NO20054579L - Kapasitiv akselerasjonssensor - Google Patents

Kapasitiv akselerasjonssensor

Info

Publication number
NO20054579L
NO20054579L NO20054579A NO20054579A NO20054579L NO 20054579 L NO20054579 L NO 20054579L NO 20054579 A NO20054579 A NO 20054579A NO 20054579 A NO20054579 A NO 20054579A NO 20054579 L NO20054579 L NO 20054579L
Authority
NO
Norway
Prior art keywords
capacitive acceleration
acceleration sensor
pair
electrodes
capacitive
Prior art date
Application number
NO20054579A
Other languages
English (en)
Other versions
NO346493B1 (no
Inventor
Heikki Kuisma
Juha Lahdenpera
Risto Mutikainen
Original Assignee
Vti Technologies Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vti Technologies Oy filed Critical Vti Technologies Oy
Publication of NO20054579L publication Critical patent/NO20054579L/no
Publication of NO346493B1 publication Critical patent/NO346493B1/no

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
    • G01R15/12—Circuits for multi-testers, i.e. multimeters, e.g. for measuring voltage, current, or impedance at will
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0002—Arrangements for avoiding sticking of the flexible or moving parts
    • B81B3/0013—Structures dimensioned for mechanical prevention of stiction, e.g. spring with increased stiffness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00912—Treatments or methods for avoiding stiction of flexible or moving parts of MEMS
    • B81C1/0096—For avoiding stiction when the device is in use, i.e. after manufacture has been completed
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/11—Treatments for avoiding stiction of elastic or moving parts of MEMS
    • B81C2201/112—Depositing an anti-stiction or passivation coating, e.g. on the elastic or moving parts

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Pressure Sensors (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

Den foreliggende oppfinnelsen angår målingsanordninger som anvendes for måling av akselerasjon, og spesifikt til kapasitive akselerasjonssensorer. Den kapasitive akselerasjonssensoren i samsvar med oppfinnelsen omfatter et par elekttoder bestående av en bevegelig elekttode (4) og en stasjonær elekttode (5), og, relatert til paret elekttoder, et isolatorfremspring med et spesielt belegg. Oppfinnelsen tilveiebringer en forbedret, mer varig sensorkonstruksjon, som motstår slitasje forårsaket av overbelastningssituasjoner bedre enn tidligere konstruksjoner.
NO20054579A 2003-03-05 2004-02-11 Kapasitiv akselerasjonssensor NO346493B1 (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20030338A FI119527B (fi) 2003-03-05 2003-03-05 Kapasitiivinen kiihtyvyysanturi
PCT/FI2004/000062 WO2004079373A1 (en) 2003-03-05 2004-02-11 Capacitive acceleration sensor

Publications (2)

Publication Number Publication Date
NO20054579L true NO20054579L (no) 2005-10-05
NO346493B1 NO346493B1 (no) 2022-09-05

Family

ID=8565768

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20054579A NO346493B1 (no) 2003-03-05 2004-02-11 Kapasitiv akselerasjonssensor

Country Status (9)

Country Link
US (1) US6938485B2 (no)
EP (1) EP1599736B1 (no)
JP (3) JP2006519387A (no)
KR (1) KR101062631B1 (no)
CH (1) CH697268B1 (no)
DE (1) DE112004000353T5 (no)
FI (1) FI119527B (no)
NO (1) NO346493B1 (no)
WO (1) WO2004079373A1 (no)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011112389A (ja) * 2009-11-24 2011-06-09 Panasonic Electric Works Co Ltd 加速度センサ
JP5716149B2 (ja) * 2009-11-24 2015-05-13 パナソニックＩｐマネジメント株式会社 加速度センサ
JP2011112392A (ja) * 2009-11-24 2011-06-09 Panasonic Electric Works Co Ltd 加速度センサ
WO2011064642A2 (ja) 2009-11-24 2011-06-03 パナソニック電工株式会社 加速度センサ
JP5789737B2 (ja) * 2009-11-24 2015-10-07 パナソニックＩｐマネジメント株式会社 加速度センサ
JP2011112390A (ja) * 2009-11-24 2011-06-09 Panasonic Electric Works Co Ltd 加速度センサ
JP2012008022A (ja) * 2010-06-25 2012-01-12 Panasonic Electric Works Co Ltd 加速度センサ
US9065358B2 (en) 2011-07-11 2015-06-23 Taiwan Semiconductor Manufacturing Company, Ltd. MEMS structure and method of forming same
US9085456B2 (en) 2012-01-16 2015-07-21 Taiwan Semiconductor Manufacturing Company, Ltd. Support structure for TSV in MEMS structure
JP6155832B2 (ja) * 2013-05-16 2017-07-05 セイコーエプソン株式会社 センサー素子、電子機器、および移動体
JP6661941B2 (ja) * 2015-09-29 2020-03-11 セイコーエプソン株式会社 物理量センサー、物理量センサーの製造方法、センサーデバイス、電子機器および移動体
US10384929B2 (en) * 2016-03-22 2019-08-20 Murata Manufacturing Co., Ltd. Impact element for a sensor device and a manufacturing method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5367429A (en) * 1991-10-18 1994-11-22 Hitachi, Ltd Electrostatic type micro transducer and control system using the same
US5644455A (en) * 1993-12-30 1997-07-01 Seagate Technology, Inc. Amorphous diamond-like carbon gaps in magnetoresistive heads
US6404028B1 (en) * 1997-04-21 2002-06-11 Ford Global Technologies, Inc. Adhesion resistant micromachined structure and coating

