MA39682B2 - Substrat de câblage et dispositif photovoltaique. - Google Patents

Substrat de câblage et dispositif photovoltaique.

Info

Publication number
MA39682B2
MA39682B2 MA39682A MA39682A MA39682B2 MA 39682 B2 MA39682 B2 MA 39682B2 MA 39682 A MA39682 A MA 39682A MA 39682 A MA39682 A MA 39682A MA 39682 B2 MA39682 B2 MA 39682B2
Authority
MA
Morocco
Prior art keywords
wiring substrate
photovoltaic device
wiring
pad
panel
Prior art date
Application number
MA39682A
Other languages
English (en)
Inventor
Kazumasa Toya
Takashi Iwasaki
Youichi Nagai
Koji Mori
Kenji Saito
Rui Mikami
Takeshi Yamana
Original Assignee
Sumitomo Electric Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries filed Critical Sumitomo Electric Industries
Publication of MA39682B2 publication Critical patent/MA39682B2/fr

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/10—Semiconductor bodies
    • H10F77/16—Material structures, e.g. crystalline structures, film structures or crystal plane orientations
    • H10F77/169—Thin semiconductor films on metallic or insulating substrates
    • H10F77/1698—Thin semiconductor films on metallic or insulating substrates the metallic or insulating substrates being flexible
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S20/00—Supporting structures for PV modules
    • H02S20/30—Supporting structures being movable or adjustable, e.g. for angle adjustment
    • H02S20/32—Supporting structures being movable or adjustable, e.g. for angle adjustment specially adapted for solar tracking
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S30/00—Structural details of PV modules other than those related to light conversion
    • H02S30/10—Frame structures
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
    • H02S40/20—Optical components
    • H02S40/22—Light-reflecting or light-concentrating means
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
    • H02S40/40—Thermal components
    • H02S40/42—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F10/00—Individual photovoltaic cells, e.g. solar cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/90—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers
    • H10F19/902—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells
    • H10F19/904—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells characterised by the shapes of the structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/42—Optical elements or arrangements directly associated or integrated with photovoltaic cells, e.g. light-reflecting means or light-concentrating means
    • H10F77/484—Refractive light-concentrating means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/93—Interconnections
    • H10F77/933—Interconnections for devices having potential barriers
    • H10F77/935—Interconnections for devices having potential barriers for photovoltaic devices or modules
    • H10F77/939—Output lead wires or elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/046—Planar parts of folded PCBs making an angle relative to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/52—PV systems with concentrators

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Photovoltaic Devices (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
  • Manufacturing & Machinery (AREA)

Abstract

Panneau de câblage (69) sur lequel est montée une partie de génération d'énergie (30). Le panneau de câblage (69) comprend une partie pastille (60) et une partie câblage (63). La largeur de la partie câblage (63) est inférieure à celle de la partie pastille (60).
MA39682A 2014-07-10 2015-07-06 Substrat de câblage et dispositif photovoltaique. MA39682B2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014142327 2014-07-10
PCT/JP2015/069404 WO2016006568A1 (fr) 2014-07-10 2015-07-06 Panneau de câblage et dispositif de génération d'énergie solaire

Publications (1)

Publication Number Publication Date
MA39682B2 true MA39682B2 (fr) 2020-06-30

Family

ID=54829518

Family Applications (4)

Application Number Title Priority Date Filing Date
MA39683A MA39683B1 (fr) 2014-07-10 2015-07-06 Module de generation d'énergie electrique et substrat de câblage
MA39684A MA39684B1 (fr) 2014-07-10 2015-07-06 Module de câblage
MA39681A MA39681B1 (fr) 2014-07-10 2015-07-06 Unité de circuit de génération d'energie electrique.
MA39682A MA39682B2 (fr) 2014-07-10 2015-07-06 Substrat de câblage et dispositif photovoltaique.

