질적으로 식 (2)
    (식 중, Y는
    이며, X는 직결, -CO- 또는 -O-의 2가기)로 표현된 반복구조단위로 이루어지는 폴리이미드를 가용성 용매에 함유하는 폴리이미드 용액을 사용하는 접착 방법.
  12. 제 11항에 있어서, 식 (3)으로 표현된 방향족 모노아민은 아닐린인 것을 특징으로 하는 접착 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920007352A 1991-04-30 1992-04-30 내열성접착제 및 이 접착제를 사용한 접착방법 Expired - Lifetime KR950011211B1 (ko)

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Application Number Priority Date Filing Date Title
JP9864791 1991-04-30
JP91-98647 1991-04-30
JP4524892 1992-03-03
JP92-45248 1992-03-03

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KR920019902A true KR920019902A (ko) 1992-11-20
KR950011211B1 KR950011211B1 (ko) 1995-09-29

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US (2) US5252700A (ko)
EP (2) EP0511813B1 (ko)
JP (1) JP2974496B2 (ko)
KR (1) KR950011211B1 (ko)
DE (2) DE69233196T2 (ko)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69115171T2 (de) * 1990-08-27 1996-05-15 Du Pont Flexible Polyimid-Mehrschichtlaminate und ihre Herstellung.
JP3056322B2 (ja) 1992-03-30 2000-06-26 三井化学株式会社 耐熱性接着剤及びその接着方法
US5406124A (en) * 1992-12-04 1995-04-11 Mitsui Toatsu Chemicals, Inc. Insulating adhesive tape, and lead frame and semiconductor device employing the tape
EP0643105A1 (en) * 1993-09-01 1995-03-15 MITSUI TOATSU CHEMICALS, Inc. Polyimide based resin composition
JPH07102196A (ja) * 1993-10-01 1995-04-18 Nitto Denko Corp 電着塗装剤および電着塗装方法
JPH083446A (ja) * 1993-12-27 1996-01-09 Mitsui Toatsu Chem Inc 疲労特性に優れたポリイミド樹脂組成物および射出成形体
US5866676A (en) * 1995-02-14 1999-02-02 The United States Of America As Represented By The United States National Aeronautics And Space Administration Copolyimides prepared from 3,4'-oxydianiline and 1,3-bis(3-aminophenoxy) benzene with 3,3', 4, 4'-biphenylcarboxylic dianhydride
JP3942642B2 (ja) * 1996-12-05 2007-07-11 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 高いＴｇ、高いＴＯＳ、および低い水分率を有するポリイミド
JP3968835B2 (ja) * 1996-12-20 2007-08-29 日本メクトロン株式会社 シロキサンポリイミドを含有する耐熱性接着剤
EP0902048B1 (en) * 1997-09-11 2005-11-23 E.I. Du Pont De Nemours And Company High dielectric constant flexible polyimide film and process of preparation
JP3968884B2 (ja) * 1998-05-01 2007-08-29 日本メクトロン株式会社 感光性組成物
JP3968885B2 (ja) * 1998-05-14 2007-08-29 日本メクトロン株式会社 感光性組成物
KR100503225B1 (ko) * 2000-03-13 2005-07-22 미쯔이카가쿠 가부시기가이샤 폴리이미드의 제조방법
US6294259B1 (en) 2000-07-06 2001-09-25 3M Innovative Properties Company Polyimide hybrid adhesives
US6379486B1 (en) * 2000-07-13 2002-04-30 Xerox Corporation Process for seaming interlocking seams of polyimide component using polyimide adhesive
US6919422B2 (en) * 2003-06-20 2005-07-19 General Electric Company Polyimide resin with reduced mold deposit
US7994274B2 (en) 2003-09-02 2011-08-09 I.S.T. (Ma) Corporation Two-stage cure polyimide oligomers
JPWO2006022265A1 (ja) * 2004-08-23 2008-05-08 旭硝子株式会社 画像表示装置用外囲器、封着材、封着方法、及び画像表示装置
WO2008004615A1 (fr) * 2006-07-07 2008-01-10 Mitsubishi Gas Chemical Company, Inc. Résine polyimide
DE102009003473A1 (de) * 2009-02-12 2010-09-23 Fsd Folienservice Deutschland Gmbh Kaschierverfahren sowie Kaschiervorrichtung
EP2594609B1 (en) * 2010-07-14 2017-01-11 Ube Industries, Ltd. Aqueous polyimide precursor solution composition and method for producing aqueous polyimide precursor solution composition
US8470936B2 (en) * 2011-07-29 2013-06-25 Namics Corporation Liquid epoxy resin composition for semiconductor encapsulation
US9141157B2 (en) * 2011-10-13 2015-09-22 Texas Instruments Incorporated Molded power supply system having a thermally insulated component
RU2534122C1 (ru) * 2013-04-10 2014-11-27 Федеральное государственное бюджетное учреждение науки Институт высокомолекулярных соединений Российской академии наук Термостойкие адгезивы для соединения кристаллов и металлов с полиимидным основанием
US20200317963A1 (en) * 2016-05-23 2020-10-08 Nissan Chemical Corporation Detachable layer-forming composition and detachable layer
KR102733576B1 (ko) * 2018-12-28 2024-11-21 주식회사 두산 폴리아믹산 조성물, 및 이를 이용한 투명 폴리이미드 필름

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4058505A (en) * 1973-05-25 1977-11-15 University Of Notre Dame Du Lac Chain-extending amine end-capped polyimides
US4337110A (en) * 1977-05-09 1982-06-29 Gulf Oil Corporation Laminates prepared from solutions of resins containing amic acid groups
US5116935A (en) * 1987-05-04 1992-05-26 The Boeing Company Polyimide oligomers and blends and method of curing
JPH0765027B2 (ja) * 1984-12-18 1995-07-12 三井東圧化学株式会社 耐熱性接着剤
JPH0765028B2 (ja) * 1985-06-19 1995-07-12 三井東圧化学株式会社 耐熱性接着剤
KR910008340B1 (ko) * 1987-11-05 1991-10-12 미쯔이도오아쯔가가꾸 가부시기가이샤 폴리이미드의 제조법 및 그것으로 이루어진 복합재료
JPH01139632A (ja) * 1987-11-27 1989-06-01 Ube Ind Ltd イミドオリゴマーマトリックスのプリプレグ
CA2002147A1 (en) * 1988-11-07 1990-05-07 Shuichi Morikawa Production process for polyimide fibers
JP2597183B2 (ja) * 1989-04-26 1997-04-02 宇部興産株式会社 末端変性イミドオリゴマー組成物
US5147966A (en) * 1990-07-31 1992-09-15 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Polyimide molding powder, coating, adhesive and matrix resin

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Publication number Publication date
DE69225018T2 (de) 1998-09-10
EP0511813B1 (en) 1998-04-08
EP0728792A2 (en) 1996-08-28
US5300620A (en) 1994-04-05
DE69225018D1 (de) 1998-05-14
JP2974496B2 (ja) 1999-11-10
EP0728792A3 (ko) 1996-09-18
US5252700A (en) 1993-10-12
DE69233196D1 (de) 2003-10-16
EP0511813A3 (en) 1993-08-25
KR950011211B1 (ko) 1995-09-29
EP0728792B1 (en) 2003-09-10
DE69233196T2 (de) 2004-07-15
JPH05306387A (ja) 1993-11-19
EP0511813A2 (en) 1992-11-04

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