MY196755A - Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device - Google Patents
Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic deviceInfo
- Publication number
- MY196755A MY196755A MYPI2017704627A MYPI2017704627A MY196755A MY 196755 A MY196755 A MY 196755A MY PI2017704627 A MYPI2017704627 A MY PI2017704627A MY PI2017704627 A MYPI2017704627 A MY PI2017704627A MY 196755 A MY196755 A MY 196755A
- Authority
- MY
- Malaysia
- Prior art keywords
- copper foil
- surface treatment
- treatment layer
- surface treated
- manufacturing
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 8
- 239000011889 copper foil Substances 0.000 title abstract 8
- 238000004519 manufacturing process Methods 0.000 title 2
- 238000000034 method Methods 0.000 title 2
- 239000002335 surface treatment layer Substances 0.000 abstract 11
- 230000008021 deposition Effects 0.000 abstract 3
- 239000010410 layer Substances 0.000 abstract 3
- 239000011164 primary particle Substances 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 230000005540 biological transmission Effects 0.000 abstract 1
- 230000002349 favourable effect Effects 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- 239000011163 secondary particle Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/24—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing hexavalent chromium compounds
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Electrochemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Disclosed is a surface treated copper foil, which is capable of favorably reducing the transmission loss even when used in a high frequency circuit substrate, and after laminating with a resin, heating at a predetermined temperature for a predetermined time (at 180? C. for 10 days), the peel strength of the surface treated copper foil and the resin is favorable. Also disclosed is a surface treated copper foil, comprising a copper foil, and a surface treatment layer on one or both sides of the copper foil, wherein the surface treatment layer has a primary particle layer, or has a primary particle layer and s secondary particle layer in this order from the side of the copper foil; the surface treatment layer contains Zn, a deposition amount of Zn in the surface treatment layer is 150 ?g/dm? or more; the surface treatment layer does not contain Ni, or in the case where the surface treatment layer contains Ni, a deposition amount of Ni in the surface treatment layer is 800 ?g/dm? or less; the surface treatment layer does not contain Co, or in the case where the surface treatment layer contains Co, a deposition amount of Co in the surface treatment layer is 3000 ?g/dm? or less; and a ten point average roughness Rz of an outermost surface of the surface treatment layer is 1.5 ?m or less. (Fig. 1)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016236250 | 2016-12-05 | ||
| JP2017205410A JP7409760B2 (en) | 2016-12-05 | 2017-10-24 | Method for manufacturing surface-treated copper foil, copper foil with carrier, laminate, printed wiring board, and manufacturing method for electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY196755A true MY196755A (en) | 2023-05-03 |
Family
ID=62565175
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2017704627A MY196755A (en) | 2016-12-05 | 2017-11-30 | Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device |
Country Status (5)
| Country | Link |
|---|---|
| JP (2) | JP7409760B2 (en) |
| KR (1) | KR20180064311A (en) |
| MY (1) | MY196755A (en) |
| PH (1) | PH12017000346A1 (en) |
| TW (1) | TWI705738B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI924627B (en) * | 2018-07-18 | 2026-05-11 | 日商力森諾科股份有限公司 | Manufacturing methods of copper-clad laminates, printed circuit boards, semiconductor packages, and copper-clad laminates |
| CN113365804A (en) * | 2019-01-30 | 2021-09-07 | Ａｇｃ株式会社 | Laminate and method for producing same, method for producing composite laminate, and method for producing polymer film |
| JP2021095596A (en) * | 2019-12-13 | 2021-06-24 | Ｊｘ金属株式会社 | Surface-treated copper foil, copper-clad laminate, and printed wiring board |
