NO862041L - Elektrolyttisk avsatt kobberfolie. - Google Patents

Elektrolyttisk avsatt kobberfolie.

Info

Publication number
NO862041L
NO862041L NO862041A NO862041A NO862041L NO 862041 L NO862041 L NO 862041L NO 862041 A NO862041 A NO 862041A NO 862041 A NO862041 A NO 862041A NO 862041 L NO862041 L NO 862041L
Authority
NO
Norway
Prior art keywords
electrolytic
copper film
proposed copper
electrolysis
proposed
Prior art date
Application number
NO862041A
Other languages
English (en)
Inventor
Kuniki Ueno
Kazuyoshi Nabekura
Yutaka Hirasawa
Makoto Fujiki
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=15411921&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=NO862041(L) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from JP60146623A external-priority patent/JPS6210291A/ja
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of NO862041L publication Critical patent/NO862041L/no

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Physical Vapour Deposition (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Fats And Perfumes (AREA)
  • Cosmetics (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

Elektrolytisk avsatt kobberfolie med forbedrede egenskaper slik som høy strekkfasthet og forlengelse ved romtemperatur og ved forhøyet temperatur, oppnådd ved elektrolyse av en kobberion-holdig elektrolytt, hvorav minst 60 volum-% er behandlet med aktivert karbon innen 20 min. før elektrolysen.
NO862041A 1985-07-05 1986-05-22 Elektrolyttisk avsatt kobberfolie. NO862041L (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60146623A JPS6210291A (ja) 1985-07-05 1985-07-05 電解銅箔

Publications (1)

Publication Number Publication Date
NO862041L true NO862041L (no) 1987-01-06

Family

ID=15411921

Family Applications (1)

Application Number Title Priority Date Filing Date
NO862041A NO862041L (no) 1985-07-05 1986-05-22 Elektrolyttisk avsatt kobberfolie.

Country Status (7)

Country Link
EP (1) EP0207244B2 (no)
JP (1) JPH0610181A (no)
AT (1) ATE82333T1 (no)
DE (1) DE3687089T3 (no)
ES (1) ES8708151A1 (no)
FI (1) FI862842L (no)
NO (1) NO862041L (no)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4837764A (en) * 1987-03-26 1989-06-06 Bunker Ramo Corporation Programmable apparatus and method for testing computer peripherals
US4956053A (en) * 1988-05-26 1990-09-11 Olin Corporation Apparatus and process for the production of micro-pore free high ductility metal foil
US5431803A (en) * 1990-05-30 1995-07-11 Gould Electronics Inc. Electrodeposited copper foil and process for making same
US6123788A (en) * 1993-04-19 2000-09-26 Electrocopper Products Limited Copper wire and process for making copper wire
TW432124B (en) * 1996-05-13 2001-05-01 Mitsui Mining & Amp Smelting C Electrolytic copper foil with high post heat tensile strength and its manufacturing method
TW336325B (en) * 1996-05-24 1998-07-11 Electrocopper Products Ltd Copper wire and process for making copper wire
JP3670179B2 (ja) * 1999-11-11 2005-07-13 三井金属鉱業株式会社 キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔を用いた銅張積層板
JP3521074B2 (ja) * 2000-01-06 2004-04-19 三井金属鉱業株式会社 電解銅箔の物性検査方法
JP2004269950A (ja) * 2003-03-07 2004-09-30 Mitsui Mining & Smelting Co Ltd 電解銅箔の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH494824A (de) * 1969-07-10 1970-08-15 Fluehmann Werner Verfahren zur elektrolytischen Abscheidung von Kupfer hoher Duktilität
GB8333752D0 (en) * 1983-12-19 1984-01-25 Thorpe J E Matte surface on metal layer
JPS6152387A (ja) * 1984-08-17 1986-03-15 Fukuda Kinzoku Hakufun Kogyo Kk 高温加熱時の伸び率が優れた電解銅箔の製造方法

Also Published As

Publication number Publication date
FI862842A7 (fi) 1987-01-06
DE3687089D1 (de) 1992-12-17
EP0207244B2 (en) 1999-03-31
DE3687089T2 (de) 1993-03-18
DE3687089T3 (de) 1999-10-07
JPH0610181A (ja) 1994-01-18
ES8708151A1 (es) 1987-07-01
ES556394A0 (es) 1987-07-01
EP0207244A2 (en) 1987-01-07
FI862842L (fi) 1987-01-06
FI862842A0 (fi) 1986-07-04
EP0207244A3 (en) 1988-05-25
EP0207244B1 (en) 1992-11-11
ATE82333T1 (de) 1992-11-15

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