PL3705601T3 - Kąpiel do złocenia bezprądowego - Google Patents
Kąpiel do złocenia bezprądowegoInfo
- Publication number
- PL3705601T3 PL3705601T3 PL20160648T PL20160648T PL3705601T3 PL 3705601 T3 PL3705601 T3 PL 3705601T3 PL 20160648 T PL20160648 T PL 20160648T PL 20160648 T PL20160648 T PL 20160648T PL 3705601 T3 PL3705601 T3 PL 3705601T3
- Authority
- PL
- Poland
- Prior art keywords
- plating bath
- gold plating
- electroless gold
- electroless
- bath
- Prior art date
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title 1
- 239000010931 gold Substances 0.000 title 1
- 229910052737 gold Inorganic materials 0.000 title 1
- 238000007747 plating Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019040385A JP7228411B2 (ja) | 2019-03-06 | 2019-03-06 | 無電解金めっき浴 |
| EP20160648.0A EP3705601B1 (en) | 2019-03-06 | 2020-03-03 | Electroless gold plating bath |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL3705601T3 true PL3705601T3 (pl) | 2022-02-21 |
Family
ID=69770462
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL20160648T PL3705601T3 (pl) | 2019-03-06 | 2020-03-03 | Kąpiel do złocenia bezprądowego |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10975475B2 (pl) |
| EP (1) | EP3705601B1 (pl) |
| JP (1) | JP7228411B2 (pl) |
| KR (1) | KR102779919B1 (pl) |
| CN (1) | CN111663123A (pl) |
| PL (1) | PL3705601T3 (pl) |
| TW (1) | TWI848066B (pl) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20210371998A1 (en) * | 2020-05-27 | 2021-12-02 | Macdermid Enthone Inc. | Gold Plating Bath and Gold Plated Final Finish |
Family Cites Families (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3635761A (en) * | 1970-05-05 | 1972-01-18 | Mobil Oil Corp | Electroless deposition of metals |
| US4009297A (en) * | 1974-02-25 | 1977-02-22 | Amp Incorporated | Gold deposition procedures and substrates upon which gold has been deposited |
| US4714627A (en) * | 1984-11-29 | 1987-12-22 | Ontario Development Corp. | Method of gold deposition using volatile organogold complexes |
| US5202151A (en) * | 1985-10-14 | 1993-04-13 | Hitachi, Ltd. | Electroless gold plating solution, method of plating with gold by using the same, and electronic device plated with gold by using the same |
| US5803957A (en) * | 1993-03-26 | 1998-09-08 | C. Uyemura & Co.,Ltd. | Electroless gold plating bath |
| FR2727637B1 (fr) * | 1994-12-06 | 1997-01-03 | Rhone Poulenc Chimie | Procede de preparation electrochimique de catalyseurs a base de metal de transition et de phosphine |
| JP3816241B2 (ja) | 1998-07-14 | 2006-08-30 | 株式会社大和化成研究所 | 金属を還元析出させるための水溶液 |
| US6506314B1 (en) * | 2000-07-27 | 2003-01-14 | Atotech Deutschland Gmbh | Adhesion of polymeric materials to metal surfaces |
| JP4171604B2 (ja) | 2002-03-18 | 2008-10-22 | 株式会社大和化成研究所 | 無電解めっき浴及び該めっき浴を用いて得られた金属被覆物 |
| JP4521228B2 (ja) * | 2003-07-28 | 2010-08-11 | 正也 市村 | 光析出による金メッキ法及び金メッキ膜形成装置 |
| US7396949B2 (en) | 2003-08-19 | 2008-07-08 | Denk Michael K | Class of volatile compounds for the deposition of thin films of metals and metal compounds |
