NO20040067L - Ammoniakkfrei alkaliske mikroelektroniske rengjoringssammensetninger med forbedret substratkompatibilitet - Google Patents

Ammoniakkfrei alkaliske mikroelektroniske rengjoringssammensetninger med forbedret substratkompatibilitet

Info

Publication number
NO20040067L
NO20040067L NO20040067A NO20040067A NO20040067L NO 20040067 L NO20040067 L NO 20040067L NO 20040067 A NO20040067 A NO 20040067A NO 20040067 A NO20040067 A NO 20040067A NO 20040067 L NO20040067 L NO 20040067L
Authority
NO
Norway
Prior art keywords
cleaning
cleaning compositions
ammonia
improved substrate
free alkaline
Prior art date
Application number
NO20040067A
Other languages
English (en)
Norwegian (no)
Inventor
Chien-Pin Sherman Hsu
Original Assignee
Mallinckrodt Baker Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mallinckrodt Baker Inc filed Critical Mallinckrodt Baker Inc
Publication of NO20040067L publication Critical patent/NO20040067L/no

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/26—Organic compounds containing nitrogen
    • C11D3/28—Heterocyclic compounds containing nitrogen in the ring
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/0005—Other compounding ingredients characterised by their effect
    • C11D3/0073—Anticorrosion compositions
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/26—Organic compounds containing nitrogen
    • C11D3/30—Amines; Substituted amines ; Quaternized amines
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/26—Organic compounds containing nitrogen
    • C11D3/33—Amino carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/43—Solvents
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3218—Alkanolamines or alkanolimines
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3263—Amides or imides
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3281—Heterocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C11D7/5004—Organic solvents
    • C11D7/5013—Organic solvents containing nitrogen
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/426—Stripping or agents therefor using liquids only containing organic halogen compounds; containing organic sulfonic acids or salts thereof; containing sulfoxides
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/34—Organic compounds containing sulfur

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Detergent Compositions (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
NO20040067A 2001-07-09 2004-01-08 Ammoniakkfrei alkaliske mikroelektroniske rengjoringssammensetninger med forbedret substratkompatibilitet NO20040067L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US30431201P 2001-07-09 2001-07-09
PCT/US2002/021374 WO2003006597A1 (en) 2001-07-09 2002-07-08 Ammonia-free alkaline microelectronic cleaning compositions with improved substrate compatibility

Publications (1)

Publication Number Publication Date
NO20040067L true NO20040067L (no) 2004-03-05

Family

ID=23175967

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20040067A NO20040067L (no) 2001-07-09 2004-01-08 Ammoniakkfrei alkaliske mikroelektroniske rengjoringssammensetninger med forbedret substratkompatibilitet

Country Status (17)

Country Link
EP (1) EP1404796B1 (de)
JP (1) JP4177758B2 (de)
KR (2) KR20040018437A (de)
CN (2) CN102399651A (de)
AT (1) ATE545695T1 (de)
AU (1) AU2002320305A1 (de)
BR (1) BR0211054A (de)
CA (1) CA2452884C (de)
IL (2) IL159761A0 (de)
IN (1) IN2004CH00042A (de)
MY (1) MY139607A (de)
NO (1) NO20040067L (de)
PL (1) PL199501B1 (de)
RS (1) RS904A (de)
TW (1) TWI292437B (de)
WO (1) WO2003006597A1 (de)
ZA (1) ZA200400064B (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040192938A1 (en) 2003-03-24 2004-09-30 Manzer Leo Ernest Production of 5-mehyl-N-aryl-2-pyrrolidone and 5-methyl-N-alkyl-2-pyrrolidone by reductive of levulinic acid esters with aryl and alkyl amines
BRPI0413657A (pt) * 2003-08-19 2006-10-24 Mallinckrodt Baker Inc Composição aquosa, isenta de silicato, para limpeza de substratos microeletrÈnicos, bem como processo para limpeza de um substrato microeletrÈnico sem produzir qualquer corrosão metálica substancial
WO2006081406A1 (en) * 2005-01-27 2006-08-03 Advanced Technology Materials, Inc. Compositions for processing of semiconductor substrates
US8263539B2 (en) 2005-10-28 2012-09-11 Dynaloy, Llc Dynamic multi-purpose composition for the removal of photoresists and methods for its use
US7632796B2 (en) 2005-10-28 2009-12-15 Dynaloy, Llc Dynamic multi-purpose composition for the removal of photoresists and method for its use
US9329486B2 (en) 2005-10-28 2016-05-03 Dynaloy, Llc Dynamic multi-purpose composition for the removal of photoresists and method for its use
CN101611130B (zh) 2007-02-14 2011-05-18 安万托特性材料股份有限公司 用于去除蚀刻残余物以过氧化物活化的金属氧酸盐为基础的制剂
CN102177230B (zh) * 2008-10-09 2014-02-19 安万托特性材料股份有限公司 用于去除铜的氧化物蚀刻残余物和防止铜电沉积的含水酸性制剂
US8298751B2 (en) 2009-11-02 2012-10-30 International Business Machines Corporation Alkaline rinse agents for use in lithographic patterning
WO2012161790A1 (en) * 2011-02-24 2012-11-29 John Moore Concentrated chemical composition and method for removing photoresist during microelectric fabrication
US9158202B2 (en) * 2012-11-21 2015-10-13 Dynaloy, Llc Process and composition for removing substances from substrates
US10072237B2 (en) * 2015-08-05 2018-09-11 Versum Materials Us, Llc Photoresist cleaning composition used in photolithography and a method for treating substrate therewith
CN113454759A (zh) * 2019-02-15 2021-09-28 日产化学株式会社 清洗剂组合物以及清洗方法
WO2020166704A1 (ja) * 2019-02-15 2020-08-20 日産化学株式会社 洗浄剤組成物及び洗浄方法
EP4022021A4 (de) * 2019-08-30 2023-05-31 Dow Global Technologies LLC Photoresistabstreifzusammensetzung
CN111519190B (zh) * 2020-05-27 2022-03-18 湖北兴福电子材料有限公司 一种铜制程面板中稳定蚀刻锥角的蚀刻液及稳定方法
CN118390064A (zh) * 2024-05-23 2024-07-26 苏州元本科技咨询有限公司 一种碱性铜光亮清洗剂及其制备方法和应用