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03296662A (ja) * 1990-04-16 1991-12-27 Ricoh Co Ltd 微小機械素子
JP2816235B2 (ja) * 1990-05-30 1998-10-27 株式会社日立製作所 半導体加速度センサとそれを用いたエアバックシステムおよびサスペンション制御システム
JPH05273231A (ja) * 1992-03-27 1993-10-22 Toyoda Mach Works Ltd 容量型加速度センサ
JPH06213924A (ja) 1993-01-13 1994-08-05 Hitachi Ltd トランスジューサ、これを利用したマイクロセンサ、車両制御システム
JPH0744037A (ja) * 1993-08-03 1995-02-14 Canon Inc 加熱定着装置の再生方法
US5939171A (en) * 1995-01-24 1999-08-17 Siemens Aktiengesellschaft Micromechanical component
JPH11260014A (ja) * 1998-03-10 1999-09-24 Fujitsu Ltd グライド・ハイト評価ヘッド
JP4465051B2 (ja) * 1998-05-01 2010-05-19 テルモ株式会社 生体留置用ステント
US6105428A (en) * 1998-12-10 2000-08-22 Motorola, Inc. Sensor and method of use
JP3593276B2 (ja) * 1998-12-24 2004-11-24 シャープ株式会社 情報記録装置
JP4676589B2 (ja) * 2000-03-24 2011-04-27 東ソー・クォーツ株式会社 真空ピンセット
JP3756373B2 (ja) * 2000-03-27 2006-03-15 株式会社日本自動車部品総合研究所 絶縁性基体用保護膜、薄膜積層体および薄膜センサ
JP3840058B2 (ja) * 2000-04-07 2006-11-01 キヤノン株式会社 マイクロレンズ、固体撮像装置及びそれらの製造方法
DE10051315A1 (de) * 2000-10-17 2002-04-18 Bosch Gmbh Robert Mikromechanisches Bauelement und entsprechendes Hersellungsverfahren

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5367429A (en) * 1991-10-18 1994-11-22 Hitachi, Ltd Electrostatic type micro transducer and control system using the same
US5644455A (en) * 1993-12-30 1997-07-01 Seagate Technology, Inc. Amorphous diamond-like carbon gaps in magnetoresistive heads
US6404028B1 (en) * 1997-04-21 2002-06-11 Ford Global Technologies, Inc. Adhesion resistant micromachined structure and coating

Also Published As

Publication number Publication date
US6938485B2 (en) 2005-09-06
JP2011022149A (ja) 2011-02-03
FI119527B (fi) 2008-12-15
DE112004000353T5 (de) 2006-01-26
CH697268B1 (de) 2008-07-31
KR101062631B1 (ko) 2011-09-07
JP2013152230A (ja) 2013-08-08
EP1599736A1 (en) 2005-11-30
US20040226374A1 (en) 2004-11-18
JP2006519387A (ja) 2006-08-24
WO2004079373A1 (en) 2004-09-16
EP1599736B1 (en) 2018-04-04
JP5748792B2 (ja) 2015-07-15
KR20050107478A (ko) 2005-11-11
NO346493B1 (no) 2022-09-05
FI20030338A0 (fi) 2003-03-05

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Legal Events

Date Code Title Description
CHAD Change of the owner's name or address (par. 44 patent law, par. patentforskriften)

Owner name: MURATA ELECTRONICS OY, FI

CHAD Change of the owner's name or address (par. 44 patent law, par. patentforskriften)

Owner name: MURATA MANUFACTURING CO., JP