MY8600478A - Composition of materials for forming protective film in semiconductor device - Google Patents
Composition of materials for forming protective film in semiconductor deviceInfo
- Publication number
- MY8600478A MY8600478A MY478/86A MY8600478A MY8600478A MY 8600478 A MY8600478 A MY 8600478A MY 478/86 A MY478/86 A MY 478/86A MY 8600478 A MY8600478 A MY 8600478A MY 8600478 A MY8600478 A MY 8600478A
- Authority
- MY
- Malaysia
- Prior art keywords
- composition
- materials
- semiconductor device
- protective film
- forming protective
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
- H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
- H10P14/6922—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/54—Nitrogen-containing linkages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6326—Deposition processes
- H10P14/6342—Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Formation Of Insulating Films (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57101027A JPS58218127A (ja) | 1982-06-11 | 1982-06-11 | 半導体装置の保護被膜材料用組成物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY8600478A true MY8600478A (en) | 1986-12-31 |
Family
ID=14289701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MY478/86A MY8600478A (en) | 1982-06-11 | 1986-12-30 | Composition of materials for forming protective film in semiconductor device |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4497922A (fr) |
| JP (1) | JPS58218127A (fr) |
| GB (1) | GB2123017B (fr) |
| MY (1) | MY8600478A (fr) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60240730A (ja) * | 1984-05-15 | 1985-11-29 | Chisso Corp | 可溶性イミドオリゴマーの製法 |
| US4675350A (en) * | 1984-11-13 | 1987-06-23 | Westinghouse Electric Corp. | Compatible self-crosslinking poly (amide-imide) polyepoxide resin blends and laminates made therewith |
| US4741939A (en) * | 1985-10-23 | 1988-05-03 | Westinghouse Electric Corp. | Compatible self-crosslinking poly (amide-imide) polyepoxide resin blends and laminates made therewith |
| JPH0740587B2 (ja) * | 1985-12-26 | 1995-05-01 | 松下電子工業株式会社 | 半導体装置の製造方法 |
| US4847358A (en) * | 1986-09-19 | 1989-07-11 | Hitachi Chemical Company, Ltd. | Process for producing polyamide acid having siloxane bonds and polyimide having siloxane bonds and isoindoloquinazolinedione rings |
| US5094919A (en) * | 1988-06-30 | 1992-03-10 | Nippon Steel Chemical Co., Ltd. | Polyimide copolymers and process for preparing the same |
| US5260413A (en) * | 1990-02-05 | 1993-11-09 | E. I. Du Pont De Nemours And Company | Coated, heat-sealable aromatic polyimide film having superior compressive strength |
| TW294702B (fr) * | 1994-03-08 | 1997-01-01 | Sumitomo Bakelite Co | |
| JP2002012666A (ja) * | 2000-06-29 | 2002-01-15 | Shin Etsu Chem Co Ltd | ポリイミドシリコーン樹脂、その製造方法およびその組成物 |
| JP5346078B2 (ja) * | 2008-05-20 | 2013-11-20 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 熱および寸法安定性ポリイミドフィルム、ならびに、これに関する方法 |
| JP5870627B2 (ja) * | 2011-11-01 | 2016-03-01 | 富士通株式会社 | 半導体装置の製造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4395527A (en) * | 1978-05-17 | 1983-07-26 | M & T Chemicals Inc. | Siloxane-containing polymers |
| JPS581685B2 (ja) * | 1980-08-27 | 1983-01-12 | 日立化成工業株式会社 | シロキサン結合を含むポリアミド酸及びシロキサン結合とイソインドロキナゾリンジオン環を有するポリイミドの製造法 |
-
1982
- 1982-06-11 JP JP57101027A patent/JPS58218127A/ja active Granted
-
1983
- 1983-06-06 US US06/501,151 patent/US4497922A/en not_active Expired - Lifetime
- 1983-06-06 GB GB08315457A patent/GB2123017B/en not_active Expired
-
1986
- 1986-12-30 MY MY478/86A patent/MY8600478A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| GB8315457D0 (en) | 1983-07-13 |
| GB2123017B (en) | 1985-07-10 |
| JPS6352772B2 (fr) | 1988-10-20 |
| US4497922A (en) | 1985-02-05 |
| GB2123017A (en) | 1984-01-25 |
| JPS58218127A (ja) | 1983-12-19 |
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