PL441867A1 - Elektrolityczna folia miedziana - Google Patents
Elektrolityczna folia miedzianaInfo
- Publication number
- PL441867A1 PL441867A1 PL441867A PL44186721A PL441867A1 PL 441867 A1 PL441867 A1 PL 441867A1 PL 441867 A PL441867 A PL 441867A PL 44186721 A PL44186721 A PL 44186721A PL 441867 A1 PL441867 A1 PL 441867A1
- Authority
- PL
- Poland
- Prior art keywords
- copper foil
- copper
- electrodeposited
- roughness
- flexible substrate
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 7
- 239000011889 copper foil Substances 0.000 title abstract 4
- 239000013078 crystal Substances 0.000 abstract 4
- 229910052802 copper Inorganic materials 0.000 abstract 3
- 239000010949 copper Substances 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 2
- 238000004458 analytical method Methods 0.000 abstract 1
- 238000000137 annealing Methods 0.000 abstract 1
- 238000001887 electron backscatter diffraction Methods 0.000 abstract 1
- 238000002003 electron diffraction Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C25D5/611—Smooth layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/615—Microstructure of the layers, e.g. mixed structure
- C25D5/617—Crystalline layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
Zgłoszenie przedstawia osadzana elektrolitycznie folie miedzianą o wysokiej gładkości i jednocześnie wykazującą wysoką elastyczność (w szczególności wysoką elastyczność po wyżarzaniu w 180°C przez 1 godzinę) odpowiednia na elastyczne podłoże. Ta osadzana elektrolitycznie folia miedziana ma chropowatość z dziesięciopunktową średnią chropowatością RZ od 0,1 do 02 µm na co najmniej jednej powierzchni i jest tak skonfigurowana, że gdy jest poddana analizie przekroju metodą dyfrakcji wstecznie rozproszonych elektronów (EBSD) obszaru pola obserwacji zajmowanego przez ziarna kryształów miedzi proporcja obszaru zajmowanego przez ziarna krystaliczne miedzi spełniające poniższe warunki wynosi 63% lub więcej. Warunki te są następujące: i) orientacja (101); ii) współczynnik kształtu 0,500 lub mniejszy; iii) ǀsin θǀ, 0,001 do 0,707, gdzie θ (°) jest kątem pomiędzy linią normalną powierzchni elektrody osadzanej elektrolitycznie folii miedzianej a główną osią ziarna kryształu miedzi; i iv) wówczas, gdy kryształ jest aproksymowany eliptycznie, długość osi małej 0,38 µm lub mniejsza. Przedmiotem zgłoszenia jest także elastyczne podłoże, zawierające wyżej wspomnianą osadzaną elektrolitycznie folię.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-013719 | 2020-01-30 | ||
| JP2020013719 | 2020-01-30 | ||
| PCT/JP2021/001102 WO2021153256A1 (ja) | 2020-01-30 | 2021-01-14 | 電解銅箔 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| PL441867A1 true PL441867A1 (pl) | 2023-03-27 |
| PL244196B1 PL244196B1 (pl) | 2023-12-11 |
Family
ID=77078850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL441867A PL244196B1 (pl) | 2020-01-30 | 2021-01-14 | Elektrolityczna folia miedziana |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US12168838B2 (pl) |
| JP (1) | JP7656554B2 (pl) |
| KR (1) | KR102758514B1 (pl) |
| CN (1) | CN114901873B (pl) |
| HU (1) | HU231472B1 (pl) |
| PL (1) | PL244196B1 (pl) |
| TW (1) | TWI869533B (pl) |
| WO (1) | WO2021153256A1 (pl) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115728194A (zh) * | 2022-11-21 | 2023-03-03 | 山东大学 | 一种铜箔截面晶粒形貌的检测方法 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2754157B2 (ja) | 1994-03-31 | 1998-05-20 | 三井金属鉱業株式会社 | プリント配線板用電解銅箔の製造方法 |
| JPH10330983A (ja) * | 1997-05-30 | 1998-12-15 | Fukuda Metal Foil & Powder Co Ltd | 電解銅箔及びその製造方法 |
| JP3850155B2 (ja) * | 1998-12-11 | 2006-11-29 | 日本電解株式会社 | 電解銅箔、二次電池の集電体用銅箔及び二次電池 |
| JP4120806B2 (ja) * | 2002-10-25 | 2008-07-16 | 福田金属箔粉工業株式会社 | 低粗面電解銅箔及びその製造方法 |
| JP4273309B2 (ja) * | 2003-05-14 | 2009-06-03 | 福田金属箔粉工業株式会社 | 低粗面電解銅箔及びその製造方法 |
| JP4549774B2 (ja) | 2004-08-11 | 2010-09-22 | 三井金属鉱業株式会社 | 電解銅箔の製造方法 |
| TWI414638B (zh) * | 2006-06-07 | 2013-11-11 | Furukawa Electric Co Ltd | A method for manufacturing a surface-treated electrolytic copper foil, and a circuit board |