Family Applications Before (3)

Application Number Title Priority Date Filing Date
MA39683A MA39683B1 (fr) 2014-07-10 2015-07-06 Module de generation d'énergie electrique et substrat de câblage
MA39684A MA39684B1 (fr) 2014-07-10 2015-07-06 Module de câblage
MA39681A MA39681B1 (fr) 2014-07-10 2015-07-06 Unité de circuit de génération d'energie electrique.

Country Status (7)

Country Link
US (5) US10985286B2 (fr)
JP (4) JP6565912B2 (fr)
CN (6) CN106663711B (fr)
AU (4) AU2015288769B2 (fr)
MA (4) MA39683B1 (fr)
TW (5) TWI656653B (fr)
WO (4) WO2016006573A1 (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6759778B2 (ja) 2016-07-07 2020-09-23 住友電気工業株式会社 集光型太陽光発電モジュール、集光型太陽光発電装置及び水素精製システム
AU2018315806B2 (en) 2017-08-07 2022-10-06 Sumitomo Electric Industries, Ltd. Concentrator photovoltaic module, concentrator photovoltaic panel, and concentrator photovoltaic apparatus
CN110998868B (zh) * 2017-08-07 2023-04-18 住友电气工业株式会社 聚光型光伏模块、聚光型光伏面板、聚光型光伏设备、以及用于制造聚光型光伏模块的方法
CN107453699B (zh) * 2017-08-28 2024-01-23 江西清华泰豪三波电机有限公司 一种光伏组件及光伏装置
US10529881B2 (en) * 2018-03-01 2020-01-07 Solaero Technologies Corp. Interconnect member
WO2020004148A1 (fr) * 2018-06-27 2020-01-02 住友電気工業株式会社 Module de génération d'énergie solaire à concentration et panneau de génération d'énergie solaire à concentration
AU2019293111A1 (en) * 2018-06-27 2021-01-07 Sumitomo Electric Industries, Ltd. Original form body of flexible printed-wiring board, method of manufacturing flexible printed-wiring board, concentrated photovoltaic power generation module, and light emitting module
CN109067346A (zh) * 2018-07-20 2018-12-21 上海空间电源研究所 刚挠结合板太阳电池阵
CN111609370A (zh) * 2020-05-19 2020-09-01 田聪 一种基于电容传感的太阳能路灯雨天可保证亮度的装置
JP2024140456A (ja) * 2023-03-28 2024-10-10 Tdk株式会社 回路基板

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JP2001298217A (ja) * 2000-04-13 2001-10-26 Sumitomo Electric Ind Ltd 光モジュール
JP2005051133A (ja) 2003-07-31 2005-02-24 Canon Inc プリント配線基板
US7550097B2 (en) * 2003-09-03 2009-06-23 Momentive Performance Materials, Inc. Thermal conductive material utilizing electrically conductive nanoparticles
US8153886B1 (en) * 2003-10-20 2012-04-10 Amonix, Inc. Method of improving the efficiency of loosely packed solar cells in dense array applications
JP4648063B2 (ja) 2005-04-19 2011-03-09 日東電工株式会社 カテーテル用フレキシブル配線回路基板、並びに、該フレキシブル配線回路基板を用いたカテーテル及びその製造方法
JP2007019334A (ja) * 2005-07-08 2007-01-25 Mitsubishi Electric Corp 太陽電池装置
US8759138B2 (en) * 2008-02-11 2014-06-24 Suncore Photovoltaics, Inc. Concentrated photovoltaic system modules using III-V semiconductor solar cells
US20110024162A1 (en) * 2008-04-21 2011-02-03 Sumitomo Bakelite Co., Ltd. Flexible wiring unit and electronic apparatus
EP2320470A4 (fr) * 2008-08-08 2015-11-04 Sphelar Power Corp Module de batteries solaires pour éclairage naturel
JP5360223B2 (ja) 2009-10-05 2013-12-04 株式会社村田製作所 回路基板
EP2362432B1 (fr) * 2010-02-25 2017-06-07 Saint-Augustin Canada Electric Inc. Ensemble de cellule solaire
JP5853374B2 (ja) 2010-03-12 2016-02-09 オムロン株式会社 照明装置
JP2011210747A (ja) 2010-03-26 2011-10-20 Mitsubishi Chemicals Corp 太陽電池モジュール及びその製造方法
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JP2013012605A (ja) * 2011-06-29 2013-01-17 Sharp Corp 集光型太陽光発電装置、および集光型太陽光発電装置の製造方法
WO2013031298A1 (fr) * 2011-08-31 2013-03-07 三洋電機株式会社 Module de cellules solaires, et procédé de fabrication de celui-ci
JP6172461B2 (ja) * 2011-09-23 2017-08-02 パナソニックＩｐマネジメント株式会社 太陽電池モジュール及び太陽電池
JP5814725B2 (ja) * 2011-10-03 2015-11-17 住友電気工業株式会社 集光型太陽光発電モジュール及び集光型太陽光発電パネル
JP5214005B2 (ja) * 2011-10-12 2013-06-19 シャープ株式会社 集光型太陽電池モジュール及び太陽光発電システム
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Also Published As

