MY204478A - Surface-treated copper foil, copper-cladded laminate, and manufacturing method for printed wiring board - Google Patents

Surface-treated copper foil, copper-cladded laminate, and manufacturing method for printed wiring board

Info

Publication number
MY204478A
MY204478A MYPI2020004828A MYPI2020004828A MY204478A MY 204478 A MY204478 A MY 204478A MY PI2020004828 A MYPI2020004828 A MY PI2020004828A MY PI2020004828 A MYPI2020004828 A MY PI2020004828A MY 204478 A MY204478 A MY 204478A
Authority
MY
Malaysia
Prior art keywords
copper foil
deposited
wiring board
printed wiring
amount
Prior art date
Application number
MYPI2020004828A
Inventor
Ayumu Tateoka
Yasuji Hara
Shota Kawaguchi
Original Assignee
Mitsui Mining & Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co Ltd filed Critical Mitsui Mining & Smelting Co Ltd
Publication of MY204478A publication Critical patent/MY204478A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/38—Chromatising
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2222/00—Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
    • C23C2222/20—Use of solutions containing silanes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

A surface-treated copper foil is provided that is superior in adhesion to a resin, chemical resistance, and heat resistance, and is less likely to leave residues after etching, and thus can improve reliability of adhesion both between the copper foil and a substrate and between substrates in production of a printed wiring board. The surface-treated copper foil includes a copper foil; and a Zn-Ni-Mo layer disposed on at least one face of the copper foil and containing deposited Zn in an amount of 3 mg/m2 to 100 mg/m2, deposited Ni in an amount of 5 mg/m2 to 60 mg/m2, and deposited Mo in an amount of 2.0 mg/m2 to 40 mg/m2. The ratio Ni/(Zn+Ni+Mo) of the amount of the deposited Ni to the total amount of the deposited Zn, Ni, and Mo is 0.40 to 0.80.
MYPI2020004828A 2018-03-27 2019-03-22 Surface-treated copper foil, copper-cladded laminate, and manufacturing method for printed wiring board MY204478A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018059562 2018-03-27
PCT/JP2019/012236 WO2019188837A1 (en) 2018-03-27 2019-03-22 Surface-treated copper foil, copper-cladded laminate, and manufacturing method for printed wiring board

Publications (1)

Publication Number Publication Date
MY204478A true MY204478A (en) 2024-08-30

Family

ID=68061792

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2020004828A MY204478A (en) 2018-03-27 2019-03-22 Surface-treated copper foil, copper-cladded laminate, and manufacturing method for printed wiring board

Country Status (6)

Country Link
JP (1) JP6975845B2 (en)
KR (1) KR102382750B1 (en)
CN (1) CN111902570B (en)
MY (1) MY204478A (en)
TW (1) TWI691623B (en)
WO (1) WO2019188837A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI924627B (en) * 2018-07-18 2026-05-11 日商力森諾科股份有限公司 Manufacturing methods of copper-clad laminates, printed circuit boards, semiconductor packages, and copper-clad laminates
JP2023040316A (en) * 2020-02-21 2023-03-23 三井金属鉱業株式会社 Surface-treated metallic foil and metal clad laminate
TWI905166B (en) * 2020-04-09 2025-11-21 日商大日本印刷股份有限公司 Wiring substrate and its manufacturing method
JP2023051784A (en) * 2021-09-30 2023-04-11 ナミックス株式会社 copper material
CN115928162A (en) * 2022-12-13 2023-04-07 国网辽宁省电力有限公司锦州供电公司 A kind of alloy electroplating solution and electroplating method for pole tower of overhead transmission line
JP7434656B1 (en) 2023-08-31 2024-02-20 Ｊｘ金属株式会社 Method for manufacturing surface-treated copper foil, copper-clad laminate, and printed wiring board

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62142389A (en) 1985-12-17 1987-06-25 福田金属箔粉工業株式会社 Copper foil for printed circuit and manufacture of the same
JPH0453180A (en) * 1990-06-18 1992-02-20 Mitsubishi Gas Chem Co Inc Manufacture of high-frequency copper-plated board
JP2002329959A (en) * 2001-04-27 2002-11-15 Hitachi Chem Co Ltd Printed wiring board and method of manufacturing the same
JP2005353918A (en) * 2004-06-11 2005-12-22 Hitachi Cable Ltd Copper foil for printed wiring board and method for producing the same
JP2008179127A (en) * 2007-01-15 2008-08-07 Ls Cable Ltd Copper foil laminated structure and copper foil surface treatment method
JP5129642B2 (en) 2007-04-19 2013-01-30 三井金属鉱業株式会社 Surface treated copper foil, copper clad laminate obtained using the surface treated copper foil, and printed wiring board obtained using the copper clad laminate
KR101295472B1 (en) * 2008-12-26 2013-08-09 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 Rolled copper foil or electrolytic copper foil for electronic circuit and method of forming electronic circuit using same
JP5634103B2 (en) * 2010-04-06 2014-12-03 福田金属箔粉工業株式会社 A treated copper foil for a copper clad laminate, a copper clad laminate obtained by bonding the treated copper foil to an insulating resin substrate, and a printed wiring board using the copper clad laminate.
JP6111017B2 (en) * 2012-02-03 2017-04-05 Ｊｘ金属株式会社 Copper foil for printed wiring board, laminate using the same, printed wiring board, and electronic component
JP2016084533A (en) * 2014-10-22 2016-05-19 Ｊｘ金属株式会社 Surface treated metal material, metal foil with carrier, connector, terminal, laminate, shield tape, shield material, printed wiring board, metal processing member, manufacturing method of electronic apparatus and manufacturing method of printed wiring board
KR20170038969A (en) * 2015-09-30 2017-04-10 일진머티리얼즈 주식회사 Surface-treated Copper Foil for PCB having fine-circuit pattern and Method of manufacturing of the same
CN109496223B (en) * 2016-07-25 2022-05-24 日东电工株式会社 Porous low dielectric polymer film and film for millimeter wave antenna

Also Published As

Publication number Publication date
KR102382750B1 (en) 2022-04-08
CN111902570A (en) 2020-11-06
KR20200105705A (en) 2020-09-08
TW201942422A (en) 2019-11-01
CN111902570B (en) 2022-11-08
WO2019188837A1 (en) 2019-10-03
TWI691623B (en) 2020-04-21
JPWO2019188837A1 (en) 2020-12-10
JP6975845B2 (en) 2021-12-01

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