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4744834A (en) * 1986-04-30 1988-05-17 Noor Haq Photoresist stripper comprising a pyrrolidinone, a diethylene glycol ether, a polyglycol and a quaternary ammonium hydroxide
JPH01502059A (ja) * 1987-02-05 1989-07-13 マクダーミツド インコーポレーテツド フォトレジストストリッパー組成物
US5091103A (en) * 1990-05-01 1992-02-25 Alicia Dean Photoresist stripper
US6110881A (en) * 1990-11-05 2000-08-29 Ekc Technology, Inc. Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials
DE69333877T2 (de) * 1992-07-09 2006-06-14 Ekc Technology Inc Reinigungsmittelzusammensetzung, das einem Redox Aminverbindung enthält
JPH0959689A (ja) * 1995-08-29 1997-03-04 Mitsubishi Chem Corp 研削剤除去用洗浄剤
JP4565741B2 (ja) * 1998-05-18 2010-10-20 マリンクロッド・ベイカー・インコーポレイテッド マイクロエレクトロニクス基板洗浄用珪酸塩含有アルカリ組成物
KR100610387B1 (ko) * 1998-05-18 2006-08-09 말린크로트 베이커, 인코포레이티드 초소형 전자 기판 세정용 실리케이트 함유 알칼리성 조성물
US6558879B1 (en) * 2000-09-25 2003-05-06 Ashland Inc. Photoresist stripper/cleaner compositions containing aromatic acid inhibitors

Also Published As

Publication number Publication date
IL159761A0 (en) 2004-06-20
BR0211054A (pt) 2004-07-20
ZA200400064B (en) 2004-10-27
JP2004536181A (ja) 2004-12-02
IN2004CH00042A (de) 2005-12-02
CN102399651A (zh) 2012-04-04
EP1404796B1 (de) 2012-02-15
TWI292437B (en) 2008-01-11
PL367838A1 (en) 2005-03-07
IL159761A (en) 2006-12-10
CN1526007A (zh) 2004-09-01
AU2002320305A1 (en) 2003-01-29
KR100944444B1 (ko) 2010-02-26
KR20040018437A (ko) 2004-03-03
JP4177758B2 (ja) 2008-11-05
CA2452884C (en) 2010-12-07
WO2003006597A1 (en) 2003-01-23
EP1404796A1 (de) 2004-04-07
MY139607A (en) 2009-10-30
KR20090076934A (ko) 2009-07-13
RS904A (sr) 2007-02-05
ATE545695T1 (de) 2012-03-15
CA2452884A1 (en) 2003-01-23
PL199501B1 (pl) 2008-09-30

Similar Documents

Publication Publication Date Title
NO20040068D0 (no) Ammoniakkfrie alkaliske mikroelektroniske rensesammensetninger med forbedret substratkompatibilitet
ATE545695T1 (de) Ammoniakfreie alkalische mikroelektronische reinigungszusammensetzung mit verbesserter substratverträglickeit
MY143399A (en) Microelectronic cleaning compositons containing ammonia-free fluoride salts for selective photoresist stripping and plasma ash residue cleaning
EP1576072A4 (de) Wässrige phosphorsäurezusammensetzung zur reinigung von halbleiter-vorrichtungen
MY139208A (en) Microelectronic cleaning compositions containing oxidizers and organic solvents
SG136954A1 (en) Composition for removing photoresist and/or etching residue from a substrate and use thereof
MY117049A (en) Composition for stripping photoresist and organic materials from substrate surfaces
TW200619872A (en) Composition and process for ashless removal of post-etch photoresist and/or bottom anti-reflective material on a substrate
EP1178359A3 (de) Entschichtungszusammensetzung
ATE344830T1 (de) Cmp-polierzusammensetzung für metall
TWI265172B (en) and method for forming the same Composition for forming insulating film, method for producing the same, silica-based insulating film
TW200600971A (en) Calixresorcinarene compounds, photoresist base materials, and compositions thereof
ATE376050T1 (de) Halbleiterreinigungslösung
ATE373071T1 (de) Zusammensetzung und verfahren zur behandlung von halbleitersubstraten
EP1148105A3 (de) Beschichtungszusammensetzung für die Filmherstellung, Verfahren zur Filmherstellung und Silica-Filme
TW200624410A (en) Triarylamine compounds, compositions and devices
TW200703459A (en) Method of forming a semiconductor device having a high-k dielectric
TW200600526A (en) Polymer for organic EL element, composition for organic EL element, and organic EL element
MY142226A (en) Removal of residual flash or resin from the exposed surface of leadframes

Legal Events

Date Code Title Description
FC2A Withdrawal, rejection or dismissal of laid open patent application