| JP7300976B2 (en) * | 2019-12-13 | 2023-06-30 | Ｊｘ金属株式会社 | Surface treated copper foil, copper clad laminate and printed wiring board |
| JP7752116B2 (en) * | 2020-07-16 | 2025-10-09 | 三井金属鉱業株式会社 | Method for manufacturing copper-clad laminate and printed wiring board |
| US12262469B2 (en) | 2020-07-16 | 2025-03-25 | Mitsui Mining & Smelting Co., Ltd. | Copper-clad laminate plate and printed wiring board |
| KR102789764B1 (en) * | 2021-12-22 | 2025-04-03 | 롯데에너지머티리얼즈 주식회사 | Surface-treated copper foil with heat resistance, copper clad laminate comprising the same, and printed wiring board comprising the same |
| KR102889712B1 (en) * | 2022-08-30 | 2025-11-21 | 롯데에너지머티리얼즈 주식회사 | Surface-treated copper foil with pillar type nodule structure, copper clad laminate comprising the same, and printed wiring board comprising the same |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW511408B (en) * | 2000-09-18 | 2002-11-21 | Nippon Denkai Kk | Method of producing copper foil for fine wiring |
| CN1217564C (en) * | 2001-05-14 | 2005-08-31 | 日本电解株式会社 | Roughened copper foil and making method thereof |
| JP4161304B2 (en) | 2003-02-04 | 2008-10-08 | 古河サーキットフォイル株式会社 | Metal foil for high frequency circuits |
| JP2004244656A (en) * | 2003-02-12 | 2004-09-02 | Furukawa Techno Research Kk | Copper foil for high frequency applications and its manufacturing method |
| JP4704025B2 (en) | 2004-12-21 | 2011-06-15 | Ｊｘ日鉱日石金属株式会社 | Roughening rolled copper foil for high frequency circuit and method for producing the same |
| JP5885054B2 (en) * | 2010-04-06 | 2016-03-15 | 福田金属箔粉工業株式会社 | A treated copper foil for a copper clad laminate, a copper clad laminate obtained by bonding the treated copper foil to an insulating resin substrate, and a printed wiring board using the copper clad laminate. |
| US9580829B2 (en) * | 2010-05-07 | 2017-02-28 | Jx Nippon Mining & Metals Corporation | Copper foil for printed circuit |
| JP5204908B1 (en) * | 2012-03-26 | 2013-06-05 | Ｊｘ日鉱日石金属株式会社 | Copper foil with carrier, method for producing copper foil with carrier, copper foil with carrier for printed wiring board and printed wiring board |
| MY172405A (en) * | 2012-03-29 | 2019-11-23 | Jx Nippon Mining & Metals Corp | Surface-treated copper foil |
| JP5362922B1 (en) * | 2012-10-12 | 2013-12-11 | Ｊｘ日鉱日石金属株式会社 | Surface-treated copper foil and laminate using the same |
| CN104685109B (en) * | 2012-09-28 | 2017-12-05 | Jx日矿日石金属株式会社 | Copper foil with carrier and copper clad laminate using copper foil with carrier |
| JP5758033B2 (en) * | 2013-08-20 | 2015-08-05 | Jx日鉱日石金属株式会社 | Surface-treated copper foil, laminate using the same, printed wiring board, electronic device, and method for manufacturing printed wiring board |
| JP2015200026A (en) * | 2014-03-31 | 2015-11-12 | Jx日鉱日石金属株式会社 | Copper foil with carrier, printed wiring board, laminate, laminated board, electronic device and method for producing printed wiring board |
| JP6591766B2 (en) * | 2014-04-24 | 2019-10-16 | Ｊｘ金属株式会社 | Copper foil with carrier, printed wiring board, laminate, electronic device and method for manufacturing printed wiring board |
| JP2015105440A (en) * | 2014-11-21 | 2015-06-08 | Jx日鉱日石金属株式会社 | Surface-treated copper foil, laminated board, printed wiring board, printed circuit board, and electronic equipment |
-
2017
- 2017-10-24 JP JP2017205410A patent/JP7409760B2/en active Active
- 2017-10-25 TW TW106136727A patent/TWI705738B/en active
- 2017-11-30 MY MYPI2017704627A patent/MY196755A/en unknown
- 2017-12-05 PH PH12017000346A patent/PH12017000346A1/en unknown
- 2017-12-05 KR KR1020170165727A patent/KR20180064311A/en not_active Ceased
-
2022
- 2022-11-25 JP JP2022188523A patent/JP2023037628A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| KR20180064311A (en) | 2018-06-14 |
| JP2023037628A (en) | 2023-03-15 |
| TW201822597A (en) | 2018-06-16 |
| PH12017000346A1 (en) | 2018-07-30 |
| JP7409760B2 (en) | 2024-01-09 |
| JP2018090903A (en) | 2018-06-14 |
| TWI705738B (en) | 2020-09-21 |
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