Publication number Publication date
CN106663711B (zh) 2019-03-29
US20170200836A1 (en) 2017-07-13
CN106537612A (zh) 2017-03-22
TW201613120A (en) 2016-04-01
TW201607057A (zh) 2016-02-16
AU2015288769B2 (en) 2020-04-30
US20170201208A1 (en) 2017-07-13
AU2015288771B2 (en) 2020-06-25
JP6551409B2 (ja) 2019-07-31
MA39683B1 (fr) 2019-06-28
WO2016006573A1 (fr) 2016-01-14
AU2015288774A1 (en) 2017-01-12
MA39681B1 (fr) 2019-06-28
JP6551408B2 (ja) 2019-07-31
MA39684A1 (fr) 2018-02-28
TWI658604B (zh) 2019-05-01
JPWO2016006571A1 (ja) 2017-04-27
US20170213923A1 (en) 2017-07-27
CN106663711A (zh) 2017-05-10
JPWO2016006570A1 (ja) 2017-04-27
TWI666786B (zh) 2019-07-21
CN204885177U (zh) 2015-12-16
CN106537610A (zh) 2017-03-22
CN106537610B (zh) 2018-05-08
US11101395B2 (en) 2021-08-24
WO2016006570A1 (fr) 2016-01-14
MA39684B1 (fr) 2020-03-31
MA39681A1 (fr) 2018-01-31
AU2015288771A1 (en) 2017-01-12
WO2016006568A1 (fr) 2016-01-14
JP6565912B2 (ja) 2019-08-28
CN105261661B (zh) 2019-01-08
TW201607058A (zh) 2016-02-16
TWI661569B (zh) 2019-06-01
JP6520943B2 (ja) 2019-05-29
CN106537611B (zh) 2019-03-15
US20160013337A1 (en) 2016-01-14
AU2015288774B2 (en) 2020-03-12
CN105261661A (zh) 2016-01-20
TWI666781B (zh) 2019-07-21
WO2016006571A1 (fr) 2016-01-14
AU2015288769A1 (en) 2017-01-12
US10680127B2 (en) 2020-06-09
JPWO2016006573A1 (ja) 2017-04-27
MA39683A1 (fr) 2018-01-31
US20170213928A1 (en) 2017-07-27
AU2015288772A1 (en) 2017-01-12
TWI656653B (zh) 2019-04-11
US9923107B2 (en) 2018-03-20
TW201613119A (en) 2016-04-01
CN106537611A (zh) 2017-03-22
AU2015288772B2 (en) 2020-06-25
US10985286B2 (en) 2021-04-20
TW201611311A (zh) 2016-03-16
CN106537612B (zh) 2019-03-01
JPWO2016006568A1 (ja) 2017-04-27

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