| JP5752301B2 (ja) | 2007-10-31 | 2015-07-22 | 三井金属鉱業株式会社 | 電解銅箔及びその電解銅箔の製造方法 |
| CN103460462A (zh) * | 2011-06-28 | 2013-12-18 | 古河电气工业株式会社 | 锂离子二次电池、构成该二次电池的负极电极的集电体、以及构成该负极电极集电体的电解铜箔 |
| JP5391366B2 (ja) * | 2011-06-28 | 2014-01-15 | 古河電気工業株式会社 | 電解銅箔、該電解銅箔を使用した配線板及びフレキシブル配線板 |
| JP2014037582A (ja) * | 2012-08-17 | 2014-02-27 | Jx Nippon Mining & Metals Corp | 電解銅箔 |
| JP5607862B1 (ja) * | 2012-12-27 | 2014-10-15 | 古河電気工業株式会社 | 低反発性電解銅箔、該電解銅箔を使用した配線板及びフレキシブル配線板 |
| JP5740052B2 (ja) * | 2013-01-29 | 2015-06-24 | 古河電気工業株式会社 | 電解銅箔及びその製造方法 |
| JP2015028197A (ja) * | 2013-07-30 | 2015-02-12 | 株式会社Ｓｈカッパープロダクツ | 粗化銅箔、銅張積層板及びプリント配線板 |
| KR101449342B1 (ko) | 2013-11-08 | 2014-10-13 | 일진머티리얼즈 주식회사 | 전해동박, 이를 포함하는 전기부품 및 전지 |
| KR101737028B1 (ko) * | 2014-07-10 | 2017-05-17 | 엘에스엠트론 주식회사 | 전해 동박의 제조 방법 |
| JP6014186B2 (ja) * | 2015-03-03 | 2016-10-25 | イルジン マテリアルズ カンパニー リミテッドＩｌｊｉｎ Ｍａｔｅｒｉａｌｓ Ｃｏ．， Ｌｔｄ． | 電解銅箔、これを含む電気部品および電池 |
| US10190225B2 (en) | 2017-04-18 | 2019-01-29 | Chang Chun Petrochemical Co., Ltd. | Electrodeposited copper foil with low repulsive force |
-
2021
- 2021-01-14 JP JP2021574617A patent/JP7656554B2/ja active Active
- 2021-01-14 PL PL441867A patent/PL244196B1/pl unknown
- 2021-01-14 KR KR1020227020302A patent/KR102758514B1/ko active Active
- 2021-01-14 WO PCT/JP2021/001102 patent/WO2021153256A1/ja not_active Ceased
- 2021-01-14 CN CN202180007696.9A patent/CN114901873B/zh active Active
- 2021-01-14 HU HUP2200352A patent/HU231472B1/hu unknown
- 2021-01-14 US US17/792,842 patent/US12168838B2/en active Active
- 2021-01-25 TW TW110102639A patent/TWI869533B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| HU231472B1 (hu) | 2024-02-28 |
| US20230044366A1 (en) | 2023-02-09 |
| CN114901873B (zh) | 2024-10-15 |
| JP7656554B2 (ja) | 2025-04-03 |
| JPWO2021153256A1 (pl) | 2021-08-05 |
| KR102758514B1 (ko) | 2025-01-23 |
| HUP2200352A1 (hu) | 2022-11-28 |
| TW202138627A (zh) | 2021-10-16 |
| WO2021153256A1 (ja) | 2021-08-05 |
| US12168838B2 (en) | 2024-12-17 |
| KR20220101685A (ko) | 2022-07-19 |
| CN114901873A (zh) | 2022-08-12 |
| TWI869533B (zh) | 2025-01-11 |
| PL244196B1 (pl) | 2023-12-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20210317590A1 (en) | Method for producing electrolytic copper foil | |
| KR101154203B1 (ko) | 전해 동박, 그 전해 동박을 이용한 표면 처리 동박 및 그 표면 처리 동박을 이용한 동박 적층판 및 그 전해 동박의 제조 방법 | |
| TW583346B (en) | Manufacturing method of electrodeposited copper foil and electrodeposited copper foil | |
| CN109642338B (zh) | 铜箔以及具有该铜箔的覆铜板 | |
| US6346181B1 (en) | Electroplating process for preparing a Ni layer of biaxial texture | |
| KR20150080024A (ko) | 전해 동박 및 전해 동박의 제조 방법 | |
| TW200407465A (en) | Electrolyte solution for manufacturing electrolytic copper foil and electrolytic copper foil manufacturing method using the same | |
| CN102168289A (zh) | 电解铜箔及其制造方法 | |
| PL441867A1 (pl) | Elektrolityczna folia miedziana | |
| KR20170001748A (ko) | 비시안계 전해 금도금액 | |
| CN102413632A (zh) | 布线电路基板 | |
| Chen et al. | Corrosion behavior of aluminum bronze under thin electrolyte layers containing artificial seawater | |
| JP5059292B2 (ja) | ウイスカー発生抑制に優れたＳｎ合金めっき | |
| KR20170023930A (ko) | Sn 도금 스테인리스 강판 | |
| KR101787513B1 (ko) | 전해 동박, 상기 전해 동박을 이용한 전지용 집전체, 상기 집전체를 이용한 이차전지용 전극, 상기 전극을 이용한 이차전지 | |
| WO2019124696A1 (ko) | 내굴곡성이 우수한 철-니켈 합금박 | |
| JPS63310989A (ja) | 電解銅箔の製造方法 | |
| Qian et al. | Preparation, microstructure and sliding-wear characteristics of brush plated copper–nickel multilayer films | |
| KR20180055927A (ko) | 전기 아연 도금 피막을 가지는 아연 도금 강판 | |
| US20230203691A1 (en) | Double layered electrolytic copper foil and manufacturing method thereof | |
| JP2011091114A (ja) | 配線回路基板およびその製法 | |
| See-Leng et al. | Microstructures and mechanical properties of electroplated Cu–Bi coatings | |
| PL441866A1 (pl) | Elektrolityczna folia miedziana | |
| JPH02104688A (ja) | Ｆｅ−Ｎｉ合金箔を製造するためのＦｅ−Ｎｉ合金電解析出方法 | |
| JP2006307328A (ja) | 無鉛Ｓｎベースめっき膜及びその製造方法、並びに接続部品の接点構造 |