MY183375A - Surface treated copper foil, copper clad laminate, printed wiring board, electronic apparatus and method for manufacturing printed wiring board - Google Patents

Surface treated copper foil, copper clad laminate, printed wiring board, electronic apparatus and method for manufacturing printed wiring board

Info

Publication number
MY183375A
MY183375A MYPI2016702133A MYPI2016702133A MY183375A MY 183375 A MY183375 A MY 183375A MY PI2016702133 A MYPI2016702133 A MY PI2016702133A MY PI2016702133 A MYPI2016702133 A MY PI2016702133A MY 183375 A MY183375 A MY 183375A
Authority
MY
Malaysia
Prior art keywords
copper foil
surface treated
wiring board
printed wiring
treated copper
Prior art date
Application number
MYPI2016702133A
Inventor
Hideta Arai
Atsushi Miki
Kohsuke Arai
Kaichiro Nakamuro
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of MY183375A publication Critical patent/MY183375A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Laser Beam Processing (AREA)

Abstract

A surface treated copper foil which is well bonded to a resin and achieves excellent visibility in observation through the resin is provided. A surface treated copper foil having one surface and other surface each surface treated, wherein a copper clad laminate formed by lamination of the surface treated copper foil to a polyimide in which the following ?B (PI) is 50 or more and 65 or less has a surface color difference ?E*ab based on JIS 28730 through the polyimide, of 50 or more. In the case that the copper foil is photographed through the polyimide, a surface treated surface of which is laminated, with a CCD camera to produce an observation spot versus brightness graph, ?B (?B ? Bt -Bb) is 40 or more. The other surface treated copper foil surface of the surface treated copper foil has a TD ten-spot average roughness Rz measured with a laser microscope using laser light having a wavelength of 405 nm of, 0.35 ?m or more. Figure 1
MYPI2016702133A 2013-12-10 2014-12-10 Surface treated copper foil, copper clad laminate, printed wiring board, electronic apparatus and method for manufacturing printed wiring board MY183375A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013255472 2013-12-10
PCT/JP2014/082766 WO2015087942A1 (en) 2013-12-10 2014-12-10 Treated surface copper foil, copper-clad laminate, printed wiring board, electronic device, and printed wiring board manufacturing method

Publications (1)

Publication Number Publication Date
MY183375A true MY183375A (en) 2021-02-18

Family

ID=53371241

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2016702133A MY183375A (en) 2013-12-10 2014-12-10 Surface treated copper foil, copper clad laminate, printed wiring board, electronic apparatus and method for manufacturing printed wiring board

Country Status (7)

Country Link
JP (1) JP5819571B1 (en)
KR (1) KR101944166B1 (en)
CN (1) CN105980609B (en)
MY (1) MY183375A (en)
PH (1) PH12016501130A1 (en)
TW (1) TWI573500B (en)
WO (1) WO2015087942A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6895936B2 (en) * 2018-09-28 2021-06-30 古河電気工業株式会社 Surface-treated copper foil, and copper-clad laminates and circuit boards using this

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2849059B2 (en) 1995-09-28 1999-01-20 日鉱グールド・フォイル株式会社 Processing method of copper foil for printed circuit
US6984456B2 (en) 2002-05-13 2006-01-10 Mitsui Mining & Smelting Co., Ltd. Flexible printed wiring board for chip-on flexibles
JP2004098659A (en) 2002-07-19 2004-04-02 Ube Ind Ltd Copper-clad laminate and its manufacturing process
JP3977790B2 (en) * 2003-09-01 2007-09-19 古河サーキットフォイル株式会社 Manufacturing method of ultra-thin copper foil with carrier, ultra-thin copper foil manufactured by the manufacturing method, printed wiring board using the ultra-thin copper foil, multilayer printed wiring board, chip-on-film wiring board
MY150825A (en) * 2008-11-25 2014-02-28 Jx Nippon Mining & Metals Corp Copper foil for printed circuit
JP5467930B2 (en) * 2010-05-19 2014-04-09 Ｊｘ日鉱日石金属株式会社 Copper clad laminate
JP5124039B2 (en) * 2011-03-23 2013-01-23 Ｊｘ日鉱日石金属株式会社 Copper foil and copper-clad laminate using the same
JP5148726B2 (en) * 2011-03-30 2013-02-20 Ｊｘ日鉱日石金属株式会社 Electrolytic copper foil and method for producing electrolytic copper foil
JP5074611B2 (en) * 2011-03-30 2012-11-14 Ｊｘ日鉱日石金属株式会社 Electrolytic copper foil for secondary battery negative electrode current collector and method for producing the same
TWI503062B (en) * 2012-05-21 2015-10-01 Ｊｘ日鑛日石金屬股份有限公司 Surface treatment of copper foil and the use of its laminated board, printed wiring board, electronic equipment and manufacturing

Also Published As

Publication number Publication date
TWI573500B (en) 2017-03-01
PH12016501130A1 (en) 2016-07-18
KR20160086378A (en) 2016-07-19
WO2015087942A1 (en) 2015-06-18
KR101944166B1 (en) 2019-01-30
JPWO2015087942A1 (en) 2017-03-16
JP5819571B1 (en) 2015-11-24
CN105980609A (en) 2016-09-28
TW201532485A (en) 2015-08-16
CN105980609B (en) 2018-08-07

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