| JP2005290415A (ja) | 2004-03-31 | 2005-10-20 | Okuno Chem Ind Co Ltd | 無電解銅めっき液 |
| JP2005290414A (ja) * | 2004-03-31 | 2005-10-20 | Okuno Chem Ind Co Ltd | 無電解ニッケルめっき液 |
| JP2007246955A (ja) * | 2006-03-14 | 2007-09-27 | Okuno Chem Ind Co Ltd | 無電解金めっき浴 |
| JP5526459B2 (ja) | 2006-12-06 | 2014-06-18 | 上村工業株式会社 | 無電解金めっき浴及び無電解金めっき方法 |
| JP5013077B2 (ja) | 2007-04-16 | 2012-08-29 | 上村工業株式会社 | 無電解金めっき方法及び電子部品 |
| JP5247142B2 (ja) | 2007-12-19 | 2013-07-24 | 株式会社大和化成研究所 | 銀めっき方法 |
| JP5525762B2 (ja) * | 2008-07-01 | 2014-06-18 | 上村工業株式会社 | 無電解めっき液及びそれを用いた無電解めっき方法、並びに配線基板の製造方法 |
| CN101348927B (zh) * | 2008-09-05 | 2010-10-06 | 江南机器（集团）有限公司 | 无氰预镀铜溶液 |
| JP5942297B2 (ja) * | 2011-03-08 | 2016-06-29 | 国立研究開発法人科学技術振興機構 | ナノギャップ長を有する電極構造の作製方法、メッキ液及びナノデバイス |
| WO2012141215A1 (ja) * | 2011-04-12 | 2012-10-18 | 日産化学工業株式会社 | ハイパーブランチポリマー及び金属微粒子を含む無電解めっき下地剤 |
| EP2628824B1 (en) | 2012-02-16 | 2014-09-17 | Atotech Deutschland GmbH | Method for electroless nickel-phosphorous alloy deposition onto flexible substrates |
| CN103682427B (zh) * | 2012-09-13 | 2016-01-20 | 微宏动力系统（湖州）有限公司 | 有机硅聚合物及其固体电解质和固态锂离子电池 |
| US10479894B2 (en) * | 2014-12-03 | 2019-11-19 | Sk Innovation Co., Ltd. | Solution for fabricating nano particles |
| JP6619563B2 (ja) | 2015-04-30 | 2019-12-11 | 日本高純度化学株式会社 | 無電解金めっき液、アルデヒド−アミン付加体補給液及びそれらを用いて形成した金皮膜 |
| JP6340378B2 (ja) * | 2015-05-11 | 2018-06-06 | 富士フイルム株式会社 | 導電性積層体の製造方法、導電性積層体、タッチセンサー |
| JP6594077B2 (ja) | 2015-07-28 | 2019-10-23 | 上村工業株式会社 | ノンシアン無電解金めっき浴および無電解金めっき方法 |
| EP3144413B1 (en) * | 2015-09-21 | 2018-04-25 | ATOTECH Deutschland GmbH | Plating bath composition for electroless plating of gold |
| ES2712858T3 (es) * | 2015-10-13 | 2019-05-16 | Macdermid Enthone Inc | Uso de fosfa-adamantanos solubles en agua y estables en aire como estabilizadores en electrolitos para deposición no electrolítica de metal |
| WO2017154913A1 (ja) * | 2016-03-09 | 2017-09-14 | 日産化学工業株式会社 | 感光性無電解めっき下地剤 |
| JP6775240B2 (ja) * | 2016-06-10 | 2020-10-28 | 株式会社Ｃ−Ｉｎｋ | めっき下地用の組成物、それによるめっき下地及び金属被膜を形成する方法 |
| JP6466521B2 (ja) * | 2017-06-28 | 2019-02-06 | 小島化学薬品株式会社 | 無電解めっきプロセス |
-
2019
- 2019-03-06 JP JP2019040385A patent/JP7228411B2/ja active Active
-
2020
- 2020-03-02 US US16/806,328 patent/US10975475B2/en active Active
- 2020-03-03 CN CN202010140063.2A patent/CN111663123A/zh active Pending
- 2020-03-03 KR KR1020200026338A patent/KR102779919B1/ko active Active
- 2020-03-03 EP EP20160648.0A patent/EP3705601B1/en active Active
- 2020-03-03 PL PL20160648T patent/PL3705601T3/pl unknown
- 2020-03-04 TW TW109107011A patent/TWI848066B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| US10975475B2 (en) | 2021-04-13 |
| CN111663123A (zh) | 2020-09-15 |
| KR102779919B1 (ko) | 2025-03-10 |
| KR20200107820A (ko) | 2020-09-16 |
| JP2020143332A (ja) | 2020-09-10 |
| TWI848066B (zh) | 2024-07-11 |
| US20200283906A1 (en) | 2020-09-10 |
| EP3705601B1 (en) | 2021-11-03 |
| JP7228411B2 (ja) | 2023-02-24 |
| EP3705601A1 (en) | 2020-09-09 |
| TW202043546A (zh) | 2020-12-01 |
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